JPS5771155A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5771155A
JPS5771155A JP14789380A JP14789380A JPS5771155A JP S5771155 A JPS5771155 A JP S5771155A JP 14789380 A JP14789380 A JP 14789380A JP 14789380 A JP14789380 A JP 14789380A JP S5771155 A JPS5771155 A JP S5771155A
Authority
JP
Japan
Prior art keywords
resin
anhydrous acid
led
added
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14789380A
Other languages
Japanese (ja)
Inventor
Shinichi Kudo
Yukio Maeda
Tamotsu Wakahata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP14789380A priority Critical patent/JPS5771155A/en
Publication of JPS5771155A publication Critical patent/JPS5771155A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve wet-proofness and heat shock resistivity and to promote fitness for sealing material of an LED or the like by a method wherein an element is sealed by mixed resin compound which has an amount of anhydrous acid refering to epoxy resin to be 80-100% f a theoretical volume to be added. CONSTITUTION:For example a light emitting element such as GaP or the like is connected to an external lead wire, and for example by application of resin for sealing an LED is fabricated. A compound prepared in such a way that for example bisphenol A family epoxy resin and anhydrous acid such as phthalic anhydride or the like are mixed to have a specific rate and a hardening accelerator consisting of a basic catalyst is added to them, is used as sealing resin. A mixing rate of anhydrous acid in the case of such resin compound is so decided and materialized as to be in a range between 80-100% of theoretical volume to be added =(equivalent of anhydrous acid)X100/(equivalent of epoxy resin). By this method fault occurrence and degradation of light permiability due to soldering and a high temperature and high humidity test of an LED are prevented, and high reliability can be attained.
JP14789380A 1980-10-21 1980-10-21 Semiconductor device Pending JPS5771155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14789380A JPS5771155A (en) 1980-10-21 1980-10-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14789380A JPS5771155A (en) 1980-10-21 1980-10-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5771155A true JPS5771155A (en) 1982-05-01

Family

ID=15440547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14789380A Pending JPS5771155A (en) 1980-10-21 1980-10-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5771155A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035018A (en) * 1983-08-05 1985-02-22 Sumitomo Bakelite Co Ltd Epoxy resin composition suitable for device encapsulation
JPS61162515A (en) * 1985-01-11 1986-07-23 Nec Corp Resin composition, and resin-encapsulated semiconductor device using thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6035018A (en) * 1983-08-05 1985-02-22 Sumitomo Bakelite Co Ltd Epoxy resin composition suitable for device encapsulation
JPS61162515A (en) * 1985-01-11 1986-07-23 Nec Corp Resin composition, and resin-encapsulated semiconductor device using thereof

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