JPS6460679A - Adhesive composition for bonding electronic component - Google Patents

Adhesive composition for bonding electronic component

Info

Publication number
JPS6460679A
JPS6460679A JP62216116A JP21611687A JPS6460679A JP S6460679 A JPS6460679 A JP S6460679A JP 62216116 A JP62216116 A JP 62216116A JP 21611687 A JP21611687 A JP 21611687A JP S6460679 A JPS6460679 A JP S6460679A
Authority
JP
Japan
Prior art keywords
epoxy resin
acrylonitrile copolymer
epoxy
carboxyl
epoxy resins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62216116A
Other languages
Japanese (ja)
Other versions
JPH0721134B2 (en
Inventor
Yoshiaki Murakami
Katsutoshi Toyoda
Kiyonori Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Shinko Corp
Shinko Chemical Co Ltd
Original Assignee
Shinko Chemical Co Ltd
Shinko Chemical Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Chemical Co Ltd, Shinko Chemical Industries Co Ltd filed Critical Shinko Chemical Co Ltd
Priority to JP62216116A priority Critical patent/JPH0721134B2/en
Publication of JPS6460679A publication Critical patent/JPS6460679A/en
Publication of JPH0721134B2 publication Critical patent/JPH0721134B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide the titled compsn. having excellent adhesion, heat resistance during soldering, electrical characteristics, etc., by blending a specific epoxy resin with a carboxyl-contg. acrylonitrile copolymer, a curing promotor and a curing agent at specified wt. ratio. CONSTITUTION:100pts.wt. at least one epoxy resin (A) having an epoxy equivalent of 250-1,200g/eq and selected from bisphenol A epoxy resins, o-cresolic novolak epoxy resins, polyphenolic epoxy resins and products of a reaction of an epoxy resin with a butadiene-acrylonitrile copolymer having carboxyl groups at both terminals is mixed with 50-300pts.wt. carboxyl-contg. acrylonitrile copolymer (B) (e.g., Nipol which is a trade name of a product of Nippon Zeon Co., Ltd.), 0.5-5pts.wt. tertiary amine or imidazole compd. (C) (e.g., 2- ethyl-4-methylimidazole), and a curing agent for the epoxy resin.
JP62216116A 1987-08-28 1987-08-28 Adhesive composition for bonding electronic components Expired - Lifetime JPH0721134B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62216116A JPH0721134B2 (en) 1987-08-28 1987-08-28 Adhesive composition for bonding electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62216116A JPH0721134B2 (en) 1987-08-28 1987-08-28 Adhesive composition for bonding electronic components

Publications (2)

Publication Number Publication Date
JPS6460679A true JPS6460679A (en) 1989-03-07
JPH0721134B2 JPH0721134B2 (en) 1995-03-08

Family

ID=16683495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62216116A Expired - Lifetime JPH0721134B2 (en) 1987-08-28 1987-08-28 Adhesive composition for bonding electronic components

Country Status (1)

Country Link
JP (1) JPH0721134B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346957A (en) * 1991-05-27 1994-09-13 Nippon Zeon Co., Ltd. Adhesive composition
JP2010006921A (en) * 2008-06-26 2010-01-14 Shin-Etsu Chemical Co Ltd Adhesive composition as well as adhesive sheet and coverlay film using it
JP2015059198A (en) * 2013-09-20 2015-03-30 Dic株式会社 Adhesive composition for laminate laminate, laminate using the same, and secondary battery

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187376A (en) * 1981-05-15 1982-11-18 Toshiba Chem Corp Adhesive composition
JPS58202583A (en) * 1982-05-21 1983-11-25 宇部興産株式会社 Substrate for flexible printed circuit board
JPS5991171A (en) * 1982-11-15 1984-05-25 Mitsui Petrochem Ind Ltd Adhesive composition
JPS61108679A (en) * 1984-11-02 1986-05-27 Fujikura Ltd Adhesive composition
JPS61183374A (en) * 1985-02-09 1986-08-16 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPS61183373A (en) * 1985-02-09 1986-08-16 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPS62146974A (en) * 1985-12-20 1987-06-30 Sumitomo Chem Co Ltd adhesive sheet
JPS62236878A (en) * 1986-04-08 1987-10-16 Sumitomo Electric Ind Ltd thermosetting adhesive

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57187376A (en) * 1981-05-15 1982-11-18 Toshiba Chem Corp Adhesive composition
JPS58202583A (en) * 1982-05-21 1983-11-25 宇部興産株式会社 Substrate for flexible printed circuit board
JPS5991171A (en) * 1982-11-15 1984-05-25 Mitsui Petrochem Ind Ltd Adhesive composition
JPS61108679A (en) * 1984-11-02 1986-05-27 Fujikura Ltd Adhesive composition
JPS61183374A (en) * 1985-02-09 1986-08-16 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPS61183373A (en) * 1985-02-09 1986-08-16 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPS62146974A (en) * 1985-12-20 1987-06-30 Sumitomo Chem Co Ltd adhesive sheet
JPS62236878A (en) * 1986-04-08 1987-10-16 Sumitomo Electric Ind Ltd thermosetting adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5346957A (en) * 1991-05-27 1994-09-13 Nippon Zeon Co., Ltd. Adhesive composition
JP2010006921A (en) * 2008-06-26 2010-01-14 Shin-Etsu Chemical Co Ltd Adhesive composition as well as adhesive sheet and coverlay film using it
JP2015059198A (en) * 2013-09-20 2015-03-30 Dic株式会社 Adhesive composition for laminate laminate, laminate using the same, and secondary battery

Also Published As

Publication number Publication date
JPH0721134B2 (en) 1995-03-08

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