JPS577129A - Treating method and device for sputtering - Google Patents

Treating method and device for sputtering

Info

Publication number
JPS577129A
JPS577129A JP8202880A JP8202880A JPS577129A JP S577129 A JPS577129 A JP S577129A JP 8202880 A JP8202880 A JP 8202880A JP 8202880 A JP8202880 A JP 8202880A JP S577129 A JPS577129 A JP S577129A
Authority
JP
Japan
Prior art keywords
substrate
electrode
plasma
sio2
jar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8202880A
Other languages
English (en)
Inventor
Kanetake Takasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP8202880A priority Critical patent/JPS577129A/ja
Publication of JPS577129A publication Critical patent/JPS577129A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
JP8202880A 1980-06-17 1980-06-17 Treating method and device for sputtering Pending JPS577129A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8202880A JPS577129A (en) 1980-06-17 1980-06-17 Treating method and device for sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8202880A JPS577129A (en) 1980-06-17 1980-06-17 Treating method and device for sputtering

Publications (1)

Publication Number Publication Date
JPS577129A true JPS577129A (en) 1982-01-14

Family

ID=13763065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8202880A Pending JPS577129A (en) 1980-06-17 1980-06-17 Treating method and device for sputtering

Country Status (1)

Country Link
JP (1) JPS577129A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988820A (ja) * 1982-11-15 1984-05-22 Ulvac Corp シ−トプラズマを利用した化合物半導体薄膜製造装置
JPH0290568A (ja) * 1988-09-28 1990-03-30 Nippon Telegr & Teleph Corp <Ntt> 薄膜トランジスタの製造方法
JPH07270827A (ja) * 1994-12-21 1995-10-20 Seiko Epson Corp 液晶表示装置の製造方法
EP0838535A1 (de) * 1996-10-28 1998-04-29 Leybold Systems GmbH Interferenzschichtensystem
JP2008001989A (ja) * 2006-06-23 2008-01-10 Qimonda Ag スパッタ堆積装置およびスパッタ堆積方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988820A (ja) * 1982-11-15 1984-05-22 Ulvac Corp シ−トプラズマを利用した化合物半導体薄膜製造装置
JPH0290568A (ja) * 1988-09-28 1990-03-30 Nippon Telegr & Teleph Corp <Ntt> 薄膜トランジスタの製造方法
JPH07270827A (ja) * 1994-12-21 1995-10-20 Seiko Epson Corp 液晶表示装置の製造方法
EP0838535A1 (de) * 1996-10-28 1998-04-29 Leybold Systems GmbH Interferenzschichtensystem
JP2008001989A (ja) * 2006-06-23 2008-01-10 Qimonda Ag スパッタ堆積装置およびスパッタ堆積方法

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