JPS5772332A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5772332A JPS5772332A JP55148598A JP14859880A JPS5772332A JP S5772332 A JPS5772332 A JP S5772332A JP 55148598 A JP55148598 A JP 55148598A JP 14859880 A JP14859880 A JP 14859880A JP S5772332 A JPS5772332 A JP S5772332A
- Authority
- JP
- Japan
- Prior art keywords
- silicon dioxide
- layer
- etching
- silicon
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
Landscapes
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To prevent an overhang from being produced at an end part of polycrystalline silicon by a method wherein a silicon dioxide layer deposited on a silicon dioxide layer is removed, only the upper face of silicon dioxide is removed by means of active ion etching while allowing the side surface thereof to be left, and after that, silicon dioxide etching that is a pretreatment is performed. CONSTITUTION:Silicon dioxide 1,3 and polycrystalline silicon 2 are oxidized once, and polycrystalline silicon layer 6,6' are formed, and with the application of reactive ion etching, the layer 6' is removed, and the layer 6 remains. After that, etching for silicon dioxide as the next process is performed. Thereby, overhang of the silicon dioxide layer is prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55148598A JPS5772332A (en) | 1980-10-23 | 1980-10-23 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55148598A JPS5772332A (en) | 1980-10-23 | 1980-10-23 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5772332A true JPS5772332A (en) | 1982-05-06 |
Family
ID=15456334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55148598A Pending JPS5772332A (en) | 1980-10-23 | 1980-10-23 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5772332A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444478A (en) * | 1977-09-14 | 1979-04-07 | Matsushita Electric Ind Co Ltd | Manufacture for semiconductor device |
| JPS54151374A (en) * | 1978-04-14 | 1979-11-28 | Toshiba Corp | Manufacture for semiconductor device |
-
1980
- 1980-10-23 JP JP55148598A patent/JPS5772332A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5444478A (en) * | 1977-09-14 | 1979-04-07 | Matsushita Electric Ind Co Ltd | Manufacture for semiconductor device |
| JPS54151374A (en) * | 1978-04-14 | 1979-11-28 | Toshiba Corp | Manufacture for semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5249772A (en) | Process for production of semiconductor device | |
| JPS54154272A (en) | Contact forming method for semiconductor device | |
| JPS5772333A (en) | Manufacture of semiconductor device | |
| JPS5772331A (en) | Manufacture of semiconductor device | |
| JPS5783034A (en) | Method for taper etching | |
| JPS56131948A (en) | Manufacture of semiconductor element | |
| JPS52124860A (en) | Electrode formation method for semiconductor devices | |
| JPS53142877A (en) | Manufacture for compound semiconductor device | |
| JPS5244169A (en) | Process for production of semiconductor device | |
| JPS52117550A (en) | Electrode formation method | |
| JPS57196585A (en) | Manufacture of high-speed mesa type semiconductor device | |
| JPS5750478A (en) | Manufacture of semiconductor device | |
| JPS5314555A (en) | Depositing method of impurity to silicon wafersa | |
| JPS57148371A (en) | Manufacture of mesa type semiconductor device | |
| JPS57173956A (en) | Manufacture of semiconductor device | |
| JPS5269266A (en) | Production of semiconductor device | |
| JPS55132042A (en) | Manufacture of bevel semiconductor device | |
| JPS57100734A (en) | Etching method for semiconductor substrate | |
| JPS5710949A (en) | Manufacture of semiconductor device | |
| JPS57124443A (en) | Forming method for electrode layer | |
| JPS5244165A (en) | Process for production of semiconductor device | |
| JPS53143163A (en) | Epitaxial growth method | |
| JPS5539634A (en) | Manufacture of semiconductor | |
| JPS57184231A (en) | Manufacture of semiconductor device | |
| JPS54162968A (en) | Manufacture of semiconductor device |