JPS5772371A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5772371A
JPS5772371A JP55148128A JP14812880A JPS5772371A JP S5772371 A JPS5772371 A JP S5772371A JP 55148128 A JP55148128 A JP 55148128A JP 14812880 A JP14812880 A JP 14812880A JP S5772371 A JPS5772371 A JP S5772371A
Authority
JP
Japan
Prior art keywords
electrode
fringe
cross
region
silicon substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55148128A
Other languages
Japanese (ja)
Inventor
Masafumi Ono
Tadashi Sakagami
Masami Fujii
Akira Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Minebea Power Semiconductor Device Inc
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP55148128A priority Critical patent/JPS5772371A/en
Publication of JPS5772371A publication Critical patent/JPS5772371A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To prevent the damage of a semiconductor substrate by holding a semiconductor by a fringe of a section where an electrode is bonded with the semiconductor substrate and obviating cross with another electrode. CONSTITUTION:The fringe of the region where the cathode electrode 7 is bonded with the silicon substrate 1 holds the silicon substrate 1 to prevent cross with the anode electrode 6. Accordingly, there is no region in which tensile stress exceeds approximately 20kg/mm.<2>, where silicon is not damaged. The silicon substrate 1 is not damaged by stress even when a temperature change of 0 deg.C-280 deg.C is given, and the semiconductor device normally functions. A corner section of the cathode electrode may be rounded in order to obviate the cross of the fringe of the bonding region with the anode electrode 6.
JP55148128A 1980-10-24 1980-10-24 Semiconductor device Pending JPS5772371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55148128A JPS5772371A (en) 1980-10-24 1980-10-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148128A JPS5772371A (en) 1980-10-24 1980-10-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5772371A true JPS5772371A (en) 1982-05-06

Family

ID=15445878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148128A Pending JPS5772371A (en) 1980-10-24 1980-10-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5772371A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5026298U (en) * 1973-07-02 1975-03-26
JPS50114183A (en) * 1974-02-15 1975-09-06
JPS5032962B2 (en) * 1973-01-08 1975-10-25
JPS5348594A (en) * 1976-10-14 1978-05-02 Nissan Motor Oxygen sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5032962B2 (en) * 1973-01-08 1975-10-25
JPS5026298U (en) * 1973-07-02 1975-03-26
JPS50114183A (en) * 1974-02-15 1975-09-06
JPS5348594A (en) * 1976-10-14 1978-05-02 Nissan Motor Oxygen sensor

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