JPS5774327A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5774327A
JPS5774327A JP15012680A JP15012680A JPS5774327A JP S5774327 A JPS5774327 A JP S5774327A JP 15012680 A JP15012680 A JP 15012680A JP 15012680 A JP15012680 A JP 15012680A JP S5774327 A JPS5774327 A JP S5774327A
Authority
JP
Japan
Prior art keywords
compd
monomaleimide
halogen
alkyl
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15012680A
Other languages
Japanese (ja)
Inventor
Masayuki Oba
Motoo Kawamata
Hikotada Tsuboi
Nobushi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP15012680A priority Critical patent/JPS5774327A/en
Publication of JPS5774327A publication Critical patent/JPS5774327A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition with good moisture-resisting electrical characteristics, excellent in mechanical strength at a high temp., heat deterioration resistance and bonding strength, which comprises a specified monomaleimide compd., polymaleimide compd. and an epoxy resin.
CONSTITUTION: 100pts.wt. mixt. consisting of 1W70wt% monomaleimide compd. of formulaI(wherein X and Y are each H, halogen, alkyl or phenyl; R1 and R2 are each H, halogen, alkyl, alkenyl, hydroxy, cyano, carboxyl or alkoxy; R3 is H or acetyl) and 99W30wt% polyimide compd. of formula II (wherein Z is a 2W150C polyvalent org. group of valency. n; n is at least 2) is compounded with 5W300pts.wt. epoxy resin such as a bisphenol A or phenolic novolak type one.
COPYRIGHT: (C)1982,JPO&Japio
JP15012680A 1980-10-28 1980-10-28 Thermosetting resin composition Pending JPS5774327A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15012680A JPS5774327A (en) 1980-10-28 1980-10-28 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15012680A JPS5774327A (en) 1980-10-28 1980-10-28 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5774327A true JPS5774327A (en) 1982-05-10

Family

ID=15490042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15012680A Pending JPS5774327A (en) 1980-10-28 1980-10-28 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5774327A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158363A (en) * 1996-11-29 1998-06-16 Mitsui Chem Inc Thermosetting resin composition and prepreg and laminated board produced by using the composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158363A (en) * 1996-11-29 1998-06-16 Mitsui Chem Inc Thermosetting resin composition and prepreg and laminated board produced by using the composition

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