JPS5774328A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5774328A
JPS5774328A JP15082680A JP15082680A JPS5774328A JP S5774328 A JPS5774328 A JP S5774328A JP 15082680 A JP15082680 A JP 15082680A JP 15082680 A JP15082680 A JP 15082680A JP S5774328 A JPS5774328 A JP S5774328A
Authority
JP
Japan
Prior art keywords
epoxy resin
heat
monomaleimide
compd
halogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15082680A
Other languages
Japanese (ja)
Inventor
Masayuki Oba
Motoo Kawamata
Hikotada Tsuboi
Nobushi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP15082680A priority Critical patent/JPS5774328A/en
Publication of JPS5774328A publication Critical patent/JPS5774328A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition with excellet mechanical strengh at a high temp. and bonding strength, comprising a specified monomaleimide compd. and an epoxy resin.
CONSTITUTION: 5W98wt% monomaleimide compd. of the formula (wherein X and Y are each H, halogen, alkyl or phenyl; R1 and R2 are each H, halogen, alkyl, alkenyl, hydroxy, cyano, carboxyl or alkoxy; R3 is H or acetyl) is mixed with 95W 2wt% epoxy resin such as a bisphenol A type or phenolic novolak type one.
EFFECT: The composition is easily cured by heating at 120W280°C for 1W50hr, giving a cured product with heat resisting characteristics usable at a high temp. for a long time.
USE: A casting resin, molding resin for electronic parts, heat-resistant adhesive, heat- resistant insulating varnish, etc.
COPYRIGHT: (C)1982,JPO&Japio
JP15082680A 1980-10-29 1980-10-29 Epoxy resin composition Pending JPS5774328A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15082680A JPS5774328A (en) 1980-10-29 1980-10-29 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15082680A JPS5774328A (en) 1980-10-29 1980-10-29 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5774328A true JPS5774328A (en) 1982-05-10

Family

ID=15505241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15082680A Pending JPS5774328A (en) 1980-10-29 1980-10-29 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5774328A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158363A (en) * 1996-11-29 1998-06-16 Mitsui Chem Inc Thermosetting resin composition and prepreg and laminated board produced by using the composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10158363A (en) * 1996-11-29 1998-06-16 Mitsui Chem Inc Thermosetting resin composition and prepreg and laminated board produced by using the composition

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