JPS5776431A - Semiconductor ressure transducer - Google Patents

Semiconductor ressure transducer

Info

Publication number
JPS5776431A
JPS5776431A JP55151372A JP15137280A JPS5776431A JP S5776431 A JPS5776431 A JP S5776431A JP 55151372 A JP55151372 A JP 55151372A JP 15137280 A JP15137280 A JP 15137280A JP S5776431 A JPS5776431 A JP S5776431A
Authority
JP
Japan
Prior art keywords
boards
vessels
sensitive element
pressure sensitive
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55151372A
Other languages
Japanese (ja)
Inventor
Susumu Kimijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55151372A priority Critical patent/JPS5776431A/en
Publication of JPS5776431A publication Critical patent/JPS5776431A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

PURPOSE:To simple temperature compensation by embedding heating elements into vessels fitting the base boards used for fixing a pressure resisting element covered by diffusion resisting layers on semiconductor monocrystal boards close to the base boards and controlling the temperature of the pressure sensitive element. CONSTITUTION:A pressure sensitive element is produced, for example, by making the center of n type silicone monocrystal board 2 thin diaphragm 2a and forming p type diffusion resisting layers 3 on the surface of the board 2. The pressure sensitive element 1 is airtightly adhered to silicone boards 4 through soldering glass 5a and then airtightly adhered to ceramic vessels 6 through soldering glass 5b. A layer consisting of the silicone boards 4 and vessels 6 communicate through a penetration hole 4a, 6a and pressure P1, p2 are applied to the diaphragm 2a. The heating elements 10 to be heated by an electric power source 10 are unified in a body with the vessels 6 close to the silicon boards to control the temperature of the pressure sensitive element 1 to keep at 50 deg.C. Thus, the temperature can be compensated by miniaturized equipment and the small quantity of power supply, preventing errors.
JP55151372A 1980-10-30 1980-10-30 Semiconductor ressure transducer Pending JPS5776431A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55151372A JPS5776431A (en) 1980-10-30 1980-10-30 Semiconductor ressure transducer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55151372A JPS5776431A (en) 1980-10-30 1980-10-30 Semiconductor ressure transducer

Publications (1)

Publication Number Publication Date
JPS5776431A true JPS5776431A (en) 1982-05-13

Family

ID=15517111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55151372A Pending JPS5776431A (en) 1980-10-30 1980-10-30 Semiconductor ressure transducer

Country Status (1)

Country Link
JP (1) JPS5776431A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112133U (en) * 1983-01-17 1984-07-28 株式会社島津製作所 pressure sensor
JPS6121944U (en) * 1984-07-12 1986-02-08 横河電機株式会社 Heat-retaining pressure capsule
JPH01311229A (en) * 1988-03-08 1989-12-15 Ppg Hellige Bv Differential pressure measuring apparatus for bidirectional gas flow
WO2019063715A1 (en) * 2017-09-28 2019-04-04 Tdk Electronics Ag MEDIUM-SEPARATE PRESSURE TRANSMITTER
CN111108359A (en) * 2017-09-28 2020-05-05 Tdk电子股份有限公司 Pressure sensor on ceramic substrate
JP2020535411A (en) * 2017-09-28 2020-12-03 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ Pressure sensor on ceramic pressure connection

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59112133U (en) * 1983-01-17 1984-07-28 株式会社島津製作所 pressure sensor
JPS6121944U (en) * 1984-07-12 1986-02-08 横河電機株式会社 Heat-retaining pressure capsule
JPH01311229A (en) * 1988-03-08 1989-12-15 Ppg Hellige Bv Differential pressure measuring apparatus for bidirectional gas flow
WO2019063715A1 (en) * 2017-09-28 2019-04-04 Tdk Electronics Ag MEDIUM-SEPARATE PRESSURE TRANSMITTER
CN111108359A (en) * 2017-09-28 2020-05-05 Tdk电子股份有限公司 Pressure sensor on ceramic substrate
JP2020535437A (en) * 2017-09-28 2020-12-03 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ Media separation type pressure transmitter
JP2020535411A (en) * 2017-09-28 2020-12-03 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ Pressure sensor on ceramic pressure connection
JP2020535434A (en) * 2017-09-28 2020-12-03 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ Pressure sensor on ceramic substrate
US11085844B2 (en) 2017-09-28 2021-08-10 Tdk Electronics Ag Media-separated pressure transmitter

Similar Documents

Publication Publication Date Title
JPS55103439A (en) Semiconductor pressure sensor
AU2108100A (en) Platinum temperature sensor and its method of production
JPS6471115A (en) Method of joining semiconductor substrate
JPS5753947A (en) Transistor and electronic device containing it
JPS5776431A (en) Semiconductor ressure transducer
US3836796A (en) Semiconductor pressure transducer employing novel temperature compensation means
US3886799A (en) Semiconductor pressure transducer employing temperature compensation circuits and novel heater circuitry
EP0186976A3 (en) Forming glass layers on semiconductor substrates
JPS5387238A (en) Diode matrix heat sensitive heads combined in one body
JPS5451490A (en) Semiconductor pressure converter
JPS56148870A (en) Semiconductor presssure converter
JPS568863A (en) Substrate for semiconductor device
JPS5717158A (en) Manufacture of semiconductor device
JPS57171235A (en) Semiconductor pressure converter
JPS56146256A (en) Hybrid ic device
JPS5565448A (en) Ceramic package for semiconductor device
JPS57141949A (en) Manufacture of thin film hybrid integrated circuit
JPS54127690A (en) Semiconductor pressure converter and its manufacture
JPS6448437A (en) Electrode structure
JPS5749258A (en) Semiconductor device
JPS5649549A (en) Semiconductor device
JPS6422035A (en) Semiconductor device
JPS55138240A (en) Manufacture of semiconductor device
JPS5533024A (en) Semiconductor device for converting pressure
JPS6444027A (en) Semiconductor device