JPS5776850A - Manufacture device for semiconductor device - Google Patents

Manufacture device for semiconductor device

Info

Publication number
JPS5776850A
JPS5776850A JP55152596A JP15259680A JPS5776850A JP S5776850 A JPS5776850 A JP S5776850A JP 55152596 A JP55152596 A JP 55152596A JP 15259680 A JP15259680 A JP 15259680A JP S5776850 A JPS5776850 A JP S5776850A
Authority
JP
Japan
Prior art keywords
bonding
film carrier
mechanism section
stage
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55152596A
Other languages
English (en)
Inventor
Hiroshi Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55152596A priority Critical patent/JPS5776850A/ja
Publication of JPS5776850A publication Critical patent/JPS5776850A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
JP55152596A 1980-10-30 1980-10-30 Manufacture device for semiconductor device Pending JPS5776850A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55152596A JPS5776850A (en) 1980-10-30 1980-10-30 Manufacture device for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55152596A JPS5776850A (en) 1980-10-30 1980-10-30 Manufacture device for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5776850A true JPS5776850A (en) 1982-05-14

Family

ID=15543879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55152596A Pending JPS5776850A (en) 1980-10-30 1980-10-30 Manufacture device for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5776850A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864038A (ja) * 1981-10-13 1983-04-16 Nec Corp ボンデイングプレ−ト
US5146661A (en) * 1990-11-07 1992-09-15 At&T Bell Laboratories Packaged device handling method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5864038A (ja) * 1981-10-13 1983-04-16 Nec Corp ボンデイングプレ−ト
US5146661A (en) * 1990-11-07 1992-09-15 At&T Bell Laboratories Packaged device handling method and apparatus

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