JPS5776865A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5776865A JPS5776865A JP55153106A JP15310680A JPS5776865A JP S5776865 A JPS5776865 A JP S5776865A JP 55153106 A JP55153106 A JP 55153106A JP 15310680 A JP15310680 A JP 15310680A JP S5776865 A JPS5776865 A JP S5776865A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- substrate
- film
- thermal
- generation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]
Landscapes
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Abstract
PURPOSE:To prevent the generation of a crystal defect by successively laminating a thermal oxide film, a CVD oxide film and a Si nitride film on the surface of a Si substrate and oxidizing the surface of the Si substrate of a section where there is no thermal oxide film. CONSTITUTION:The thermal oxide film 2, the CVD oxide film 6 and the Si3N4 film 3 are laminated successively on the Si substrate 1, and patterned, and a separation oxide film 4 is formed by thermally oxidizing an exposed surface of the Si substrate. Accordingly, thermal stress resulting from the Si3N4 layer when the films are selectively oxidized can be relaxed effectively, and the generation of the crystal defect can be prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55153106A JPS5776865A (en) | 1980-10-31 | 1980-10-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55153106A JPS5776865A (en) | 1980-10-31 | 1980-10-31 | Manufacture of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5776865A true JPS5776865A (en) | 1982-05-14 |
Family
ID=15555096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55153106A Pending JPS5776865A (en) | 1980-10-31 | 1980-10-31 | Manufacture of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5776865A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4983537A (en) * | 1986-12-29 | 1991-01-08 | General Electric Company | Method of making a buried oxide field isolation structure |
| US5422300A (en) * | 1992-12-03 | 1995-06-06 | Motorola Inc. | Method for forming electrical isolation in an integrated circuit |
| CN1050932C (en) * | 1994-07-06 | 2000-03-29 | 现代电子产业株式会社 | Method of forming a dield oxide film in a semiconductor device |
-
1980
- 1980-10-31 JP JP55153106A patent/JPS5776865A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4983537A (en) * | 1986-12-29 | 1991-01-08 | General Electric Company | Method of making a buried oxide field isolation structure |
| US5422300A (en) * | 1992-12-03 | 1995-06-06 | Motorola Inc. | Method for forming electrical isolation in an integrated circuit |
| CN1050932C (en) * | 1994-07-06 | 2000-03-29 | 现代电子产业株式会社 | Method of forming a dield oxide film in a semiconductor device |
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