JPS5778155A - Sealing method for electric device - Google Patents
Sealing method for electric deviceInfo
- Publication number
- JPS5778155A JPS5778155A JP15417780A JP15417780A JPS5778155A JP S5778155 A JPS5778155 A JP S5778155A JP 15417780 A JP15417780 A JP 15417780A JP 15417780 A JP15417780 A JP 15417780A JP S5778155 A JPS5778155 A JP S5778155A
- Authority
- JP
- Japan
- Prior art keywords
- case
- pellet
- shape
- sealed
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000008188 pellet Substances 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
PURPOSE:To enable the use of a low heat resistnat part by containing a thermosetting resin pellet of incompletely cured state in a box-shape case for mounting the part and melting and hardening the pellet with its seal directed downwardly, thereby facilitating an assembling work. CONSTITUTION:A base block 7 passed with a terminal 8 therethrough is formed in a shape engaged with a box-shaped case 1, and is used as a cover 5. A printed board 10 mounted with a part 2 is soldered fixedly to the end of the terminal 8, and is contained in the case 1 together with a resin pellet 4 formed in air gap shape of the part with a cover 5 directed downwardly. The pellet 4 is secured with power, e.g., epoxy or the like in semi-hardened state, is allowed to stand at 80 deg.C for 20- 30min to be molten to bury the leads of the printed board 10 and the part 2 and to be then hardened, and the gap between the case 1 and the base block 7 is sealed. In this manner, assembling can be facilitated including the inspection of the characteristics, and can be sealed at low temperature, thereby enabling the use of the low heat resistant part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15417780A JPS5778155A (en) | 1980-10-31 | 1980-10-31 | Sealing method for electric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15417780A JPS5778155A (en) | 1980-10-31 | 1980-10-31 | Sealing method for electric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5778155A true JPS5778155A (en) | 1982-05-15 |
Family
ID=15578510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15417780A Pending JPS5778155A (en) | 1980-10-31 | 1980-10-31 | Sealing method for electric device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5778155A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233482U (en) * | 1988-08-26 | 1990-03-02 | ||
| FR2803097A1 (en) * | 1999-12-28 | 2001-06-29 | Thomson Csf Sextant | Method for coating an electronic device mounted in a casing with a protective resin |
-
1980
- 1980-10-31 JP JP15417780A patent/JPS5778155A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233482U (en) * | 1988-08-26 | 1990-03-02 | ||
| FR2803097A1 (en) * | 1999-12-28 | 2001-06-29 | Thomson Csf Sextant | Method for coating an electronic device mounted in a casing with a protective resin |
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