JPS5778155A - Sealing method for electric device - Google Patents
Sealing method for electric deviceInfo
- Publication number
- JPS5778155A JPS5778155A JP15417780A JP15417780A JPS5778155A JP S5778155 A JPS5778155 A JP S5778155A JP 15417780 A JP15417780 A JP 15417780A JP 15417780 A JP15417780 A JP 15417780A JP S5778155 A JPS5778155 A JP S5778155A
- Authority
- JP
- Japan
- Prior art keywords
- case
- pellet
- shape
- sealed
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000008188 pellet Substances 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15417780A JPS5778155A (en) | 1980-10-31 | 1980-10-31 | Sealing method for electric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15417780A JPS5778155A (en) | 1980-10-31 | 1980-10-31 | Sealing method for electric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5778155A true JPS5778155A (en) | 1982-05-15 |
Family
ID=15578510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15417780A Pending JPS5778155A (en) | 1980-10-31 | 1980-10-31 | Sealing method for electric device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5778155A (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233482U (ja) * | 1988-08-26 | 1990-03-02 | ||
| FR2803097A1 (fr) * | 1999-12-28 | 2001-06-29 | Thomson Csf Sextant | Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede |
-
1980
- 1980-10-31 JP JP15417780A patent/JPS5778155A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233482U (ja) * | 1988-08-26 | 1990-03-02 | ||
| FR2803097A1 (fr) * | 1999-12-28 | 2001-06-29 | Thomson Csf Sextant | Procede d'enrobage multifonctionnel d'un dispositif electronique monte dans un boitier, et dispositif electronique en boitier obtenu par la mise en oeuvre du procede |
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