JPS5779623A - Formation of silicate glass film - Google Patents
Formation of silicate glass filmInfo
- Publication number
- JPS5779623A JPS5779623A JP55155361A JP15536180A JPS5779623A JP S5779623 A JPS5779623 A JP S5779623A JP 55155361 A JP55155361 A JP 55155361A JP 15536180 A JP15536180 A JP 15536180A JP S5779623 A JPS5779623 A JP S5779623A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- flow
- silicate glass
- tube
- reaction tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45514—Mixing in close vicinity to the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45578—Elongated nozzles, tubes with holes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
- H10P14/6923—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC the material being boron or phosphorus doped silicon oxides, e.g. BPSG, BSG or PSG
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To make silicate glass films to grow stably on semiconductor substrates by a method wherein hydride gas is made to flow in from a gas feeding fine tube, and oxidizing gas is made to flow in from another gas feeding fine tube. CONSTITUTION:The silicon semiconductor substrates to be treated are arranged at the heat equalizing part in a reaction tube 1, hydride gas being mixed with monosilane and phosphine is made to flow from the gas feeding fine tube 4 into the reaction tube, oxygen gas is made to flow from the gas feeding fine tube 6 into the reaction tube, and moreover oxygen gas is made to flow in from a gas flow-in port 3 of the reaction tube 1, and the silicate glass films are made to grow on the semiconductor substrates. When the silicate glass film manufactured by this way is analyzed with a spectrum analyzer, no Si-H2 is contained therein, containment of phosphorus is uniform, and etching speed is also uniform being in proportion to the contents of phophorus.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55155361A JPS5779623A (en) | 1980-11-05 | 1980-11-05 | Formation of silicate glass film |
| EP81303829A EP0047112B1 (en) | 1980-08-29 | 1981-08-21 | Method of forming phosphosilicate glass films |
| DE8181303829T DE3173066D1 (en) | 1980-08-29 | 1981-08-21 | Method of forming phosphosilicate glass films |
| US06/518,329 US4513026A (en) | 1980-08-29 | 1983-08-01 | Method for coating a semiconductor device with a phosphosilicate glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55155361A JPS5779623A (en) | 1980-11-05 | 1980-11-05 | Formation of silicate glass film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5779623A true JPS5779623A (en) | 1982-05-18 |
| JPS629214B2 JPS629214B2 (en) | 1987-02-27 |
Family
ID=15604225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55155361A Granted JPS5779623A (en) | 1980-08-29 | 1980-11-05 | Formation of silicate glass film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5779623A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4098923A (en) * | 1976-06-07 | 1978-07-04 | Motorola, Inc. | Pyrolytic deposition of silicon dioxide on semiconductors using a shrouded boat |
-
1980
- 1980-11-05 JP JP55155361A patent/JPS5779623A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4098923A (en) * | 1976-06-07 | 1978-07-04 | Motorola, Inc. | Pyrolytic deposition of silicon dioxide on semiconductors using a shrouded boat |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS629214B2 (en) | 1987-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5559729A (en) | Forming method of semiconductor surface insulating film | |
| JPS57158370A (en) | Formation of metallic thin film | |
| JPS5779623A (en) | Formation of silicate glass film | |
| JPS5694751A (en) | Vapor growth method | |
| US4279669A (en) | Method for epitaxial deposition | |
| AU556652B2 (en) | Glow discharge deposition apparatus | |
| JPS5591815A (en) | Silicon epitaxial growth | |
| JPS56142642A (en) | Manufacture of semiconductor device | |
| JPS55109293A (en) | Production of semiconductor crystal of group 3-5 compound | |
| JPS5753942A (en) | Method of oxidation and diffusion | |
| JPS6425545A (en) | Growing method for boron phosphorus silicate glass film | |
| JPS55154728A (en) | Manufacture of semiconductor device | |
| JPS5789438A (en) | Purging method for inside of furnace for two-chamber type box annealing furnace | |
| JPS56112722A (en) | Manufacture of semiconductor device | |
| JPS60227415A (en) | Vapor growth apparatus | |
| JPS55121634A (en) | Diffusing method for impurity | |
| JPS5441280A (en) | Manufacturing apparatus for single crystal | |
| JPS56150822A (en) | Manufacture of semiconductor device | |
| JPS54121283A (en) | Manufacture of silicon single crystal by pulling method and apparatus therefor | |
| JPS5760869A (en) | Semiconductor device | |
| JPS56153727A (en) | Manufacture of semiconductor device | |
| JPS55110031A (en) | Method for vapor growth | |
| JPS6446917A (en) | Chemical vapor growth device | |
| JPS5754329A (en) | Decompressed vapor-phase growing device | |
| JPS56142632A (en) | Diffusing method for boron |