JPS5779645A - Division of semiconductor wafer - Google Patents

Division of semiconductor wafer

Info

Publication number
JPS5779645A
JPS5779645A JP15497980A JP15497980A JPS5779645A JP S5779645 A JPS5779645 A JP S5779645A JP 15497980 A JP15497980 A JP 15497980A JP 15497980 A JP15497980 A JP 15497980A JP S5779645 A JPS5779645 A JP S5779645A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
pressed
semicylindrical
pelletization
pinched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15497980A
Other languages
Japanese (ja)
Inventor
Keiji Itoga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15497980A priority Critical patent/JPS5779645A/en
Publication of JPS5779645A publication Critical patent/JPS5779645A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To enhance the efficiency of pelletization by a method wherein a soft and slippery sheet is provided on one side face of a semiconductor wafer with dicing lines being formed thereon, while an assembled body being pinched and held with flexible magnetic sheets is pressed with pressure against a semicylindrical jig. CONSTITUTION:On one side face of the semiconductor wafer 1 being formed with the dicing lines in mutually rectangular two directions on the surface thereof, and being formed with a functional region inside and having metalized layer providing with magnetizability on the back, the thin and soft and slippery sheet 7 of parchment paper, etc., is interposed, and after it is pinched and held with the flexible magnetic sheets 6, 8 of magnetic rubber, etc., it is pressed with pressure against the semicylindrical jig 9 using a press tool 10, and it is rotated at 90 deg. and is pressed with pressure again in succession to divide the wafer into the pellets. Accordingly, the pelletization can be performed efficiently, and when the degree of inflection is large, split of pellet can be reduced.
JP15497980A 1980-11-04 1980-11-04 Division of semiconductor wafer Pending JPS5779645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15497980A JPS5779645A (en) 1980-11-04 1980-11-04 Division of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15497980A JPS5779645A (en) 1980-11-04 1980-11-04 Division of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5779645A true JPS5779645A (en) 1982-05-18

Family

ID=15596050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15497980A Pending JPS5779645A (en) 1980-11-04 1980-11-04 Division of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5779645A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171717A (en) * 1990-05-25 1992-12-15 International Business Machines Corporation Method for batch cleaving semiconductor wafers and coating cleaved facets

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171717A (en) * 1990-05-25 1992-12-15 International Business Machines Corporation Method for batch cleaving semiconductor wafers and coating cleaved facets

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