JPS5494577A - Device for adhering wafer - Google Patents

Device for adhering wafer

Info

Publication number
JPS5494577A
JPS5494577A JP176178A JP176178A JPS5494577A JP S5494577 A JPS5494577 A JP S5494577A JP 176178 A JP176178 A JP 176178A JP 176178 A JP176178 A JP 176178A JP S5494577 A JPS5494577 A JP S5494577A
Authority
JP
Japan
Prior art keywords
wafer
adhering
pressing
center
pressing plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP176178A
Other languages
Japanese (ja)
Inventor
Tsuneo Hamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP176178A priority Critical patent/JPS5494577A/en
Publication of JPS5494577A publication Critical patent/JPS5494577A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: In the device for adhering wafers to platens with an adhesive, a pressing plate that has convex surface against the wafer surface and readily deforms by elasticity is used to form a thin and good-flatness adhering layer.
CONSTITUTION: In the wafer-adhering device, pressing plate 3 that has convex pressing surface against the wafer surface, being elastically deformable is fixed to pressing platen 1 through pressing ring 2. When wafer 4 is adhered to adhering pla ten 6 through adhesive layer 5, the force is applied to the center of wafer 4 during the pressure is small, and as the pressure becomes larger and the adhesive layer becomes thinner at the center, the pressing plate 3 gradually deforms until the peri pheral surface of the plate 3 comes to the same level as that of the center part.
COPYRIGHT: (C)1979,JPO&Japio
JP176178A 1978-01-10 1978-01-10 Device for adhering wafer Pending JPS5494577A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP176178A JPS5494577A (en) 1978-01-10 1978-01-10 Device for adhering wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP176178A JPS5494577A (en) 1978-01-10 1978-01-10 Device for adhering wafer

Publications (1)

Publication Number Publication Date
JPS5494577A true JPS5494577A (en) 1979-07-26

Family

ID=11510555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP176178A Pending JPS5494577A (en) 1978-01-10 1978-01-10 Device for adhering wafer

Country Status (1)

Country Link
JP (1) JPS5494577A (en)

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