JPS5787542U - - Google Patents
Info
- Publication number
- JPS5787542U JPS5787542U JP1980163983U JP16398380U JPS5787542U JP S5787542 U JPS5787542 U JP S5787542U JP 1980163983 U JP1980163983 U JP 1980163983U JP 16398380 U JP16398380 U JP 16398380U JP S5787542 U JPS5787542 U JP S5787542U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980163983U JPS5787542U (2) | 1980-11-14 | 1980-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980163983U JPS5787542U (2) | 1980-11-14 | 1980-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5787542U true JPS5787542U (2) | 1982-05-29 |
Family
ID=29522744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980163983U Pending JPS5787542U (2) | 1980-11-14 | 1980-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5787542U (2) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147667A (2) * | 1974-05-16 | 1975-11-26 | ||
| JPS54118170A (en) * | 1978-02-28 | 1979-09-13 | Amp Inc | Electric connector used to mount electronic device at substrate |
-
1980
- 1980-11-14 JP JP1980163983U patent/JPS5787542U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50147667A (2) * | 1974-05-16 | 1975-11-26 | ||
| JPS54118170A (en) * | 1978-02-28 | 1979-09-13 | Amp Inc | Electric connector used to mount electronic device at substrate |