JPS5796532A - Treating method for semiconductor substrate - Google Patents

Treating method for semiconductor substrate

Info

Publication number
JPS5796532A
JPS5796532A JP55173593A JP17359380A JPS5796532A JP S5796532 A JPS5796532 A JP S5796532A JP 55173593 A JP55173593 A JP 55173593A JP 17359380 A JP17359380 A JP 17359380A JP S5796532 A JPS5796532 A JP S5796532A
Authority
JP
Japan
Prior art keywords
resin
foreign matter
substrate
pulverized
protruded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55173593A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6143849B2 (de
Inventor
Masao Kanazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55173593A priority Critical patent/JPS5796532A/ja
Publication of JPS5796532A publication Critical patent/JPS5796532A/ja
Publication of JPS6143849B2 publication Critical patent/JPS6143849B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP55173593A 1980-12-09 1980-12-09 Treating method for semiconductor substrate Granted JPS5796532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55173593A JPS5796532A (en) 1980-12-09 1980-12-09 Treating method for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173593A JPS5796532A (en) 1980-12-09 1980-12-09 Treating method for semiconductor substrate

Publications (2)

Publication Number Publication Date
JPS5796532A true JPS5796532A (en) 1982-06-15
JPS6143849B2 JPS6143849B2 (de) 1986-09-30

Family

ID=15963464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55173593A Granted JPS5796532A (en) 1980-12-09 1980-12-09 Treating method for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5796532A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128530A (ja) * 1984-11-28 1986-06-16 Canon Inc エピスパイククラツシユ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61128530A (ja) * 1984-11-28 1986-06-16 Canon Inc エピスパイククラツシユ装置

Also Published As

Publication number Publication date
JPS6143849B2 (de) 1986-09-30

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