JPS58111401A - Mounting construction for microwave and millimeter wave integrated circuit - Google Patents

Abstract

PURPOSE:To improve the transmission characteristics of connection parts, by providing a space having spread toward a base at the side surface of a metallic carrier where an integrated circuit is connected and inserting and adhering a conductive member to this space. CONSTITUTION:Integrated circuits 2, 2' are mounted on metallic carriers 1, 1' and mounted on a base 8. The carriers 1, 1' are cut off at the side surface with a slope and provided with a space 9 spread toward the base 8 and a soft and good electric conductive material 10 such as conductive rubber or indium is inserted to this space 9 to push the carriers 1, 1' toward the base 8 for mounting. The material 10 receives the largest weight at its center bottom and deforms toward the opposite direction, in contact with a part near ground conductors 6, 6' of upper microwave integrated circuits 2, 2' of the carriers 1, 1' to decrease discontinuity of the conductors 6, 6'.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides microwave and reflected wave transmission lines on a dielectric substrate.
Or a microwave/millimeter wave circuit in which a microwave/millimeter wave integrated circuit made by bonding and mounting the microwave/millimeter wave integrated circuit boards constituting the microwave/tU wave circuit on individual metal carriers is mounted on a flat base. Regarding mosier, in particular, it relates to improving the connection method of each microwave/millimeter wave integrated circuit.

Conventionally, as shown in FIG. 1, the connection of transmission lines 3.3' of microwave integrated circuits 2', 2' mounted on a metal carrier 1.1' by connecting a conductive ribbon 4 between the transmission line patterns.
I am connecting it with #hk board board 5.5
The ground conductor 6.6' on the 'plane is connected to the gap between the microwave integrated circuit connections and the metal carrier l.

The groove 7 formed by the thickness of 1' creates a large discontinuity, especially in the ground area, resulting in misalignment of the transmission line.
Transmission characteristics deteriorate. For this purpose, the shape of the transmission 6-line connection ribbon or the circuit around the junction.

However, since gaps in microwave integrated circuits inevitably occur due to errors in manufacturing and assembly, they cannot be fixed (conventional methods cannot obtain sufficient matching characteristics). There wasn't. In addition, for millimeter-wave integrated circuits that require severe matching characteristics, integrated circuit testing, adjustment,
This is a factor that prevents the adoption of a metal carrier system that is superior in terms of installation and maintenance. The present invention was devised to solve this problem.

In the present invention, a transmission line or circuit is formed on a dielectric substrate, and a plurality of microwave/millimeter wave integrated circuits, which are formed by bonding and mounting the substrate on a metal carrier, are mounted on the same plane base. Arrange and connect! In the IXI-HA-1 IXI-Wave circuit module, a space is provided on the side surface of the metal carrier at the part where the integrated circuit is connected, expanding toward the base, and a conductive material is inserted into the scissor cavity and tightly attached. It is characterized by:

Hereinafter, embodiments of the present invention will be described in detail based on the accompanying drawings.

FIG. 2 shows a sectional view of the first embodiment. In the figure, parts that are the same as those in FIG. 1 are designated by the same reference numerals. Therefore, 1.1' is a metal carrier, 2.2' is a microwave integrated circuit, and 3.8
' is the transmission circuit, 4 is the conductor for connecting the transmission line, ribbon, 5
．． 5' is a dielectric substrate, and 6.6' is a ground conductor. The microwave integrated circuits 2.2' are each mounted on a metal carrier 1.1', and the four-wave integrated circuit 2.1 is mounted on a base 8. The side surface of the metal carrier 1.1' to be connected is cut obliquely to provide a space 9 extending toward the base 8, and this space 9 is filled with conductive rubber or indium, for example.

Soft and highly conductive materials such as pure aluminum and pure gold 10
is inserted, and the metal carrier 1.1' is pressed in the direction of the base 8 and mounted. In this embodiment configured as described above, the soft and highly conductive material 1G receives the largest load at the center bottom.

The metal carrier 1.1' is deformed in the opposite direction.
Earth conductor 6.6 of the upper microwave integrated circuit 2.2'
, which reduces discontinuities in the ground conductor 6.6'. This reduces mismatch and improves transmission characteristics.

Next, a second embodiment is shown in FIG. 3. This embodiment differs from the previous embodiment in that a conductive sheet 11 and an elastic body 12 are used instead of the soft conductive material 10. That is, meta
Insert the conductive sheet 11 and elastic body 12 into the space 9 provided in the carrier 1.1'.

The elasticity of the elastic body 12 presses the conductive sheet 11 to a position close to the ground conductor 6.6' of the V-microwave integrated circuit 2.2'.

Similar to the previous embodiment, this embodiment, which is configured in a similar manner, reduces the number of discontinuities in the ground conductor 6.6'O.

Improves transmission characteristics.

As explained above, the mounting structure of the microwave/sunwave integrated circuit of the present invention makes it possible to improve the transmission characteristics of the connecting portion when a plurality of microwave/sunwave integrated circuits are connected. It is something.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a conventional microwave integrated circuit mounting structure, and FIG. 2 is a cross-sectional view of a first embodiment of the present invention! Stomach wave to cum
FIG. 3 is a sectional view of the mounting structure of the radio wave integrated circuit, and FIG. 3 is a sectional view of the second embodiment. 1.1'...metal carrier, 2.2'...! Iku wave integrated circuit, s, s'...transmission line, 4...conductor ribbon for transmission line connection, s, s'...dielectric substrate, 6
．． 6'... Earth conductor, 8... Base, 9... Space expanding in the direction of the base, 1G... Soft, highly conductive material, 1
1--Conductive sheet, 12--Elastic body.

Claims (1)

[Claims] 1. Forming a transmission line or circuit on a dielectric substrate,
A plurality of microwave/millimeter wave integrated circuits are formed by bonding and mounting the substrate on a metal carrier. In a microwave/millimeter wave circuit module arranged and connected to the same plane base, a space extending in the direction of the base is provided on the side surface of the metal carrier at the part where the integrated circuit is connected, and the space is filled with a space extending in the direction of the base. A mounting structure for microwave/millimeter wave integrated circuits characterized by inserting and closely adhering a conductive material.