JPS5811245U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5811245U
JPS5811245U JP1981105185U JP10518581U JPS5811245U JP S5811245 U JPS5811245 U JP S5811245U JP 1981105185 U JP1981105185 U JP 1981105185U JP 10518581 U JP10518581 U JP 10518581U JP S5811245 U JPS5811245 U JP S5811245U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
fixed part
semiconductor element
semiconductor
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981105185U
Other languages
English (en)
Inventor
赤瀬　一豊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981105185U priority Critical patent/JPS5811245U/ja
Publication of JPS5811245U publication Critical patent/JPS5811245U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａは半導体素子とリードフレームとをダー　　イ
ボンデイングするために対向させた状態の断面図、同図
すはグイボンディング後の断面図である。 第２図ａは半導体素子に硬化剤（又は主剤）を塗布する
前の関係を示す断面図、同図すは塗布時の断面図である
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子裏面と該素子の固着部とに夫々接着剤の硬化
    剤と有機性樹脂剤とを分けて塗布し、前記半導体素子を
    前記固着部に貼り合わせたことを特徴とする半導体装置
    。
JP1981105185U 1981-07-15 1981-07-15 半導体装置 Pending JPS5811245U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981105185U JPS5811245U (ja) 1981-07-15 1981-07-15 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981105185U JPS5811245U (ja) 1981-07-15 1981-07-15 半導体装置

Publications (1)

Publication Number Publication Date
JPS5811245U true JPS5811245U (ja) 1983-01-25

Family

ID=29899729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981105185U Pending JPS5811245U (ja) 1981-07-15 1981-07-15 半導体装置

Country Status (1)

Country Link
JP (1) JPS5811245U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254439A (ja) * 1986-04-22 1987-11-06 シ−メンス、アクチエンゲゼルシヤフト 大面積の電力用電子デバイスを基板上に固定する方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62254439A (ja) * 1986-04-22 1987-11-06 シ−メンス、アクチエンゲゼルシヤフト 大面積の電力用電子デバイスを基板上に固定する方法

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