JPS58128792A - Method and device for primarily plating copper on printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to a method and apparatus for performing primary copper plating in a printed circuit board manufacturing process.

In general, the board manufacturing process for Print 1 includes a primary steel plating process in which copper plating is applied to the entire board material such as phenol, and then masking is applied to the above-mentioned - next - plating, followed by electrolytic copper plating (secondary steel) and solder plating. The process is roughly divided into the process of creating a pattern plate and the process of etching the pattern plate. The sub-copper plating process described above is divided into pretreatment, chemical plating (copper), and electroplating (-).

Conventionally, primary plating has been performed using one of the following 2Ik methods. That is, one method is to use the basket 1 of the first @ and the rack 2 shown in Fig. b2, and first put a large number of puddings (materials) in the basket l. Stored in a straight position,
In this state, it can be handled in a chemical plating tank (not shown). When the chemical plating is completed and the top number is pulled out from the car or Metsky, the base 4kr is removed from the car and placed on the rack 2. Rack 2 has a -1 edge shape, and the bottom plate IIk
is held within 1 inch of one edge in the rack 2, and the substrate r is held in rank 2 and immersed in a one-gas plating tank (not shown) K in a downward motion. However, with this method, it is difficult for the operator to change the base plate from car 1 to rack 2.
There is also the problem that the substrate r is easily soiled during the work. Furthermore, the equipment is divided into two parts, and for example, it is necessary to separately provide transportation and storage equipment for rack 1 and transportation and storage equipment for rack 2.

There is a problem that equipment costs and occupied space increase.

In contrast to this conventional method, the other conventional method is as follows.

Both chemical plating and electroplating are performed with the substrate r held in the rack 2, and this one-rack method solves the above-mentioned problems when holding the substrate r in the rack 2. However, the one-rack method has the disadvantage of poor productivity because it requires only a small number of boards to be assembled. Another disadvantage is that the load factor of chemical plating is low. In other words, in chemical plating, #&1lIlik of a certain amount or more for a certain amount of plating solution.
If there is no I product (group Ii greater than or equal to - chamber Ii), there is no chemical reaction l1
In contrast to the 411 mold that does not progress at all, with the one-rack method, the number of substrates that can be immersed at one time is small, so there is little control over the amount of liquid! -Lack of spears,
There is also the problem of stratification due to processing conditions.

The present invention aims to solve the above-mentioned conventional problems.

A number of printed circuit boards are stored vertically at intervals in a basket in a tilted manner, and the printed circuit boards are stored in the basket in a prone position.
#hS for both chemical plating tank and electroplating cypress KWAJ
When immersed in er, an electrode for glaze plating was inserted between the printed circuit boards at -1lllIl after chemical plating, and the explanation will be as follows with reference to the drawings.

In the third wholesaler, which is a schematic perspective view, the wrinkles are applied by dulling with a chemical plating bath 5 for primary steel plating and an electroplating cypress 6.
It is equipped with a basket 7 for accommodating a large number of print substrates (for example, 12 or more, and 6 in FIG. 3), and an anode 8 for plating (1/h). Both plating tanks 5,
6 is provided in the middle of the treated cypress 9. Before and after the plating tank 5.6, cypress 10 for pre-glazing, slow-processing, etc. are provided.

&&i' in car 7 are parallel to each other, tN! The upper and lower E@ are stacked on top of each other with Jl between them. Each board r is inclined with a pitch of 4v, for example, the long sides a and b of the base fiP are horizontal, the long side C1 is inclined, and the long side crow, b is the water hand conveyance of the cage 7. Direction F (J611@H9 direction)
The car is housed in the car 7 in an attitude that is perpendicular to the car.

As shown in 54IEl, which is an enlarged schematic perspective view, the car 7 is equipped with a rectangular parallelepiped frame 11, and one straight support 12 of the frame 11 has a large number of shelf-like horizontal blocks that support the long sides a*b of the board r (Fig. 83). #13
The upper frame is mounted parallel to the upper frame in the feeding direction 15
The lower end of the -1 member 16 is connected to the middle part of the boat in the boat direction. The car 1t16 has a hook 17f at its upper end, and a hook 17 is engaged by a transport robot on the 11F (not shown) to transport the car 7f up and down and in the direction of the arrow y15.

In SaW! 0.21 is Denki Metsu Konnobu 6 and the threshold of 95.10 before and after it, 23 is one e*ari of tank 6
S-Yang! 0.21 and 111 (iKl not shown) are Confucian-
It protrudes to the right (Ik31Clg) and forms a storage L26 for the anode 8 together with the 14m end 25 of the tip. A gap I& is provided between the cypress 6 and the storage section 26, so that the two communicate with each other. 27.2 kudzu is 1 fili
These are the protrusions 20 and 21.

A plurality of anodes 8 are provided in the form of a plate, each of which is inclined in the same direction as the position 1, and has the same size as the position 1'.
The results are examined above and below. Anode 8 is at end 112
It is held in the above position by a holder 30 fixed to the edge of 51 m, and the upper end of the holder 30 can run along the upper edges of the extensions 27 and 28 using rollers 31 and the like. 32 is a rail for the roller 31. Although not shown in the drawings, an anode power source is connected to the holder 30 via a current collector \wI&m or a flexible cable, and a drive unit equipped with a motor, chain, or air cylinder system is connected to the holder 30.
The holder 30 is made to run by sliding doors.

The number of anodes 8, their vertical positions, etc. are set so that each anode 8 can be interposed on a plate i', pI&&1, as described later.

- When carrying out the next steel plating process, the plate 7 containing the finished prints IIkIIiP is immersed in the chemical plating bath 5 for a predetermined period of time. When the chemical plating is completed, the basket 7 is pulled up and conveyed in the direction of arrow 1*, and immersed in the electroplating wood 6. Next, anode 8 @
At 11, it advances to 23 m, and one anode B enters each gap 1 between the groups @i' and r thresholds as shown in FIG. Each anode 5oiki@ is sufficiently wide, and the anodes $ are opposed to each other over substantially the entire surface of each substrate r. When the anode 8 is energized for a certain period of time and 1st plating is completed, the anode 8 becomes 11
1311 retreats into the storage section 26, and the basket 7 is pulled up and sent to the next stroke.

As explained above, according to the present invention, Il number of printed bases ll11r are piled up and stored in the basket 7, and the basket 7' is immersed in turn into the chemical metal key 5 and the electroplating tower 6. So, like Kimai, I put ik&r in basket 1 (
Work to transfer from $1ad) to rack 2 (juku 21)
It can be prevented by continuous chemical plating and electroplating. Therefore, in addition to saving manpower,
It is possible to prevent the board from being contaminated by dirt. In addition, instead of having to divide the feeder equipment into one for cars and one for racks as in the past, it is possible to reduce costs and occupy space by integrating the equipment into one. Since a large number of substrates can be stored individually, it is possible to accommodate a large number of substrates in one rack, compared to the conventional one-rack system that processes a small number of substrates.
The quality of fresh noodles can be improved by increasing the number of noodles processed each time.

Since the anode 8 is interposed between the edges E of the substrate rlP,
Even if you have a large number of groups &r, each group &P
The anode 8 can be arranged adjacent to the
It is possible to improve the plating finish by making the roughness of each substrate P uniform. Since the chemical plating tank 51 is immersed in the chemical plating tank 51, it is necessary to keep the #Ml wood for the tomb above the required value, prevent the deterioration of the load factor, and respond to the desired chemistry. I can do it.

Apart from the present invention, it is also possible to lay the jk &l' horizontally and stack it on top) or lay the & board 1'f* electric horizontally, compared to Sowara's method, this 111i! 111
has the following advantages: First of all, if you lay the board R horizontally and stack it one above the other, when you pull the basket up from the cypress 5.6, some of the plating solution will remain on the horizontal board R and it will be exposed.
As a result, there are problems such as the plating solution flowing out from the top of the board r at the rising position t and pouring into another tank, or the plate r being immersed in the next plating bath with the plating solution remaining on the top. . On the other hand, if the substrate r is tilted as in the present invention.

Since the plating solution flows out from above the mar into the pull-up 11, the above-mentioned problem does not occur.

When comparing the present invention with the method of straightening the base plate, the present invention is superior in terms of the length of the plating tank, the injection nozzle for rapid plating, etc. as described below.

In other words, as shown in Figure 61, the hook consists of 12 1hill LPs separated by 111Jt1m
If they are arranged in a straight position, the total base mN including wM direction and length L
- is 40X12= even if we ignore the group &ra)II#
The volume is 480 ml, but in the case of a 46" inclination method, the total conveyance direction of the entire bottle is 1 as shown in ji5&l.
m ) X /, /f = 500/&2 a
It becomes very similar. Therefore, according to the present invention, it is possible to study the width of each plating tank and the total length of the plating tank group 9, and the installation cost of the plating tank group 9 in a factory can be reduced.

The above-mentioned quick plating nozzle 40 is, for example, the gap 112 in Fig. 5.
The plating solution is installed near the main plate 1 so as to spray a first plating solution to each plate 1, and a drain 41 for the plating solution is provided near the lower end of the other mai 20. By arranging the fast plating nozzle 40, it is possible to constantly supply new plating solution to the surface of the substrate r, so that the plating processing time can be controlled.In the present invention, such a nozzle 40 is used.
It is possible to install it without &. On the other hand, plow 6
In the one-tortoise method shown in the figure, the nozzle 40 must be installed directly above the lk inspection machine, or the nozzle 40 will get in the way of raising and lowering the car. is the best in Eishoku.

For 1#L method number ζ, install the nozzle 40 near @-23 and apply the plating solution as shown in figure s7, which is a schematic view of the ■-1 arrow in figure 6! Is it conceivable to eject in half a line when the long side of the board is placed?
It is very long compared to t' (generally 600all or less), so il! In the method of No. 1711, the flow rate of the plating solution varies between the short side C side and the short side dll, making it impossible to finish the plating uniformly.

Furthermore, a bridge abutment embodying the present invention, such as 1118aa, has an anode 8 on standby above the electrolyte 6, and the anode 8 is interposed on the substrate r and pltl above the cypress 6, and the anode 8 is immersed in the tank 6, and electroplating is carried out. It may be possible to pull out the anode 8 from the substrates R and P after the substrate R is lifted above the tank 6 after the completion of the process.

[Brief explanation of the drawing]

Figure 1 and Figure 2 are schematic perspective views of conventional baskets and racks, No. 31! lll according to the invention! ! ! Schematic perspective view of koshiki, No. 4
The figure is an enlarged view of the basket, the plow 5- is a schematic view of the 11th side of the device in the T-node interposed shape 14c, and the 6th oil is a fi that is different from the present invention.
The 71st is a schematic diagram of Il & IIS, the 71st is a schematic diagram of Figure 6, and Figure 8 is a diagram of another embodiment according to the present invention.
It is. 5...Chemical plating tank, 6...-Kimetsu beef rights, 7...Basket%8...Anode (electrodynamic &). Patent seller Uemura Kogyo Co., Ltd. Agent Patent attorney Tadaka Omori

Claims (1)

[Claims] (1) A printed circuit board of m number was placed in a basket in a state of being stacked up and down, and the basket was immersed in a chemical plating bath to apply chemical plating to the printed circuit board. After that, an electrode for electroplating is interposed between the sil & I between the printed circuit boards in the basket, and the first step is to put the printed circuit board in the basket in the state of the home appliance and electroplating. L
A method for primary steel plating of printed circuit boards based on the 411th image of performing step 11. (11＠ A cage that stores a number of printed circuit boards in a state where they are stacked up and down with one space between them. Chemical biopsies and electroplating for primary copper plating that can be immersed in the cage. A device for primary copper plating of a printed circuit board, which is capable of working with the electroplating electrode interposed between the print 1 and the diaphragm.