JPS58140636U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS58140636U
JPS58140636U JP1982036595U JP3659582U JPS58140636U JP S58140636 U JPS58140636 U JP S58140636U JP 1982036595 U JP1982036595 U JP 1982036595U JP 3659582 U JP3659582 U JP 3659582U JP S58140636 U JPS58140636 U JP S58140636U
Authority
JP
Japan
Prior art keywords
semiconductor element
solder material
semiconductor equipment
heat sink
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982036595U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6344991Y2 (2
Inventor
明 山岸
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982036595U priority Critical patent/JPS58140636U/ja
Publication of JPS58140636U publication Critical patent/JPS58140636U/ja
Application granted granted Critical
Publication of JPS6344991Y2 publication Critical patent/JPS6344991Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP1982036595U 1982-03-16 1982-03-16 半導体装置 Granted JPS58140636U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982036595U JPS58140636U (ja) 1982-03-16 1982-03-16 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982036595U JPS58140636U (ja) 1982-03-16 1982-03-16 半導体装置

Publications (2)

Publication Number Publication Date
JPS58140636U true JPS58140636U (ja) 1983-09-21
JPS6344991Y2 JPS6344991Y2 (2) 1988-11-22

Family

ID=30048019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982036595U Granted JPS58140636U (ja) 1982-03-16 1982-03-16 半導体装置

Country Status (1)

Country Link
JP (1) JPS58140636U (2)

Also Published As

Publication number Publication date
JPS6344991Y2 (2) 1988-11-22

Similar Documents

Publication Publication Date Title
JPS58140636U (ja) 半導体装置
JPS602848U (ja) 半導体装置
JPS5839058U (ja) 半導体装置
JPS59191744U (ja) 半導体装置
JPS5933254U (ja) 半導体装置
JPS58155836U (ja) 半導体装置
JPS5991747U (ja) 半導体装置
JPS58158453U (ja) 半導体装置
JPS58155838U (ja) 半導体装置
JPS5887359U (ja) 半導体装置
JPS59191741U (ja) 半導体装置
JPS61240U (ja) 半導体装置
JPS6142853U (ja) 樹脂封止型半導体装置
JPS605147U (ja) 半導体装置
JPS5887339U (ja) 半導体装置
JPS6061729U (ja) 半導体装置
JPS58155849U (ja) 半導体装置
JPS60130644U (ja) 半導体装置
JPS58155835U (ja) 半導体装置
JPS5844844U (ja) 半導体装置
JPS5958941U (ja) 半導体装置
JPS5829836U (ja) 半導体装置
JPS60151132U (ja) 半導体装置
JPS58153458U (ja) 半導体装置
JPS5877058U (ja) 半導体装置