JPS602848U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS602848U
JPS602848U JP1983093919U JP9391983U JPS602848U JP S602848 U JPS602848 U JP S602848U JP 1983093919 U JP1983093919 U JP 1983093919U JP 9391983 U JP9391983 U JP 9391983U JP S602848 U JPS602848 U JP S602848U
Authority
JP
Japan
Prior art keywords
bonding wire
lead
semiconductor pellet
semiconductor equipment
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983093919U
Other languages
English (en)
Inventor
青野　勉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP1983093919U priority Critical patent/JPS602848U/ja
Publication of JPS602848U publication Critical patent/JPS602848U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来および本考案の半導体装置の構造を説明す
る断面図、第２図は本考案の効果を説明する特性図であ
る。 １はリード、２はパッド部分、３は半導体ペレット、４
はボンディングワイヤー、５は樹脂層である。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード上に固着された半導体ベレットと該半導体ペレッ
    トの電極と隣接するリードの接続をするボンティングワ
    イヤーと前記半導体ベレットボンディングワイヤーおよ
    びリードの一部を封止する樹脂層とを具備する半導体装
    置に於いて、前記ボンディングワイヤーをアルミニウム
    に１ｏｐｐｍ以上のニッケルあるじ）は銅等の重金属を
    添加したもので構成して成る半導体装置。
JP1983093919U 1983-06-17 1983-06-17 半導体装置 Pending JPS602848U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983093919U JPS602848U (ja) 1983-06-17 1983-06-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983093919U JPS602848U (ja) 1983-06-17 1983-06-17 半導体装置

Publications (1)

Publication Number Publication Date
JPS602848U true JPS602848U (ja) 1985-01-10

Family

ID=30225079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983093919U Pending JPS602848U (ja) 1983-06-17 1983-06-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS602848U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160963U (ja) * 1987-04-06 1988-10-20
JPH0351049U (ja) * 1989-09-27 1991-05-17
JPH04184945A (ja) * 1990-11-20 1992-07-01 Hitachi Chem Co Ltd 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5616647A (en) * 1979-07-21 1981-02-17 Heraeus Gmbh W C Aluminum alloy super fine conductive wire
JPS5956737A (ja) * 1982-09-25 1984-04-02 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5616647A (en) * 1979-07-21 1981-02-17 Heraeus Gmbh W C Aluminum alloy super fine conductive wire
JPS5956737A (ja) * 1982-09-25 1984-04-02 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用Ａｌ線

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63160963U (ja) * 1987-04-06 1988-10-20
JPH0351049U (ja) * 1989-09-27 1991-05-17
JPH04184945A (ja) * 1990-11-20 1992-07-01 Hitachi Chem Co Ltd 半導体装置

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