JPS58158A - Packaging method by ultrasonic welding - Google Patents
Packaging method by ultrasonic weldingInfo
- Publication number
- JPS58158A JPS58158A JP56098548A JP9854881A JPS58158A JP S58158 A JPS58158 A JP S58158A JP 56098548 A JP56098548 A JP 56098548A JP 9854881 A JP9854881 A JP 9854881A JP S58158 A JPS58158 A JP S58158A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin base
- base
- case
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W95/00—Packaging processes not covered by the other groups of this subclass
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は超音波溶着によるノくツケージ方法に関する。[Detailed description of the invention] The present invention relates to a bolt cage method using ultrasonic welding.
ハイブリッドＩＣやリレー等の電子部品の中には基板や
端子蝉が実装された樹脂ベースに樹脂ケースを被せてパ
ッケージされたものがある。又このパッケージ手段とし
て従来の接着剤固定に変９近時超音波溶着が用いられる
場合が多い。更に、置数性を嵐くするため樹脂ベースと
樹脂ケースの溶着は樹脂ベースを複数個連結片によ〉接
続され九連結部品として与えられる場合も多い。Some electronic components such as hybrid ICs and relays are packaged by covering a resin base with a board and terminals mounted on it with a resin case. Moreover, as a packaging means, ultrasonic welding is often used in place of conventional adhesive fixing. Furthermore, in order to simplify the arrangement, the resin base and the resin case are often welded together by connecting a plurality of resin bases with a connecting piece to form nine connecting parts.
このような連結部品として形成された各樹脂ベースに樹
脂ケースを載置しその談合部を超音波溶着してパッケー
ジする場合、従来で紘所望樹脂ケースの溶着時に他の樹
脂ベースが自由な状態にあった丸め共振や反射等を鐙ζ
し大きな超音波歪を生じてリード總断線や樹脂ベースの
クラック勢が発生することがあっ九。When packaging a resin case by placing a resin case on each resin base formed as a connecting part and ultrasonically welding the rigging parts, conventionally, when the desired resin case is welded, the other resin bases are left in a free state. Stirrup ζ to eliminate rounded resonance, reflection, etc.
This can cause large ultrasonic distortion, leading to lead breakage and cracking of the resin base.
本発明はこの従来欠点を解決するもので、この目的は複
数個の樹脂ベースが連結片により接続された連結部品を
有し、受は台上に支持され九ａｍベースに対し樹脂ケー
スを載置してその接合部を超音波溶着してなるパッケー
ジ方法において、所望の前記樹脂ケースを前記樹脂ベー
スに超音波溶着している際倫の前記樹脂ベースが押え部
材によシ前記受は台に押圧されていることを特徴とし九
超音波によるパッケージ方法によシ違戚できる。The present invention is intended to solve this conventional drawback, and its purpose is to have a connecting part in which a plurality of resin bases are connected by a connecting piece, and the receiver is supported on a stand and the resin case is placed on the nine-piece base. In a packaging method in which the desired resin case is ultrasonically welded to the resin base, the resin base is pressed by a holding member and the receiver is pressed by a stand. It is characterized by nine different ultrasonic packaging methods.
以下本発明の一実施例を添付図面により説明する。An embodiment of the present invention will be described below with reference to the accompanying drawings.
纂１図は本パッケージ方法を説明する九めの側面図で、
ｌは受は台、２は樹脂ペース、３は樹脂ベース２に埋込
されたリード線、４は各樹脂ベース２のリード線３を一
連に接続した連結片、５は樹脂ケース、６は超音波を与
えるホーンヘッド、７は金属等からなる押え部材である
。樹脂ベース２はリード線３を介して連結片４によυ−
一連されることによシ複数個同一平面上に位置した連結
部品として形成されている。そして、この連結部品を受
は台１のスリット内にリード＃ｉ！３および連結月番を
入れ受は台１上面に樹脂ベース２を載せてセットし、且
つ樹脂ケース５を樹脂ペース２上にＩ！ｔＬ九状態で所
望樹脂ケース５上にホーンヘット６を当てて超音波振動
を与えることによりその接合部が溶融し溶着が行なわれ
る。本パッケージ方法ではこの際に他の樹脂ベース２を
樹脂ケース５を介して押え部材７で受は台１上に押圧し
た点を特徴としている◎このように所望樹脂ケース浴着
時に他の樹脂ベースを押圧した結果、嬉１ｗｉのム部分
を拡大し九第ｇｇの如く、従来（他の樹脂ベースが自由
状態）ではＩＩｌ生していたリード線３の断線（Ｘ印で
示す）中樹脂ベース２或は基板８のクラックがほとんど
なくなった。Figure 1 is the ninth side view explaining this packaging method.
1 is a stand for the receiver, 2 is a resin paste, 3 is a lead wire embedded in the resin base 2, 4 is a connecting piece connecting the lead wires 3 of each resin base 2 in series, 5 is a resin case, and 6 is a super A horn head 7 for applying sound waves is a holding member made of metal or the like. The resin base 2 is connected to the connecting piece 4 via the lead wire 3.
By connecting them in series, they are formed as a plurality of connected parts located on the same plane. Then, this connecting part is connected to the lead #i in the slit of the base 1! 3 and the connection month number, set the resin base 2 on the top of the stand 1, and place the resin case 5 on the resin paste 2! In the tL9 state, the horn head 6 is placed on the desired resin case 5 and ultrasonic vibrations are applied thereto, thereby melting the joint and performing welding. This packaging method is characterized in that at this time, the other resin base 2 is pressed onto the base 1 by the holding member 7 through the resin case 5.In this way, when the desired resin case is attached, the other resin base As a result of pressing , the part of the resin base 2 is enlarged, and as shown in the ninth gg, the lead wire 3 is broken (indicated by an Or, the cracks in the substrate 8 almost disappeared.
陶、基板８はハイブリッドＩＣ用のセライック基板であ
る。The ceramic substrate 8 is a ceramic substrate for a hybrid IC.
以上の本発明によれば超音波連着時の歪による断線やク
ラックを肪ぐことができ、高信頼度の電 −子部品を得
ることができる・According to the present invention described above, it is possible to reduce wire breakage and cracks caused by distortion during continuous ultrasonic waves, and it is possible to obtain highly reliable electronic components.
第１図は本発明に係るパッケージ方法を説明する断面図
、菖２図は第１図の部分拡大断面図である０
〔符号の説明〕
１・・・・・・・・・受は台
２・・・・・・・・・１１？−ス
４・・・・・・・・・連結片
５・・・・・・・・・樹脂ケース
６・・・・・・・・・ホー７へ、）’
７・・・・・・・・・押え部材Fig. 1 is a sectional view for explaining the packaging method according to the present invention, and Fig. 2 is a partially enlarged sectional view of Fig. 1.・・・・・・・・・11? - Space 4...Connection piece 5...Resin case 6...To hose 7)' 7......・・Presser member
Claims (1)
を有し、受は台上に支持された樹脂ベースに対し樹脂ケ
ースを載置してその接合部を超音波溶着してなるパッケ
ージ方法において、所望の前記樹脂ケースを前記樹脂ベ
ースに超音波溶着している際他の前記樹脂ベースが押え
部材により前記受は台に押圧されていることを特徴とし
た超音波溶着によるパッケージ方法。A packaging method in which a plurality of resin bases are connected by connecting pieces and has nine connecting parts, and the receiver is a resin case supported on a table, and a resin case is placed on the resin base and the joints are ultrasonically welded. . A packaging method by ultrasonic welding, characterized in that while the desired resin case is being ultrasonically welded to the resin base, the other resin base is pressed against the stand by a pressing member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56098548A JPS58158A (en) | 1981-06-25 | 1981-06-25 | Packaging method by ultrasonic welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56098548A JPS58158A (en) | 1981-06-25 | 1981-06-25 | Packaging method by ultrasonic welding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58158A true JPS58158A (en) | 1983-01-05 |
Family
ID=14222735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56098548A Pending JPS58158A (en) | 1981-06-25 | 1981-06-25 | Packaging method by ultrasonic welding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05329236A (en) * | 1992-06-01 | 1993-12-14 | Bridgestone Corp | Golf club head |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919901A (en) * | 1972-05-18 | 1974-02-21 |
-
1981
- 1981-06-25 JP JP56098548A patent/JPS58158A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919901A (en) * | 1972-05-18 | 1974-02-21 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05329236A (en) * | 1992-06-01 | 1993-12-14 | Bridgestone Corp | Golf club head |
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