JPS58169993A - Part mounting method - Google Patents
Part mounting methodInfo
- Publication number
- JPS58169993A JPS58169993A JP5120182A JP5120182A JPS58169993A JP S58169993 A JPS58169993 A JP S58169993A JP 5120182 A JP5120182 A JP 5120182A JP 5120182 A JP5120182 A JP 5120182A JP S58169993 A JPS58169993 A JP S58169993A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- components
- circuit board
- mounting method
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
発明の対象
本発明はプリント基板、セラミック基板に部品をはんだ
付する方法に係り、特に基板の両面ｌこ実装される部品
を、同時にリフローする工法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Object of the Invention The present invention relates to a method for soldering components to a printed circuit board or a ceramic substrate, and particularly to a method for simultaneously reflowing components to be mounted on both sides of a circuit board.
従来技術
従来、プリント基板のはんだ付パターン上にはんだペー
ストを印刷し、部品を実装後、加熱リフローするはんだ
付方式において、基板の両面に部品を実装する場合は、
まず一方の実装面のりフローはんだ付を行い、この面の
部品を高温はんだあるいは接着剤等により固定後、この
面を下にして他の実装面をリフ０−するという方式が一
般ｉこ使用されていた。Conventional technology Conventionally, in the soldering method where solder paste is printed on the soldering pattern of a printed circuit board, the components are mounted, and the components are heated and reflowed, when components are mounted on both sides of the circuit board,
A commonly used method is to first perform glue flow soldering on one mounting surface, fix the components on this surface with high-temperature solder or adhesive, and then refrigerate the other mounting surface with this surface facing down. was.
上記方式ではりフロ一作業が２回となり、作業−［種数
の増大と共に、はんだの再溶融によるはんだ付欠陥の増
加、あるいは基板、部品が２回の熱賀荷をうけることか
らくる特性劣化等のデメリットを持っていた。With the above method, the gluing flow process is performed twice, and as the number of types increases, the number of soldering defects increases due to remelting of the solder, or the characteristics deteriorate due to the board and components being subjected to hot stress twice. It had disadvantages such as.
発明の目的
本発明は前述した様な基板の両面に実装される部品を同
時にリフロー接続し、かつはんだ付欠陥の発生しない効
率的なはんだ付方式を提供すること２目的とする。OBJECTS OF THE INVENTION The two objects of the present invention are to provide an efficient soldering method in which components mounted on both sides of a board as described above can be reflow-connected at the same time, and no soldering defects occur.
発明のＷｉｇ括的説明
本発明はりフロ一時にド側吉なる面に実装されるｓＩＳ
′ｉ！Ｉを、熱収ａ特性を有する物質であらかじめ固定
し、この状態で加熱リフローした時の熱収砿特性・２利
用ｒることにより、部品の落下と、部品リードのつき等
により発生するはんだ付欠陥を防止することを特徴とし
た両面実装基板の同時リフロ一方式である。Wig's comprehensive explanation of the invention The present invention provides an sIS to be implemented on the beam surface at the same time.
'i! By fixing I in advance with a material that has heat absorption properties and using heat absorption properties when reflowing in this state, soldering that occurs due to falling parts and sticking of component leads can be avoided. This is a simultaneous reflow method for double-sided mounting boards that prevents defects.
発明の実施例
第１〜第４図を用いて本発明によるはんだ付方式の一実
施例を説明する。Embodiment of the Invention An embodiment of the soldering method according to the present invention will be described with reference to FIGS. 1 to 4. FIG.
プリント基板ｌ上の部品が搭載されるパターン２には、
第１図に示す様に、印刷等の手段によりはんだペースト
３が供給されている。このはんだペースト３上に第２図
に示すごとく熱収縮特性を持つ粘着性物質５を下面に塗
布した部品４を搭載した後、第３図に示したごとく基板
１を反転して基板Ｂ面を上面としてはんだペーストを印
刷し、部品６を搭載する。この様に基板Ｂ面を上方とし
、粘着性熱収縮物質５で保持された部品４が下面となる
状態で雰囲気炉等の加熱手段を用いはんだを門融するこ
とにより、基板１のＡ、８両面に実装された部品が同時
にリフロー可能となる。Pattern 2 on which components are mounted on the printed circuit board l is
As shown in FIG. 1, solder paste 3 is supplied by means such as printing. After mounting a component 4 coated with an adhesive substance 5 having heat-shrinkable properties on the bottom surface on the solder paste 3 as shown in FIG. 2, the board 1 is turned over as shown in FIG. Solder paste is printed as the top surface, and component 6 is mounted. In this way, by melting the solder using a heating means such as an atmospheric furnace with the board B side facing upward and the component 4 held by the adhesive heat-shrinkable material 5 facing downward, solder can be melted using heating means such as an atmospheric furnace. Components mounted on both sides can be reflowed at the same time.
下方にある基板Ａ面に実装された部品４は熱収縮性粘着
物質により、リフローまでの聞落下することなく保持さ
れる。さらにリフロ一時の熱で収縮することにより第４
図に示す様に、はんだペースト３が溶融時に３′のごと
くその体積を減少させるのに追随して、体積を６′のご
とく減少させ部品４を基板面ｌ側に引張り、ペーストの
体積減少により発生する「はんだ付なし」等のはんだ付
欠陥の発生を防止する。The components 4 mounted on the lower side of the substrate A are held by the heat-shrinkable adhesive without falling until reflow. Furthermore, due to shrinkage due to the heat during reflow, the fourth
As shown in the figure, as the solder paste 3 decreases in volume as indicated by 3' when it melts, the volume decreases as indicated by 6' and the component 4 is pulled toward the board surface l side. Prevents soldering defects such as "no soldering" from occurring.
粘着性熱収縮物質の収縮率は、はんだペーストの体積減
少率に応じて設定されるべきで、その材質は接着剤自身
に熱収縮性を持たせる方法あるいは市販されている熱収
縮プラスチック（ヒシチーーブ等）に接”層性を持たせ
る方法でも可能である。The shrinkage rate of the adhesive heat-shrink material should be set according to the volume reduction rate of the solder paste. ) can also be made to have tangential properties.
又、本実施例では熱収縮性物質を塗布した部品は、基板
の下面にのみ実装される例を引用したが、基板！１ｉｌ
ｉ９上面に実装される部品について塗布しても上述した
効果からはんだ付欠陥の発生を防止できる。Also, in this example, the parts coated with heat-shrinkable material are mounted only on the bottom surface of the board, but the board! 1il
Even if it is applied to components mounted on the upper surface of the i9, the above-mentioned effects can prevent soldering defects from occurring.
発明の効果
本発明によりプリント基板の両面に実装された部品を同
時１こリフローはんだ付ができると共にリフロ一時のは
んだペーストの体積減少に影響されることなく高品質の
はんだ付がＯＴ能となる。Effects of the Invention According to the present invention, parts mounted on both sides of a printed circuit board can be simultaneously reflow soldered, and high-quality soldering can be performed in OT without being affected by volume reduction of solder paste during reflow.
第１図乃至第４図は本発明に上る部品実装方“法を説明
するための図で、第１図はプリント板・のパターン上に
はんだペーストを塗布した工程を示す図、第２図はプリ
ント基板上に部品及び粘着性熱収縮物質を搭載する工程
を示す図、溝３図はプリント基板の裏面にも部品伎び粘
着性物質を搭載する工程を示す図、第４ｉ閾（ａ）及び
（ｂ）は、前記プリント基板のりフロー前及び後の状轢
をそれぞれ示す図である。
符号の説明
１・・・プリント基板 ２・・・部品搭載用パターン
３・・・はんだペースト ４・・・Ａ面側実装部品５・
・・粘着性熱収縮物質６・・Ｂ！酊ｆｌｌｌ＋実装部品
３′・・・リフロー後のはんだ1 to 4 are diagrams for explaining the component mounting method according to the present invention. A diagram showing the process of mounting components and an adhesive heat-shrinkable material on a printed circuit board, Groove 3 is a diagram showing a process of mounting components and an adhesive material on the back side of the printed circuit board, 4th threshold (a) and (b) is a diagram showing the conditions before and after the printed circuit board glue flow.Explanation of symbols 1...Printed board 2...Component mounting pattern 3...Solder paste 4... A side mounted parts 5・
...Adhesive heat shrinkable material 6...B! Full + mounted parts 3'...solder after reflow
Claims (1)
供給し、この位置に部品を搭載後加熱してリフローはん
だ付を行うはんだ付実装方式において、搭載部品とプリ
ント基板とを、はんだ付温度で収縮性を示す熱収縮性物
質で予め固定した後に、はんだ付を行うことを特徴とし
た部品実装方法。In the soldering mounting method, in which solder paste is supplied onto the component mounting pattern of the printed circuit board, the component is mounted at this position, and then heated and reflow soldered. A component mounting method characterized by performing soldering after fixing in advance with a heat-shrinkable material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5120182A JPS58169993A (en) | 1982-03-31 | 1982-03-31 | Part mounting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5120182A JPS58169993A (en) | 1982-03-31 | 1982-03-31 | Part mounting method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58169993A true JPS58169993A (en) | 1983-10-06 |
Family
ID=12880275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5120182A Pending JPS58169993A (en) | 1982-03-31 | 1982-03-31 | Part mounting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58169993A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068693A (en) * | 1983-09-26 | 1985-04-19 | 松下電器産業株式会社 | Method of producing printed circuit board |
| JPS61237494A (en) * | 1985-04-13 | 1986-10-22 | 松下電器産業株式会社 | Assembling of circuit board |
| JPS61251098A (en) * | 1985-04-27 | 1986-11-08 | 松下電器産業株式会社 | Assembly of chip type electronic component and circuit board |
| JPH01278091A (en) * | 1988-04-28 | 1989-11-08 | Uchihashi Estec Co Ltd | Soldering of electronic component |
| EP2403026A2 (en) | 2010-06-30 | 2012-01-04 | Kabushiki Kaisha Toyota Jidoshokki | Connection structure of elements and connection method |
-
1982
- 1982-03-31 JP JP5120182A patent/JPS58169993A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6068693A (en) * | 1983-09-26 | 1985-04-19 | 松下電器産業株式会社 | Method of producing printed circuit board |
| JPS61237494A (en) * | 1985-04-13 | 1986-10-22 | 松下電器産業株式会社 | Assembling of circuit board |
| JPS61251098A (en) * | 1985-04-27 | 1986-11-08 | 松下電器産業株式会社 | Assembly of chip type electronic component and circuit board |
| JPH01278091A (en) * | 1988-04-28 | 1989-11-08 | Uchihashi Estec Co Ltd | Soldering of electronic component |
| EP2403026A2 (en) | 2010-06-30 | 2012-01-04 | Kabushiki Kaisha Toyota Jidoshokki | Connection structure of elements and connection method |
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