JPS58195437U - Wedge for ultrasonic wire bonding - Google Patents

Wedge for ultrasonic wire bonding

Info

Publication number
JPS58195437U
JPS58195437U JP1982095033U JP9503382U JPS58195437U JP S58195437 U JPS58195437 U JP S58195437U JP 1982095033 U JP1982095033 U JP 1982095033U JP 9503382 U JP9503382 U JP 9503382U JP S58195437 U JPS58195437 U JP S58195437U
Authority
JP
Japan
Prior art keywords
wedge
wire bonding
ultrasonic wire
ultra
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982095033U
Other languages
Japanese (ja)
Inventor
隆 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1982095033U priority Critical patent/JPS58195437U/en
Publication of JPS58195437U publication Critical patent/JPS58195437U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の超音波ワイヤボンディング用のウェッジ
の外観図で、第２図はその先端部の拡大断面図である。 第３図は本考案のウェッジの先端、　部の拡大断面図、
第４図はその正面図である。第５図はボンディング時の
接合点の位置の分布を示す説明図である。 １・・・・・・ウェッジ、２・・・・・・ワイヤホール
ド用穴、３・・・・・・溶接部、４・・・・・・溝。FIG. 1 is an external view of a conventional wedge for ultrasonic wire bonding, and FIG. 2 is an enlarged sectional view of its tip. Figure 3 is an enlarged sectional view of the tip of the wedge of the present invention,
FIG. 4 is a front view thereof. FIG. 5 is an explanatory diagram showing the distribution of bonding point positions during bonding. 1...Wedge, 2...Wire holding hole, 3...Welded part, 4...Groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミニウムワイヤ等の極細線を超音波エネルギによっ
て被加工物に溶接するウェッジにおいて被加工物と当接
する溶接部の極細線供給側に、極細線を案内する溝を形
成したことを特徴とする超音波”ワイヤボンド用ウェッ
ジ。An ultrasonic wedge for welding an ultra-fine wire such as an aluminum wire to a workpiece using ultrasonic energy, in which a groove for guiding the ultra-fine wire is formed on the ultra-fine wire supply side of the welding part that comes into contact with the workpiece. ``Wedge for wire bonding.
JP1982095033U 1982-06-22 1982-06-22 Wedge for ultrasonic wire bonding Pending JPS58195437U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982095033U JPS58195437U (en) 1982-06-22 1982-06-22 Wedge for ultrasonic wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982095033U JPS58195437U (en) 1982-06-22 1982-06-22 Wedge for ultrasonic wire bonding

Publications (1)

Publication Number Publication Date
JPS58195437U true JPS58195437U (en) 1983-12-26

Family

ID=30227155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982095033U Pending JPS58195437U (en) 1982-06-22 1982-06-22 Wedge for ultrasonic wire bonding

Country Status (1)

Country Link
JP (1) JPS58195437U (en)

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