JPS58206635A - 高分子物品の放射応力解消法 - Google Patents

高分子物品の放射応力解消法

Info

Publication number: JPS58206635A
Authority: JP; Japan
Prior art keywords: polymer; stress; radiation; sheet; article
Prior art date: 1982-05-21
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP57122809A

Other languages

English (en)

Japanese (ja)

Other versions

JPS6412215B2 (2

Inventor

デビツド・シイ・フリツシユ

ウイルヘルム・ウイ−バ−

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Kollmorgen Technologies Corp

Original Assignee

Kollmorgen Technologies Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-05-21

Filing date

1982-07-12

Publication date

1983-12-01

1982-07-12 Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp

1983-12-01 Publication of JPS58206635A publication Critical patent/JPS58206635A/ja

1989-02-28 Publication of JPS6412215B2 publication Critical patent/JPS6412215B2/ja

Status Granted legal-status Critical Current

Links

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NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
General Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Treatments Of Macromolecular Shaped Articles (AREA)
Laminated Bodies (AREA)
Extrusion Moulding Of Plastics Or The Like (AREA)
Manufacture Of Macromolecular Shaped Articles (AREA)
Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Chemically Coating (AREA)

JP57122809A 1982-05-21 1982-07-12 高分子物品の放射応力解消法 Granted JPS58206635A (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US38093082A	1982-05-21	1982-05-21
US380930		1982-05-21

Publications (2)

Publication Number	Publication Date
JPS58206635A true JPS58206635A (ja)	1983-12-01
JPS6412215B2 JPS6412215B2 (2)	1989-02-28

Family

ID=23503001

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP57122809A Granted JPS58206635A (ja)	1982-05-21	1982-07-12	高分子物品の放射応力解消法

Country Status (12)

Country	Link
JP (1)	JPS58206635A (2)
AT (1)	AT387184B (2)
AU (1)	AU8577682A (2)
CH (1)	CH659428A5 (2)
DE (1)	DE3318487A1 (2)
FR (1)	FR2527216B2 (2)
GB (1)	GB2121058B (2)
IL (1)	IL68639A0 (2)
IT (1)	IT1172259B (2)
NL (1)	NL8301814A (2)
SE (1)	SE8302795L (2)
ZA (1)	ZA823981B (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2019137863A (ja) *	2018-02-13	2019-08-22	日信工業株式会社	熱可塑性樹脂組成物の製造方法及び熱可塑性樹脂組成物

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0204084A3 (en) *	1985-04-18	1988-10-12	The Firestone Tire & Rubber Company	Method for stress relaxation of polyurethanes
DE3609616A1 (de) *	1986-03-21	1988-01-07	Ciba Geigy Ag	Verfahren zur herstellung eines spannungsriss- und temperaturbestaendigen kunststoffs
DE102014105484B4 (de) *	2014-04-17	2017-09-07	Tmd Friction Services Gmbh	Verfahren und Vorrichtung zur thermischen Behandlung von Reibbelägen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5034066A (2) *	1973-07-26	1975-04-02

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
BE559150A (2) *	1956-07-18
GB1009654A (en) *	1962-08-17	1965-11-10	Union Carbide Corp	Improved method and apparatus for processing thermoplastics
US3409717A (en) *	1965-11-12	1968-11-05	Gen Electric	Process for improving resistance of thermoplastic materials to environmental stress-induced crazing, and product produced thereby
FR2014790A1 (en) *	1968-07-31	1970-04-17	Shoe & Allied Trades Res Ass	Thermal treatment for informing the properties of - synthetic polymer material especially microcellulor
GB1340709A (en) *	1970-06-10	1973-12-12	Du Pont	Process for producing crystalline copolyketone films and insulated electrical conductors
US3668057A (en) *	1970-06-10	1972-06-06	Du Pont	Laminar structures of metal and crystalline copolyketones and method of forming same
AT341791B (de) *	1972-08-14	1978-02-27	Nunc As	Verfahren zur modifizierung der oberflache von kunststoffgegenstanden
US3988408A (en) *	1974-09-16	1976-10-26	International Business Machines Corporation	Stabilization of printed circuit board core laminates
GB1581641A (en) *	1976-09-14	1980-12-17	Secr Defence	Methods of heat treatment of graft copolymer films
DE2854385C2 (de) *	1978-12-16	1982-04-15	Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt	Gedruckte Schaltung
DE3012889C2 (de) *	1979-04-30	1984-01-12	Kollmorgen Technologies Corp., 75201 Dallas, Tex.	Basismaterial für die Herstellung gedruckter Schaltungen
FR2477170B1 (fr) *	1980-02-28	1986-09-19	Toyo Boseki	Article moule a base de polyester ou de polyamide sature ayant des proprietes ameliorees et son procede de production
US4339303A (en) *	1981-01-12	1982-07-13	Kollmorgen Technologies Corporation	Radiation stress relieving of sulfone polymer articles

1982
- 1982-06-07 ZA ZA823981A patent/ZA823981B/xx unknown
- 1982-07-09 AU AU85776/82A patent/AU8577682A/en not_active Abandoned
- 1982-07-12 JP JP57122809A patent/JPS58206635A/ja active Granted
1983
- 1983-05-09 IL IL68639A patent/IL68639A0/xx unknown
- 1983-05-17 GB GB08313566A patent/GB2121058B/en not_active Expired
- 1983-05-18 SE SE8302795A patent/SE8302795L/xx not_active Application Discontinuation
- 1983-05-19 DE DE3318487A patent/DE3318487A1/de not_active Ceased
- 1983-05-20 AT AT0186183A patent/AT387184B/de active
- 1983-05-20 IT IT48340/83A patent/IT1172259B/it active
- 1983-05-20 NL NL8301814A patent/NL8301814A/nl not_active Application Discontinuation
- 1983-05-20 CH CH2785/83A patent/CH659428A5/de not_active IP Right Cessation
- 1983-05-24 FR FR8308492A patent/FR2527216B2/fr not_active Expired

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5034066A (2) *	1973-07-26	1975-04-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2019137863A (ja) *	2018-02-13	2019-08-22	日信工業株式会社	熱可塑性樹脂組成物の製造方法及び熱可塑性樹脂組成物

Also Published As

Publication number	Publication date
FR2527216A2 (fr)	1983-11-25
ATA186183A (de)	1988-05-15
IT1172259B (it)	1987-06-18
GB2121058B (en)	1985-08-29
SE8302795D0 (sv)	1983-05-18
NL8301814A (nl)	1983-12-16
DE3318487A1 (de)	1983-11-24
IT8348340A0 (it)	1983-05-20
JPS6412215B2 (2)	1989-02-28
IL68639A0 (en)	1983-09-30
AU8577682A (en)	1983-11-24
AT387184B (de)	1988-12-12
ZA823981B (en)	1983-06-29
FR2527216B2 (fr)	1987-02-20
SE8302795L (sv)	1983-11-22
GB2121058A (en)	1983-12-14
GB8313566D0 (en)	1983-06-22
CH659428A5 (de)	1987-01-30

Publication	Publication Date	Title
US4339303A (en)	1982-07-13	Radiation stress relieving of sulfone polymer articles
US4424095A (en)	1984-01-03	Radiation stress relieving of polymer articles
US4555414A (en)	1985-11-26	Process for producing composite product having patterned metal layer
US3606677A (en)	1971-09-21	Multilayer circuit board techniques
US4775444A (en)	1988-10-04	Process for fabricating multilayer circuit boards
CA1157622A (en)	1983-11-29	Polysulfone surfaced laminated blanks
US4810326A (en)	1989-03-07	Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US3884771A (en)	1975-05-20	Process of producing resinous board having a rough surface usable for firmly supporting thereon a printed circuit
US4110147A (en)	1978-08-29	Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits
JPS63103075A (ja)	1988-05-07	マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品
US3756891A (en)	1973-09-04	Multilayer circuit board techniques
US4786528A (en)	1988-11-22	Process for treating reinforced polymer composite
JPS63168077A (ja)	1988-07-12	プリント配線板の製造法
JPS6412215B2 (2)	1989-02-28
JPH032354B2 (2)	1991-01-14
US3793106A (en)	1974-02-19	Process for forming plastic parts having surfaces receptive to adherent coatings
JPH01308628A (ja)	1989-12-13	エポキシ樹脂から成る基材、および導体板の製法
JPS61219196A (ja)	1986-09-29	電子回路用プリント基板
JPH04233793A (ja)	1992-08-21	多層プリント回路及びその製造方法
JPH01124292A (ja)	1989-05-17	金属薄層付絶縁基板の製造法
JPS61179875A (ja)	1986-08-12	金属導体被膜形成方法
JPS6364393A (ja)	1988-03-22	プリント回路ボ−ドの製造方法
JPS6072293A (ja)	1985-04-24	アディティブ用基板並びにこれを用いた回路基板
JPH0448684A (ja)	1992-02-18	プリント配線板の製造法
JPS58128789A (ja)	1983-08-01	プリント基板の製法

JPS58206635A - 高分子物品の放射応力解消法 - Google Patents

Info

Links

Classifications

Landscapes

Applications Claiming Priority (2)

Publications (2)

Family

ID=23503001

Family Applications (1)

Country Status (12)

Cited By (1)

Families Citing this family (3)

Citations (1)

Family Cites Families (13)

Patent Citations (1)

Cited By (1)

Also Published As

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