JPS5820719B2 - Brazing alloy for ferrite bonding - Google Patents
Brazing alloy for ferrite bondingInfo
- Publication number
- JPS5820719B2 JPS5820719B2 JP1354181A JP1354181A JPS5820719B2 JP S5820719 B2 JPS5820719 B2 JP S5820719B2 JP 1354181 A JP1354181 A JP 1354181A JP 1354181 A JP1354181 A JP 1354181A JP S5820719 B2 JPS5820719 B2 JP S5820719B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- brazing alloy
- ferrite
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
- B23K35/268—Pb as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】
本発明はセラミックスの接着用ろ5合金に関し、特に耐
水性の良好なフェライト接着用のろう合金に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a filler alloy for bonding ceramics, and more particularly to a braze alloy for bonding ferrite with good water resistance.
セラミックス同志の接着にはガラスを用いることができ
る。Glass can be used to bond ceramics together.
ところが、セラミックスと金属、半金属等を接着する場
合は、ガラスでは熱膨張係数の相違に対応できず、又他
に適当な接着手段が無かったため、従来上として熱硬化
性樹脂が接着剤として使用されてきた。However, when bonding ceramics to metals, metalloids, etc., thermosetting resins have traditionally been used as adhesives because glass cannot cope with the differences in thermal expansion coefficients and there are no other suitable bonding methods. It has been.
しかしながら、一般に用いられる熱硬化性樹脂接着剤は
機椋的衝撃に対する強度が小さく、又、温度−強度特性
において約80°C以上で急激に強度が低下する欠点を
有している。However, commonly used thermosetting resin adhesives have the disadvantage that their strength against mechanical impact is low, and their temperature-strength characteristics rapidly decrease at temperatures above about 80°C.
このため、例えば超音波洗浄装置の組立においてフェラ
イト振動子を金属製振動板に熱硬化性樹脂接着剤で接着
したものは長時間連続して使用したり、長期間使用して
いるうちに接着面で剥離し、該振動子が振動板から脱落
する欠点が時々見られた。For this reason, for example, when assembling an ultrasonic cleaning device, if a ferrite vibrator is bonded to a metal diaphragm with a thermosetting resin adhesive, it may be used continuously for a long period of time, or the adhesive surface may The defect that the vibrator sometimes peeled off and fell off the diaphragm was observed.
近年、セラミック上で熔融乃至半熔融状態の半田に振動
を与えた後、該半田を凝固すると、該半田がセラミック
スに強固に接着することが見出され、ガラス又はセラミ
ックスに対する半田付は方法として提案された。In recent years, it has been discovered that when molten or semi-molten solder is vibrated on ceramics and then solidified, the solder firmly adheres to the ceramics, and soldering to glass or ceramics has been proposed as a method. It was done.
(特公昭48−12850号公報)この方法によれば樹
脂接着剤による接着の欠点を解消でき、接着の信頼性が
大きく向上することが期待できる。(Japanese Patent Publication No. 48-12850) According to this method, the drawbacks of adhesion using resin adhesives can be overcome, and it is expected that the reliability of adhesion will be greatly improved.
その後、接着性を改良した種々の半田組成(以下ろう合
金という)が提案された。Subsequently, various solder compositions (hereinafter referred to as braze alloys) with improved adhesive properties were proposed.
代表的なろう合金はPb−8n−Zn合金である(例え
ば特公昭48−847号公報、同45−1739号公報
)。A typical brazing alloy is a Pb-8n-Zn alloy (for example, Japanese Patent Publication No. 48-847 and Japanese Patent Publication No. 45-1739).
この合金は従来のpb −8n系半田に亜鉛を添加して
、酸化物に対する濡れ性を改善して接着力の向上を図っ
た点に特徴を有するものである。This alloy is characterized in that zinc is added to conventional PB-8N solder to improve wettability to oxides and improve adhesive strength.
ところが、このPb−8n−Zn合金により振動板にフ
ェライト振動子を取付けたものも、長期間使用している
とまれに振動子が脱落することがあり、このためPb−
8n−Zn合金の接着力を更に改善する必要があった。However, even when using this Pb-8n-Zn alloy with a ferrite resonator attached to the diaphragm, the resonator may occasionally fall off after long-term use.
There was a need to further improve the adhesion of the 8n-Zn alloy.
本発明者はこのような要請に応え、既に錫1〜10重量
係、亜鉛0.5〜5重量係、ゲルマニウム0.1〜1.
5重量係、残部鉛からなるろう合金を開発した。In response to such requests, the present inventor has already developed tin 1-10 weight ratio, zinc 0.5-5 weight ratio, germanium 0.1-1.
We have developed a brazing alloy consisting of 5 parts by weight and the balance being lead.
このろう合金はPb−8n−Zn合金に比べ接着力が著
るしく向上し、セラミックスとろう合金との接着界面で
の剥離、脱落の問題を全く解消した。This brazing alloy has significantly improved adhesive strength compared to the Pb-8n-Zn alloy, completely eliminating the problem of peeling and falling off at the adhesive interface between the ceramic and the brazing alloy.
しかしながら、上記のようなろう合金で接着した物品が
高湿度の環境下で使用されることを考慮しておく必要が
ある。However, it must be taken into account that articles bonded with braze alloys such as those described above will be used in a high humidity environment.
即ち、セラミックスとろう合金の接着力が高湿度下で低
下しないことが要請される。That is, it is required that the adhesive strength between the ceramic and the brazing alloy does not decrease under high humidity.
本発明は既に開発したPb −Sn −Zn −Ge合
金の耐水性を改善することを目的とする。The present invention aims to improve the water resistance of the already developed Pb-Sn-Zn-Ge alloy.
この目的を達成するため、本発明者は更に研究した結果
、微量の銅を添加することによりこの耐水性が著るしく
向上することを見出して本発明に到達した。In order to achieve this objective, the present inventor conducted further research and found that the water resistance was significantly improved by adding a small amount of copper, thereby achieving the present invention.
即ち本発明のろう合金は錫1−io重量係、亜鉛0.5
〜5重量%、ゲルマニウム0.1−1.5重量係、銅0
.05〜0.5重量係、残部鉛からなる。That is, the brazing alloy of the present invention has a weight ratio of 1-io of tin and 0.5 of zinc.
~5% by weight, germanium 0.1-1.5% by weight, copper 0
.. 05 to 0.5 by weight, the balance being lead.
本発明の基材となるPb−8n−Zn−Ge合金組成は
、80〜100°Cでの使用で充分強度を有するように
、300〜350℃程度で熔融乃至半熔融状態となるべ
く決められている。The composition of the Pb-8n-Zn-Ge alloy that is the base material of the present invention is determined to be in a molten or semi-molten state at about 300 to 350°C so that it has sufficient strength when used at 80 to 100°C. There is.
即ち、錫は多過ぎるとろう合金の融点が低くなり過ぎる
ので1〜10重量%とし、亜鉛は多過ぎると硬化が高く
なり過ぎるので0.5〜5重量%とした。That is, too much tin would lower the melting point of the brazing alloy, so it was set at 1 to 10% by weight, and too much zinc would cause hardening to be too high, so it was set at 0.5 to 5% by weight.
ゲルマニウムは接着力を増すための成分で0.1〜1.
5重量係が必要である。Germanium is a component to increase adhesive strength and has a content of 0.1 to 1.
5 Weighers are required.
本発明のろう合金はこのような基本合金に銅を0.05
〜0.5重量係添加したものである。The brazing alloy of the present invention is such a basic alloy with 0.05 copper added.
~0.5% by weight was added.
銅は0.05重重量風下では耐水性が殆んど改善されず
、0.5重量係以上とすると接着力を低下させるので好
ましくない。Copper is not preferable because its water resistance is hardly improved when the weight is 0.05 weight, and when the weight is 0.5 weight or more, the adhesive force decreases.
好ましい銅の添加量は0.1〜03重量%である。The preferred amount of copper added is 0.1 to 0.3% by weight.
鉛は錫、亜鉛、ゲルマニウム、銅の残りの分を占める。Lead makes up the balance with tin, zinc, germanium, and copper.
本発明のろう合金はアルミニウムとアンチモンの片方又
は両方を0.2重量係以下含有しても良い。The brazing alloy of the present invention may contain one or both of aluminum and antimony at a weight ratio of 0.2 or less.
これらの成分は接着力及び耐水性を若干改善する傾向が
ある。These ingredients tend to slightly improve adhesion and water resistance.
アルミニウム及びアンチモンをそれぞれ0.05重量係
程度含有せしめた上記pb −8n Zn Ge−
Cu合金は接着力、耐水性ともに良好であった。The above pb-8n Zn Ge- containing approximately 0.05 weight factor of aluminum and antimony each.
The Cu alloy had good adhesive strength and water resistance.
このようなろう合金は各成分を秤量して混合し溶解する
ことによって得られ、適当な形状に成形して実用に供す
ることができる。Such a brazing alloy is obtained by weighing, mixing, and melting each component, and can be molded into an appropriate shape for practical use.
例えば押出し、圧延、線引き等により棒状又は糸状に成
形すれば半田ごてを用いてどのような接着面へも対応で
きるし、接着面形状が平坦で一定している場合は、合金
を圧延して板状とし、所望の形状に打抜いて用いること
もできる。For example, if the alloy is formed into a rod or thread shape by extrusion, rolling, wire drawing, etc., it can be applied to any bonding surface using a soldering iron.If the shape of the bonding surface is flat and constant, rolling the alloy It can also be used by forming it into a plate shape and punching it into a desired shape.
以下に実施例を示す。Examples are shown below.
実施例
接着面が2cm×4cmのフェライト振動子を4確×1
0C1n×2−厚の短冊状SUS板に接着し、種種の条
件で割裂試験を行なった。Example: 4 x 1 ferrite vibrator with adhesive surface of 2 cm x 4 cm
It was adhered to a strip-shaped SUS plate of 0C1n x 2-thickness, and a splitting test was conducted under various conditions.
接着は先ず、フェライト振動子を300〜350℃に予
熱し、鉛91、錫5、亜鉛3、ゲルマニウム0.8、銅
0.2各重量係の棒状ろう合金を半田ごてで熔かしなが
ら該フェライトの接着面に塗布し、ろう合金が熔融した
状態で半田ごてに超音波振動を与え、後放冷してフェラ
イトの接着面にろう合金を被着した。For bonding, first preheat the ferrite vibrator to 300 to 350°C, and melt the bar-shaped brazing alloy with a weight ratio of 91 lead, 5 tin, 3 zinc, 0.8 germanium, and 0.2 copper with a soldering iron. The solder alloy was applied to the adhesive surface of the ferrite, and while the soldering iron was in a molten state, ultrasonic vibrations were applied to a soldering iron, and the soldering iron was then allowed to cool to adhere to the adhesive surface of the ferrite.
比較のため鉛91.2、錫5、亜鉛3、ゲルマニウム0
.8、各重量係のろう合金を用いて同様の試料を作成し
た。For comparison, lead: 91.2, tin: 5, zinc: 3, germanium: 0
.. 8. Similar samples were prepared using brazing alloys of various weights.
ろう合金を被着したこれらフェライト振動子は次いで鉛
40、錫60各重量係の半田を用いて前記SUS板に接
着し、このようにした試料を割裂試験に供した。These ferrite vibrators coated with the brazing alloy were then adhered to the SUS plate using solder of 40% lead and 60% tin, and the resulting samples were subjected to a splitting test.
割裂試験は図に示すようにフェライト振動子1を固定金
具2で挾んで固定し、SUS板3の一端に取付けた金具
を図示しない引張試験機で上方に引張り、ろう合金層4
0割裂時の引張力を測定するものである。In the splitting test, the ferrite vibrator 1 is clamped and fixed between the fixing metal fittings 2 as shown in the figure, and the metal fitting attached to one end of the SUS plate 3 is pulled upward using a tensile testing machine (not shown).
This is to measure the tensile force at the time of 0% tearing.
100kgで割裂しない場合はそのまま60秒間保持し
た。If the sample did not split at 100 kg, it was held for 60 seconds.
割裂試験は常温100℃の油中及び熱湯に10時間浸漬
後常温で行なった。The splitting test was conducted at room temperature after immersion in oil at room temperature of 100°C and in hot water for 10 hours.
割裂に至った試料は剥離状態を観察した。For samples that had split, the state of peeling was observed.
試験はそれぞれ10個の試料で行なった。The test was performed on 10 samples each.
結果を表に示す。常 温 100℃ 熱
湯浸漬後本発明例 強 度 割裂せず 90
〜100に9 割裂せず争1離状態
凝集破壊比較例 強 度 割裂
せず 90〜100に9 ’10〜100
に9剥離状態 凝集破壊
1 / 2〜1/3界面剥離表において凝集破壊と
はろう合金層4自体の降伏破壊である。The results are shown in the table. Example of the present invention after immersion in hot water at room temperature 100°C Strength No splitting 90
~9 out of 100, no split, no dispute
Comparative example of cohesive failure Strength No splitting 90 to 100 9'10 to 100
9 peeling state cohesive failure
In the 1/2 to 1/3 interfacial peeling table, cohesive failure is yield failure of the brazing alloy layer 4 itself.
又界面剥離とはフェライト振動子1とろう合金層4との
界面で剥離するもので1、l/2〜l/3界而剥離は全
接着面積の1/′2〜l/′3の界面が露出したことを
意味する。Also, interfacial peeling refers to peeling at the interface between the ferrite vibrator 1 and the brazing alloy layer 4, and peeling at the interface between 1/1/2 and 1/3 is 1/2 to 1/3 of the total adhesive area. means that it has been exposed.
この結果、銅を添加したろう合金は熱湯浸漬後も割裂せ
ず、接着力の低下が殆んど無いことが分る。The results show that the brazing alloy containing copper does not crack even after being immersed in hot water, and there is almost no decrease in adhesive strength.
従って本発明のろう合金は高湿度の環境下でも高い接着
力を維持でき、極めて信頼性が高い。Therefore, the brazing alloy of the present invention can maintain high adhesive strength even in a high humidity environment and is extremely reliable.
第1図は実施例に用いた割裂試験装置の正面図1第2図
は第1図の側面図である。
1・・・・・・フェライト振動子、2・・・・・・固定
金具、3・・・・・・SUS板、4・・・・・・ろう合
金層。FIG. 1 is a front view of the splitting test apparatus used in the example. FIG. 2 is a side view of FIG. 1. DESCRIPTION OF SYMBOLS 1... Ferrite vibrator, 2... Fixing metal fittings, 3... SUS plate, 4... Brazing alloy layer.
Claims (1)
ニウムo、i〜1.5重量係、銅0.05〜0.5重量
係、残部鉛からなるろう合金。 2 錫1〜10重量係、亜鉛0.5〜5重量係、ゲルマ
ニウムo、i〜1.5重量係、銅0.05〜0.5重量
係、アルミニウムとアンチモンの片方又は両方0.2重
量係以下、残部鉛からなるろう合金。[Claims] 1 A wax consisting of 1 to 10 parts by weight of tin, 0.5 to 5 parts by weight of zinc, 0 to 1.5 parts by weight of germanium, 0.05 to 0.5 parts by weight of copper, and the balance lead. alloy. 2 Tin 1-10 weight, zinc 0.5-5 weight, germanium o, i-1.5 weight, copper 0.05-0.5 weight, one or both of aluminum and antimony 0.2 weight Below, a brazing alloy consisting of the balance being lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1354181A JPS5820719B2 (en) | 1981-01-30 | 1981-01-30 | Brazing alloy for ferrite bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1354181A JPS5820719B2 (en) | 1981-01-30 | 1981-01-30 | Brazing alloy for ferrite bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57127593A JPS57127593A (en) | 1982-08-07 |
| JPS5820719B2 true JPS5820719B2 (en) | 1983-04-25 |
Family
ID=11836005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1354181A Expired JPS5820719B2 (en) | 1981-01-30 | 1981-01-30 | Brazing alloy for ferrite bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5820719B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59139165A (en) * | 1983-01-25 | 1984-08-09 | Matsushita Electric Ind Co Ltd | magnetic tape device |
| IT1264630B1 (en) * | 1993-06-30 | 1996-10-04 | Agip Spa | IMPROVED ANTI-SEIZE PROTECTION FOR JOINTS PARTICULARLY SUITABLE IN THE OIL FIELD |
| DE10237495A1 (en) * | 2002-04-22 | 2003-11-13 | Siemens Ag | Solder material used in the production of electrical/electronic components using Flip-Chip technology contains aluminum |
-
1981
- 1981-01-30 JP JP1354181A patent/JPS5820719B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57127593A (en) | 1982-08-07 |
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