JPS583060U - thick film circuit board - Google Patents

thick film circuit board

Info

Publication number
JPS583060U
JPS583060U JP9376281U JP9376281U JPS583060U JP S583060 U JPS583060 U JP S583060U JP 9376281 U JP9376281 U JP 9376281U JP 9376281 U JP9376281 U JP 9376281U JP S583060 U JPS583060 U JP S583060U
Authority
JP
Japan
Prior art keywords
electrode
circuit board
thick film
film circuit
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9376281U
Other languages
Japanese (ja)
Inventor
正信 渡辺
高井　輝男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9376281U priority Critical patent/JPS583060U/en
Publication of JPS583060U publication Critical patent/JPS583060U/en
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の厚膜回路基板の例を示す側面図、第２
図は、本考案による厚膜回路基板の一実施例の側面図で
ある。　　　　− １・・・基板、２・・・紫外線硬化樹脂、３・・・金属
層、４・・・硬質膜。Figure 1 is a side view showing an example of a conventional thick film circuit board;
FIG. 1 is a side view of an embodiment of a thick film circuit board according to the present invention. - 1... Substrate, 2... Ultraviolet curing resin, 3... Metal layer, 4... Hard film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミック基板上に、Ａｇ−Ｐｄ等の粉末を主成分とす
るペーストを印刷・焼成して電極を形成する厚膜回路基
板において、セラミック基板との接着強度が要求される
箇所に、第１の電極を印刷し、次にＡｇ含有率の大きい
第２の電極を第１の電極゛　　と重複する形で印刷後に
焼成し、回路全体の電極を構成し、はんだレジスト膜が
第２の電極と第１の電極の電極と第１の電極の１部を覆
うように構成されたことを特徴とする厚膜回路基板。In a thick film circuit board in which electrodes are formed by printing and firing a paste containing powder such as Ag-Pd as a main component on a ceramic substrate, a first electrode is placed at a location where adhesive strength with the ceramic substrate is required. Next, a second electrode with a high Ag content is printed and fired in a manner that overlaps with the first electrode, forming the electrode of the entire circuit, and a solder resist film is formed between the second electrode and the first electrode. 1. A thick film circuit board characterized in that the circuit board is configured to cover an electrode of the electrode and a part of the first electrode.
JP9376281U 1981-06-26 1981-06-26 thick film circuit board Pending JPS583060U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9376281U JPS583060U (en) 1981-06-26 1981-06-26 thick film circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9376281U JPS583060U (en) 1981-06-26 1981-06-26 thick film circuit board

Publications (1)

Publication Number Publication Date
JPS583060U true JPS583060U (en) 1983-01-10

Family

ID=29888730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9376281U Pending JPS583060U (en) 1981-06-26 1981-06-26 thick film circuit board

Country Status (1)

Country Link
JP (1) JPS583060U (en)

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