JPS583255A - Lead pin for integrated circuit device - Google Patents

Lead pin for integrated circuit device

Info

Publication number
JPS583255A
JPS583255A JP56101765A JP10176581A JPS583255A JP S583255 A JPS583255 A JP S583255A JP 56101765 A JP56101765 A JP 56101765A JP 10176581 A JP10176581 A JP 10176581A JP S583255 A JPS583255 A JP S583255A
Authority
JP
Japan
Prior art keywords
lead pin
pin
ring
lead
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56101765A
Other languages
Japanese (ja)
Inventor
Kenya Mori
森　賢也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP56101765A priority Critical patent/JPS583255A/en
Publication of JPS583255A publication Critical patent/JPS583255A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate a soldering work by engaging a silver solder ring having an inner diameter smaller than that of the thickness of a rod-shaped lead pin and a circular section with one end of the pin. CONSTITUTION:A silver solder 4 of circular section is bent to form a ring shape smaller than the thickness of a rod-shaped lead pin 3 to be engaged with the bore of the ring, and is engaged with the pin 3 by utilizing the rigidity of the ring 4. In this manner, the setting work of the solder with the pin can be facilitated.

Description

【発明の詳細な説明】 本発明は集積回路装置用リードピン（以下単にリードビ
ンと称す）の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in lead pins (hereinafter simply referred to as lead bins) for integrated circuit devices.

従来、第１図に示す如くメタライズしたセラミックス基
板１の上に粒状の銀ろう２とリードビン３とをセットし
てろう付していた。Conventionally, as shown in FIG. 1, granular silver solder 2 and a lead bottle 3 have been set and brazed on a metallized ceramic substrate 1.

しかしながら、上記のセットは作業が煩雑で能率の悪い
ものであった。However, the above-mentioned set was complicated and inefficient.

本発明は、上記事情に鑑みてなされたものでセット作業
能率のよいリードビンを提供せんと・するものである。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a lead bin with high efficiency in setting work.

本発＃４は、第１図に示す如く棒状リードピン３に、第
２図に示す如く断面円形の銀ろう４Ｉを曲げ力ロエによ
ってリードビン３の太さよりも小さい内径にした銀ろう
リング４を、ｍ３図に示す如く嵌合したリードビン３′
である。The present invention #4 includes a silver solder ring 4, which is made by bending a silver solder 4I with a circular cross section and has an inner diameter smaller than the thickness of the lead bin 3, as shown in FIG. Lead bin 3' fitted as shown in figure m3
It is.

本発明に於いて、断面円形の銀ろう−を曲げ加工によっ
て釧ろうリングにしたのｉｊ％　リードビン３に嵌合し
やすくするためであｐ、＊ううり／グ４の内径をリード
ピ／３の太さよりも小さくしたのは、−ろうリング４の
剛性によって鈑ろうリング４ｔ’Ｊ−ドピン３に嵌合固
定するためである。In the present invention, a silver solder with a circular cross section is bent into a solder ring to make it easier to fit into the lead pin 3. The reason why it is made smaller than the thickness is that the solder ring 4t' is fitted and fixed to the J-doping pin 3 by the rigidity of the solder ring 4.

次に本発明の効果を一層明瞭にするために実施例につい
て以下に述べる。Next, examples will be described below in order to further clarify the effects of the present invention.

〔実施例〕〔Example〕

直径０．１７ｗａのＡｇ　　２８９６Ｃｕ合金！５成ル
ｉｉｌ口うＳｔ曲げ加工によって、第２図に示す如く内
径０．４２Ｍの銀ろうりング４を成形し、これを、１Ｉ
Ｎ３図に示す如く直径０．４５　ａｍのリードビン３の
一端部に嵌合してリードビン３′とした。Ag 2896Cu alloy with a diameter of 0.17wa! A silver soldering ring 4 with an inner diameter of 0.42M is formed as shown in FIG.
As shown in Figure N3, it was fitted into one end of a lead bin 3 having a diameter of 0.45 am to form a lead bin 3'.

上記実施例で得たリードビン３′と従来のリードビア３
會使ってセラミックス＆ａｌ上にセットしてみたところ
、本発明によるリードピン３’によるセット時聞け、従
来のリードピン３に比しｂ以下であった。Lead bin 3' obtained in the above embodiment and conventional lead via 3
When I tried setting it on ceramics & aluminum using the lead pin 3' of the present invention, it was less than b compared to the conventional lead pin 3.

以上の説明で明らかなように本発明のリードピンは、従
来のリードピンに比しセット作業能率が−＜、またセッ
トの自動化の容易なもので従来のり−ドビンに砲って代
るものと言える。As is clear from the above description, the lead pin of the present invention has lower setting work efficiency than the conventional lead pin, and can be easily automated for setting, so it can be said to replace the conventional glue-dobin.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はセラミックス基板上に従来のリードビ／及び錯
ろうをセットした状態を示す側面図、第２図は本発明に
係る釧ろうリングの斜視図、第３図は不発明に係るリー
ドピンの斜視図である。 ３１・・・・・・本発明のリードピン、４・・・・・・
銀ろうリング。 出願人　　田中貴金槁工業株式会社 第１図 第２図　　第３図Fig. 1 is a side view showing a state in which a conventional lead pin/and interlocking solder is set on a ceramic substrate, Fig. 2 is a perspective view of a wire ring according to the present invention, and Fig. 3 is a perspective view of a lead pin according to the invention. It is a diagram. 31...Lead pin of the present invention, 4...
Silver wax ring. Applicant: Tanaka Kikinko Kogyo Co., Ltd. Figure 1 Figure 2 Figure 3

Claims (1)

【特許請求の範囲】[Claims] 棒状リードピンの一端部に、断面円形の銀ろうＳｔ−―
け加工によって前記リードピンの太さよりも小さい内径
にした優ろうリングを嵌合したことを特徴とする集積回
路装置用リードピン。A silver solder with a circular cross section is attached to one end of the rod-shaped lead pin.
1. A lead pin for an integrated circuit device, characterized in that a solder ring having an inner diameter smaller than the thickness of the lead pin is fitted therein by drilling.
JP56101765A 1981-06-30 1981-06-30 Lead pin for integrated circuit device Pending JPS583255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56101765A JPS583255A (en) 1981-06-30 1981-06-30 Lead pin for integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56101765A JPS583255A (en) 1981-06-30 1981-06-30 Lead pin for integrated circuit device

Publications (1)

Publication Number Publication Date
JPS583255A true JPS583255A (en) 1983-01-10

Family

ID=14309315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56101765A Pending JPS583255A (en) 1981-06-30 1981-06-30 Lead pin for integrated circuit device

Country Status (1)

Country Link
JP (1) JPS583255A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60194347U (en) * 1984-06-01 1985-12-24 福井鋲螺株式会社 lead pin
EP0780176A2 (en) 1995-12-13 1997-06-25 Hitachi, Ltd. Apparatus for and process of continuous casting

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154260A (en) * 1974-11-07 1976-05-13 Ngk Spark Plug Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154260A (en) * 1974-11-07 1976-05-13 Ngk Spark Plug Co

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60194347U (en) * 1984-06-01 1985-12-24 福井鋲螺株式会社 lead pin
EP0780176A2 (en) 1995-12-13 1997-06-25 Hitachi, Ltd. Apparatus for and process of continuous casting

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