JPS5837720B2 - Ryoumen Kairoban no Seizouhouhou - Google Patents
Ryoumen Kairoban no SeizouhouhouInfo
- Publication number
- JPS5837720B2 JPS5837720B2 JP15557175A JP15557175A JPS5837720B2 JP S5837720 B2 JPS5837720 B2 JP S5837720B2 JP 15557175 A JP15557175 A JP 15557175A JP 15557175 A JP15557175 A JP 15557175A JP S5837720 B2 JPS5837720 B2 JP S5837720B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- conductive adhesive
- sides
- conductor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 239000008188 pellet Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 本発明は両面回路板の製造方法に関するものである。[Detailed description of the invention] The present invention relates to a method for manufacturing double-sided circuit boards.
，電気機器を小型化するために、印刷回路板においてそ
の絶縁層の両面に電気回路を形成している。In order to miniaturize electrical equipment, electrical circuits are formed on both sides of the insulating layer of printed circuit boards.
このような電気回路の典型的な例は、両面銅箔印刷回路
にみられる。A typical example of such an electrical circuit is found in double-sided copper foil printed circuits.
従来のこの種両面回路板に見受けられる欠点の一つは、
両面の回路を信頼性ある接続で結合することができない
ことである。One of the drawbacks of conventional double-sided circuit boards of this type is that
The inability to connect circuits on both sides with a reliable connection.
従来、この接続ははと目金とスルーホールめっきによる
方法によっている。Traditionally, this connection has been made by grommet and through-hole plating methods.
前者のはと目金による方法では、絶縁層に小型のはと目
金を刺し通して、それぞれの回路の表面に、はと目金の
両端部をかしめて、接続する。In the former method using eyelets, a small eyelet is pierced through the insulating layer, and both ends of the eyelet are caulked and connected to the surface of each circuit.
この方法は、両方の絶縁層の表面にはと目金をかしめる
場合、必ずしも常に絶縁層の両面の回路を満足できる程
度に接続することにならないという欠点がある。This method has the disadvantage that when the surfaces of both insulating layers are caulked with eyelets, it does not always result in a satisfactory connection of the circuits on both sides of the insulating layers.
後者のスルーホールめっきによる方法は第１の導電部材
と絶縁層と第２の導電部材とを貫通して孔を形成する電
解工程を包合している。The latter through-hole plating method includes an electrolytic process of forming holes through the first conductive member, the insulating layer, and the second conductive member.
そして、真空堆積方法、１たは無電解方法さらには電気
めっき法により絶縁層を貫通している孔に導電性物質を
充填して、絶縁層の両面に形成されている導電部材間に
電気的接続部を形或する。Then, the holes penetrating the insulating layer are filled with a conductive substance by a vacuum deposition method, an electroless method, or an electroplating method, thereby creating an electrical connection between the conductive members formed on both sides of the insulating layer. Shape the connection.
しかしながら、この方法によれば、絶縁層に紙フェノー
ル基板を用いる場合、熱衝撃、湿度などの環境要因に対
して、金属と紙フェノール基板の熱膨脹率、吸水率の差
によるストレスのため、第１の導電部材と第２の導電部
材の接続が断線し、信頼性を十分確保できるとは言えな
いのが現状である。However, according to this method, when using a paper phenolic substrate for the insulating layer, stress due to the difference in thermal expansion coefficient and water absorption rate between metal and paper phenolic substrate due to environmental factors such as thermal shock and humidity causes At present, the connection between the first conductive member and the second conductive member is broken, and reliability cannot be sufficiently ensured.
さらに他の従来の接続方法としては、導電部材と絶縁層
とを貫通して設けた孔内に硬化性の導電性接着剤を押込
むことにより絶縁層の両面間に電気的接続部を形成する
方法がある。Yet another conventional connection method involves forming an electrical connection between both sides of the insulating layer by forcing a curable conductive adhesive into a hole that is formed through the conductive member and the insulating layer. There is a way.
これによれば、導電性接着材を押込んだのち、導電体の
片面に余剰分の接着剤を取除くための工程が必要である
。According to this, after pressing the conductive adhesive, a step is required to remove excess adhesive from one side of the conductor.
この工程は導電性接着剤を取り扱うため、回路板面の電
気回路配線間隙が狭い場合、あるいは、電気回路配線が
銅箔印刷配線板に形成されているように基板面より銅箔
面が凸面になっている場合など、導電性接着剤が回路板
面に残留してしオうという危険性がきわめて高く、絶縁
抵抗の低下、回路配線間の短絡事故を引き起こす釦それ
があった。This process uses a conductive adhesive, so it may be difficult to use when the gap between the electrical circuit wiring on the circuit board surface is narrow, or when the copper foil surface is convex than the board surface, such as when the electrical circuit wiring is formed on a copper foil printed wiring board. In some cases, the risk of conductive adhesive remaining on the circuit board surface is extremely high, causing a drop in insulation resistance and short-circuiting between circuit wires.
１た導電性接着剤を押込む際に空気を抱き込み、ボイド
が発生して、第１の導電部材と第２の導電部材との接続
が析線しやすいという欠点もある。Another disadvantage is that when the conductive adhesive is pressed in, air is trapped, creating voids, and the connection between the first conductive member and the second conductive member is likely to cause wire separation.
本発明は、絶縁層の両面に位置決めされた電気回路間に
信頼できない低品質の電気的接続部が形或されるという
従来技術の欠点を克服することを目的とする。The present invention aims to overcome the drawbacks of the prior art in that unreliable and low quality electrical connections are made between electrical circuits located on both sides of an insulating layer.
すなわち、導電部材と絶縁層とを貫通して設けた孔内に
、熱硬化性の固体導電性接着剤をペレットにして挿入す
ることにより、絶縁層の両面間に電気的接続部が形成さ
れる。That is, by inserting a pellet of thermosetting solid conductive adhesive into a hole provided through the conductive member and the insulating layer, an electrical connection is formed between both sides of the insulating layer. .
この接着剤のペレットを加熱溶融させて硬化させること
により、絶縁層の両面に配置した導体間に硬い電気接続
部が形成される。By heat-melting and curing the adhesive pellets, hard electrical connections are formed between the conductors disposed on both sides of the insulating layer.
以下、図面を用いてその一実施例を説明する。One embodiment will be described below with reference to the drawings.
第１図には、絶縁層１０の上面に第１の導電体１１が位
置決めされ、下面に第２の導電体１２が位置決めされて
いる。In FIG. 1, a first conductor 11 is positioned on the upper surface of an insulating layer 10, and a second conductor 12 is positioned on the lower surface.
回路板９が示されている。絶縁層１０は可撓性のもので
も硬いものでもよく、種々の材料から任意の形状に作る
ことができる。A circuit board 9 is shown. The insulating layer 10 can be flexible or rigid, and can be made from a variety of materials and in any shape.
この回路板９には、第１の導電体１１と絶縁層１０と第
２の導電体１２とを貫通して円形の孔１４．１４’が設
けられている。This circuit board 9 is provided with a circular hole 14 , 14 ′ passing through the first conductor 11 , the insulating layer 10 and the second conductor 12 .
第２図には第１の導電体１１と第２の導電体１２とを電
気的に接続する第１段階の工程が示してある。FIG. 2 shows the first step of electrically connecting the first conductor 11 and the second conductor 12. As shown in FIG.
筐ず、回路板９を、比較的平らで、接着剤との剥離性の
よいプレートヒータ１８上に置く。The housing and circuit board 9 are placed on a plate heater 18 that is relatively flat and has good peelability from the adhesive.
このプレートヒータとしては、ステンレススチロール製
のプレートヒータの表面を四弗化エチレンなどで被覆し
たものを使用すればよい。As this plate heater, a plate heater made of stainless steel whose surface is coated with tetrafluoroethylene or the like may be used.
次に潜在硬化剤を含む熱硬化性の固体導電性接着剤８，
８′を孔１４．１４’にそれぞれ挿入する。Next, a thermosetting solid conductive adhesive containing a latent curing agent 8,
8' into holes 14 and 14', respectively.
このような接着剤としてはんだ状エポキシ接着剤がある
。Such adhesives include solder-like epoxy adhesives.
その配合の一例を示すと、エポキシ樹脂（分子量４００
）：１００重量部、４，４′−メチレンジアニリン：２
９重量部、銀粉末：５０重量部、シリカ（非圧縮）１０
重量部である。An example of its formulation is epoxy resin (molecular weight 400
): 100 parts by weight, 4,4'-methylene dianiline: 2
9 parts by weight, silver powder: 50 parts by weight, silica (uncompressed) 10
Parts by weight.
これを低温度で加熱溶融し、棒状の鋳型に流し込むこと
によって、はんだ状エポキシ接着剤を製造することがで
きる。A solder-like epoxy adhesive can be manufactured by heating and melting this at a low temperature and pouring it into a rod-shaped mold.
１た、はんだ状エポキシ樹脂と同様に、エポキシ樹脂、
硬化剤および変性剤を混合し固化させて得た半硬化状態
の粉末を圧搾して、種々の形状や大きさのペレットとし
てもよい。1. Similarly to solder-like epoxy resin, epoxy resin,
A semi-hardened powder obtained by mixing and solidifying a curing agent and a modifier may be pressed to form pellets of various shapes and sizes.
そしてこれらペレットに可撓性付与剤を添加する−こと
も可能である。It is also possible to add a flexibility imparting agent to these pellets.
導電性接着剤８，８′を孔１４，１４’にそれぞれ挿入
する方法は種々のものから選択して使用できる。Various methods can be selected for inserting the conductive adhesives 8, 8' into the holes 14, 14', respectively.
導電性接着剤をあらかじめ適当な寸法に切断して釦いて
、それを挿入するか、あるいは挿入してから適当な寸法
に切断してもよい。The conductive adhesive may be cut to an appropriate size in advance and then inserted into the button, or the conductive adhesive may be inserted and then cut to an appropriate size.
そして、挿入は適尚な自動挿入装置を使用して行なえば
よい。Insertion may then be performed using a suitable automatic insertion device.
第３図には、回路板９を加熱炉に入れ、固体導電性接着
剤８，８′を加熱溶融硬化し、第１と第２の導電体１１
．１２間に第３の導電体１３．１３’を形或した両面回
路板を示す。In FIG. 3, the circuit board 9 is placed in a heating furnace, the solid conductive adhesives 8, 8' are heated, melted and hardened, and the first and second conductors 11 are bonded together.
．． 12 shows a double-sided circuit board with a third electrical conductor 13, 13' formed between them.
四弗化エチレンで被覆したステンレススチール製のプレ
ートヒータ板１８の板面温度を１０５゜Ｃに調整し、回
路板９をのせて２０分を要して約９５゜Ｃの加熱炉に通
す。The surface temperature of the stainless steel plate heater plate 18 coated with tetrafluoroethylene is adjusted to 105°C, and the circuit board 9 is placed on it and passed through a heating furnace at about 95°C for 20 minutes.
このとき導電性接着剤８，８′が溶融し、硬化する。At this time, the conductive adhesives 8, 8' are melted and hardened.
その過程において、プレートヒータ板１８に接している
回路板９の下面の温度を高くしてあるため、第２図のよ
うに配置した場合、導電性接着剤８，８′は下側の部分
から溶融するため、空気を抱き込むことなく、孔１４．
１４’内を導電性接着剤でそれぞれ満たすことができる
。During this process, the temperature of the lower surface of the circuit board 9 that is in contact with the plate heater plate 18 is increased, so when arranged as shown in FIG. Because of the melting, the holes 14.
14' can be filled with conductive adhesive.
ところで、第２図に示すように、プレートヒータ１８の
板面に凹部１９を設けておき、これを孔１４と位置合わ
せし、導電性接着剤８を挿入して溶融硬化させると、第
３図の導電体１３のように下面に釦いても凸部が形或さ
れるため、接続状態はきわめて良好なものとなる。By the way, as shown in FIG. 2, a recess 19 is provided on the plate surface of the plate heater 18, and when this is aligned with the hole 14 and the conductive adhesive 8 is inserted and melted and hardened, the recess 19 is formed as shown in FIG. Even if the button is placed on the bottom surface like the conductor 13, a convex portion is formed, so that the connection condition is extremely good.
以上のように、本発明の方法によれば、両面にそれぞれ
導電体を有する絶縁層に、導電体を含めて貫通する孔を
形成する工程、この貫通孔に熱硬化性の固体導電性接着
剤を挿入する工程、および挿入した固体導電性接着剤を
加熱溶融させて孔を満たしてから、硬化させ、絶縁層の
両面の導電体を接続する工程を有することを特徴とする
。As described above, according to the method of the present invention, there is a step of forming a hole penetrating the insulating layer including the conductor on both sides, and applying a thermosetting solid conductive adhesive to the through hole. and a step of heating and melting the inserted solid conductive adhesive to fill the hole and then curing it to connect the conductors on both sides of the insulating layer.
この方法によれば、絶縁層の両面に配置された電気回路
の導体を断線のない信頼性ある接続が可能である。According to this method, it is possible to reliably connect the conductors of the electric circuit arranged on both sides of the insulating layer without disconnection.
製造面においても、作業者は液状の樹脂配合物に１つわ
る、秤量、可使時間、注入量、毒性など、作業上いろい
ろ注意しなければならない事柄から解放され、作業性、
量産性が著しく改善される。In terms of manufacturing, workers are freed from the various issues that they have to pay attention to when working with liquid resin formulations, such as weighing, pot life, injection amount, and toxicity, which improves workability and improves workability.
Mass productivity is significantly improved.
さらには、この接続作業を機械化することもきわめて容
易であるという利点を有する。Furthermore, it has the advantage that it is extremely easy to mechanize this connection work.
第１図、第２図ち・よび第３図は、本発明にかかる両面
回路板の製造方法の一実施例を説明するための図である
。
８．８′・・・・・・固体導電性接着剤、１０・・・・
・・絶縁層、１１，１２・・・・・・導電体、１３，１
３’・・・・・導電体、１４．１４′・・・・・・孔。FIGS. 1, 2, and 3 are diagrams for explaining an embodiment of the method for manufacturing a double-sided circuit board according to the present invention. 8.8'...Solid conductive adhesive, 10...
...Insulating layer, 11, 12... Conductor, 13, 1
3'... Conductor, 14.14'... Hole.
Claims (1)
含めて貫通する孔を形戒する工程、前記貫通孔に熱硬化
性の固体導電性接着剤を挿入する工程、および前記挿入
した固体導電性接着剤を加熱溶融させて孔を満たしてか
ら、硬化させ、前記絶縁層の両面の導電体を接続する工
程を有することを特徴とする両面回路板の製造方法。1. A step of forming a through hole including the conductor in an insulating layer having conductors on both sides, a step of inserting a thermosetting solid conductive adhesive into the through hole, and a step of inserting the inserted solid conductive adhesive into the through hole. 1. A method for manufacturing a double-sided circuit board, comprising the steps of heating and melting an adhesive to fill the holes, and then curing the adhesive to connect conductors on both sides of the insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15557175A JPS5837720B2 (en) | 1975-12-24 | 1975-12-24 | Ryoumen Kairoban no Seizouhouhou |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15557175A JPS5837720B2 (en) | 1975-12-24 | 1975-12-24 | Ryoumen Kairoban no Seizouhouhou |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5278070A JPS5278070A (en) | 1977-07-01 |
| JPS5837720B2 true JPS5837720B2 (en) | 1983-08-18 |
Family
ID=15608941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15557175A Expired JPS5837720B2 (en) | 1975-12-24 | 1975-12-24 | Ryoumen Kairoban no Seizouhouhou |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5837720B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06276649A (en) * | 1993-03-15 | 1994-09-30 | Matsushita Electric Works Ltd | Floor plug socket |
-
1975
- 1975-12-24 JP JP15557175A patent/JPS5837720B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06276649A (en) * | 1993-03-15 | 1994-09-30 | Matsushita Electric Works Ltd | Floor plug socket |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5278070A (en) | 1977-07-01 |
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