JPS5839018A - Assembling method of hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To enable to assemble the titled integrated circuit at low cost without reducing a radiation effect by a method wherein resin coating is performed on the surface only of a thick film resistance substrate. CONSTITUTION:A substrate is indicated by 1 and a semiconductor chip by 2 in the diagram, and a heat-resisting tape 3 is adhered to the back side of the substrate 1. Then, using a fluidization dip resin molding method, fluidization dip resin 5 is coated, and after the coating has been finished, the heat-resisting tape 3 is peeled off while the fluidization dip resin is still soft, and the radiating plate 6 of prescribed measurements is adhered to the substrate 1 as occasion demands after the fluidization dip resin has been cured. As regards the radiating plate 6, its shape and method of adhesion are properly selected, and its assembling process is completed. The package of hybrid integrated circuit to be used for power can now be accomplished without reducing radiation effect by utilizing the coating of the fluidization dip resin.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for assembling a hybrid integrated circuit that facilitates resin coating of a thick film resistive substrate.

Conventionally, power hybrid integrated circuits have been mainly packaged with a heat sink attached to the back side of a thick film resistor substrate (hereinafter simply referred to as the substrate) and a plastic case or the like.

This method is expensive due to material costs and processing costs.

This invention has been made in consideration of the above points,
By coating only the surface of the substrate with resin, the purpose is to assemble it at low cost without reducing the heat dissipation effect. The invention will be explained below with reference to one drawing.

FIGS. 1(a) to 1(d) are 11 views showing one embodiment of the present invention, and FIG. 1(a') is a front view of FIG. 1(a).

1 (a), (a') 1 is a substrate, 2 is a semiconductor chip, and a heat-resistant tape 3 is pasted on the back surface of the substrate 1. In this case, the substrates 5 are clamped with clip leads 4 and held in series so that they can be attached to a plurality of substrates 1 at the same time. Next, a fluid immersion resin 5 is coated by a fluid immersion resin molding method, as shown in FIG. 1(b).
state. After coating, the heat-resistant tape 3 is peeled off while the fluidized immersion resin 5 is still soft, resulting in the state shown in FIG. 1(e). After the fluidized immersion resin 5 is after-cured, a heat dissipation plate 6 of a predetermined size is attached to the substrate 1 as required. In this case, the shape and bonding method (soldering or resin bonding) of the heat sink 6 are selected depending on the thermal resistance. In this way, the desired assembly is completed.

FIGS. 2(a) to 2(e) are process diagrams showing another embodiment of the present invention, and FIG. 2(a') is a front view of FIG. 2(a).

In this embodiment, a heat sink 6 is used as shown in FIG. 2(a)k.
After pasting or soldering to the board 1, tape it with heat-resistant tape 3 and coat it with fluidized immersion resin 5 as shown in Fig. 2(b), then peel off the heat-resistant tape 3 and remove it as shown in Fig. 2(e). Complete the assembly as shown. In this case, the heat sink 6 to be pasted is of a relatively small shape,
It is also possible to further attach a heat sink having a shape required depending on the thermal resistance using screws or the like.

As explained above, this invention was developed in the process of changing the expensive package of a power hybrid integrated circuit to an inexpensive fluidized dip resin coating. This has the advantage that it is possible to prevent the possibility of attachment, and that a low-cost package can be realized without deteriorating the heat dissipation effect.

[Brief explanation of the drawing]

FIGS. 1(a) to (d) are side views of each process showing an embodiment of the present invention, FIG. 1(a') is a front view of FIG. 1(a),
FIGS. 2(a) to 2(e) are side views of each process showing another embodiment of the present invention, and FIG. 2(aj) is a front view of FIG. 2(a). In the figure, 1 is a thick film resistance substrate, 2 is a semiconductor chip, 3 is a heat-resistant tape, 4 is a clip lead, 5 is a fluidized immersion resin, and 6 is a heat sink. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Makoto Kuzuno - (1 other person) Figure 1 (a') Figure 2 (a') Procedural amendment (method) I Gansho 56-138
964 No. 2, Title of the invention: Method for assembling a hybrid integrated circuit 3, Person making the amendment 6, Brief description of drawings in the specification subject to the amendment and drawing 7, Contents of the amendment DJ Specification page 4, pages 8-10 Row r of each process...
... Correct the part ``'' in Figure 2 (a) as follows. "A side view of the assembly process of a hybrid integrated circuit, Figure 2 is similar to Figure 1 (
3(a) to 3(c) are side views of one assembly of a hybrid integrated circuit showing other embodiments of the present invention, and FIG. 4 is a front view of FIG. 3(a). (2) Figures 1 and 2 of the drawings have been corrected to provide Figures 1 to 4 as shown in the attached sheet. Above Figure 1 Figure 2 Figure 3 Figure 4 Figure 4 Indication of the case of the Commissioner of the Patent Office Title of the invention in Japanese Patent Application No. 56-138964 Person amending the method of assembling a hybrid integrated circuit 5 Description subject to amendment Detailed Description of the Invention Column 6, Contents of Amendment (1) Page 2 of the Specification, Line 11 [Figure 1 (a') J]
Corrected to "Figure 2". (2) Similarly, page 2, line 13, “Figure 1 (a), (a
') Correct J to "Figure 1 (a) and Figure 2". (3) Similarly, "Fig. 2 (a) to (C)" on page 3, line 7 is corrected to "Fig. 3 (-) to (C)." (4) Similarly, [1a2 Figure 0') on page 3, line 8, is shown in Figure 2 (
a)” is corrected to “Fig. 4 is Fig. 3 (a).” (5) Similarly, "Fig. 2 (&)" on page 3, line 10 is corrected to "Fig. 3 (a)." (6) Similarly, page 3, lines 12-13, “Figure 2 (b)
” is corrected as “Figure 3 (b) J. (7) Similarly, “Figure 2 (C)” on page 3, line 14, is
3(C)". that's all

Claims (2)

[Claims] (1) Tape the back side of the thick film resistor board with heat resistant tape, immerse the whole body in Vt dynamic immersion resin to coat the resin, then peel off the heat resistant tape and remove the heat resistant tape of the thick film resistor board. A method for assembling a hybrid integrated circuit characterized by pasting the peeled portion on a heat sink. (2) After attaching a heat sink to the thick film resistor board, tape only the heat sink with heat resistant tape, immerse the entire body in fluidized immersion resin to coat it with resin, and then peel off the heat resistant tape. A method for assembling a hybrid integrated circuit characterized by: