JPS5840265A - 両面ポリシング装置 - Google Patents

両面ポリシング装置

Info

Publication number
JPS5840265A
JPS5840265A JP56135122A JP13512281A JPS5840265A JP S5840265 A JPS5840265 A JP S5840265A JP 56135122 A JP56135122 A JP 56135122A JP 13512281 A JP13512281 A JP 13512281A JP S5840265 A JPS5840265 A JP S5840265A
Authority
JP
Japan
Prior art keywords
temperature
cooling water
liquid
flow rate
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56135122A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0323304B2 (2
Inventor
Masaharu Kinoshita
正治 木下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56135122A priority Critical patent/JPS5840265A/ja
Publication of JPS5840265A publication Critical patent/JPS5840265A/ja
Publication of JPH0323304B2 publication Critical patent/JPH0323304B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP56135122A 1981-08-28 1981-08-28 両面ポリシング装置 Granted JPS5840265A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56135122A JPS5840265A (ja) 1981-08-28 1981-08-28 両面ポリシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56135122A JPS5840265A (ja) 1981-08-28 1981-08-28 両面ポリシング装置

Publications (2)

Publication Number Publication Date
JPS5840265A true JPS5840265A (ja) 1983-03-09
JPH0323304B2 JPH0323304B2 (2) 1991-03-28

Family

ID=15144331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56135122A Granted JPS5840265A (ja) 1981-08-28 1981-08-28 両面ポリシング装置

Country Status (1)

Country Link
JP (1) JPS5840265A (2)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475860A (ja) * 1990-07-15 1992-03-10 Amitec Kk ベルトサンダー機のパッド冷却装置
US5718620A (en) * 1992-02-28 1998-02-17 Shin-Etsu Handotai Polishing machine and method of dissipating heat therefrom
KR100457718B1 (ko) * 1995-07-03 2005-04-06 미쓰비시 마테리알 가부시키가이샤 실리콘웨이퍼의제조방법과그장치
WO2025094443A1 (ja) * 2023-10-30 2025-05-08 株式会社Sumco ワークの研磨装置及び研磨方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454390A (en) * 1977-10-08 1979-04-28 Shibayama Kikai Kk Cooling water temperature control system for polishing table
JPS5775776A (en) * 1980-10-28 1982-05-12 Supiide Fuamu Kk Temperature detector and controller of polishing machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454390A (en) * 1977-10-08 1979-04-28 Shibayama Kikai Kk Cooling water temperature control system for polishing table
JPS5775776A (en) * 1980-10-28 1982-05-12 Supiide Fuamu Kk Temperature detector and controller of polishing machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475860A (ja) * 1990-07-15 1992-03-10 Amitec Kk ベルトサンダー機のパッド冷却装置
US5718620A (en) * 1992-02-28 1998-02-17 Shin-Etsu Handotai Polishing machine and method of dissipating heat therefrom
KR100457718B1 (ko) * 1995-07-03 2005-04-06 미쓰비시 마테리알 가부시키가이샤 실리콘웨이퍼의제조방법과그장치
WO2025094443A1 (ja) * 2023-10-30 2025-05-08 株式会社Sumco ワークの研磨装置及び研磨方法

Also Published As

Publication number Publication date
JPH0323304B2 (2) 1991-03-28

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