JPS5843809Y2 - board circuit device - Google Patents

Description

[Detailed description of the invention] The present invention relates to a circuit board device, and is applied to, for example, a television tuner device.
The assembly work is simplified by providing the L-shaped case mounting part on the circuit component mounting side of the board, and by assembling the case cover through the opening or notch provided in the L-shaped mounting part, the case cover can be attached easily. It is an object of the present invention to provide a device that allows stable assembly and facilitates solder dip work.

Generally, the method for attaching a television tuner device to a television set is as follows: 1. As shown in FIG. Soldering type (upright board insertion type), ■Case body 1 as shown in Figure 2
On the other hand, there is a type in which the case body 1 is placed upright and screwed to the chassis 5 of the set using the respective screws 4 (upright screw type); A type in which the case convex portion 1b and the board terminal 2 are respectively inserted into the board 3 and soldered thereto (face-down type board insertion type); ■ A pair of L-shaped cases with the case body 1 laid down as shown in Fig. 4; There are roughly four types of mounting parts 1C that are screwed to the chassis 5 with screws 4 (downside screw-fastening type), and the present invention belongs to the above-mentioned type (2), and this type will be explained below.

A conventional tuner device of type (2) above is shown in FIG.

In the figure, a case 1 has a rectangular frame shape, and a pair of case mounting portions 1C having the above-mentioned letter shape are integrated into the lower portions of a pair of both side walls.

Reference numeral 6 denotes a board, and when the board 6 is alone, the lead terminals 7a of the circuit components 7 are inserted into the bottom surface of the board from the top side of the board, and soldered to a predetermined pattern on the bottom surface of the board by soldering 8 by the first solder dip. It is fixed temporarily by fixing it.

At this point, each lead terminal 7 of this board with circuit components 7 is attached.
After the protruding part of a is cut into a relatively short size, it is assembled near the lower end inside the case 1, and then soldered together with the case 1 for a second time, and the predetermined pattern and the lead terminal are connected with solder 82. The soldering of 7a is for final fixing and the grounding pattern, and the soldering of case 1 is for conductive fixation.

Case covers 9 are attached to cover the upper and lower opening surfaces of the case 1, respectively.

The reason why the solder dip is performed in two steps is that if the circuit component 7 is attached to the board 6 by simply inserting its lead terminal 7a, then the circuit component 7 is assembled into the case 1, and the above two dips are carried out at once. If soldering is performed using solder tape, when cutting the protruding portion of the lower surface of the board of the lead terminal 7a after soldering, the cut surface must be at the same level as the lower surface of the case mounting portion 1C.The length of the protruding portion of the lead terminal 7a This is because the cutting operation itself is difficult, and even after cutting, the terminals 7a come into contact with each other and cause a short circuit.

However, according to the above-mentioned conventional example, the solder 8 adheres to the pair of case mounting parts 1C during the second solder dip, spoiling the appearance, and if the mounting parts 1C are covered to prevent this, This method has the drawback that the number of man-hours required increases, and the number of man-hours increases because it is necessary to carry out the soldering process twice based on the step of cutting the lead terminal 7a.

The present invention eliminates the above-mentioned drawbacks, and embodiments thereof will be described below with reference to the drawings.

FIG. 6 and FIG. 7 each show one of the board circuit devices according to the present invention.
5 is a vertical sectional view and a perspective view with the cover removed of a television tuner device to which the embodiment is applied; in the figure, the same parts as in FIG.

11 is a tuner case with four side walls 113 to 11 d
However, in this case, the side wall 11 b
(This is a separate item and can be attached at the same time as the board 6 as described later)
, 1 which is not provided with input/output terminals 13 to 16, which will be described later.
The upper portions of the pair of side walls 11 a and 11 C are formed to extend in an L-shape toward the circuit component 7 mounting side of the board 6 (i.e., upward in the figure), and each has an extending portion 12 a and a bent portion 12 b. L pairs of case mounting portions 12 (12, 12□) are formed, each extending portion 12a has a rectangular opening 12C, and a plurality of bent portions 12b of the mounting portion 12 are formed. The hole 12d and the bent portion 12b of the mounting portion 122 are provided with a plurality of U-shaped notches 12e.

Further, a pair of protrusions 12f are formed on the extending portion 12a only on the mounting portion 122 side.

Also, each side wall 1i a to 11d of the tuner case 11 has an eighth
As shown in the figure (the upper part in the figure is the lower part of the case), an L-shaped groove is carved in a predetermined part of the lower end of the case 11 and each is cut and raised inward to form a plurality of cut-and-raised parts 11e. has been done.

Further, for example, l pairs of protrusions 11f are provided at predetermined positions near the lower ends of the side walls 11b and 11d, and each protrusion 11f has a pair of protrusions 11f as shown in FIGS. 8 to 10. It is formed by deforming the portion in which the horizontal grooves are carved so as to protrude inward of the case.

As shown in FIGS. 7 and 8, the board 6 has a circuit component 7, a plurality of L-shaped terminals 13, and a shield plate 19 on its upper surface in advance, with their lead terminals 7a and terminal portions 13a protruding from the bottom surface of the board. It has.

This board 6 is temporarily fixed by conducting and fixing each lead terminal 7a and the terminal portion 13a to a predetermined pattern 17 on the lower surface of the board using the solder 8 applied by the first solder dip in the same manner as in the conventional example. In this state, the protruding portion of each lead terminal 7a to the lower surface of the board 6 is further cut at approximately the same level as the lower end surface of the case 11, and the above-mentioned chain double-dashed line portion is removed.
As shown in FIG. 8, the protruding length l is cut into short pieces of 1 to 2 mm each.

Subsequently, the board 6 is attached to the side wall 11 of the case 11 in FIG.
As shown in FIG. 8, insert the cut-and-raised portion 11 into the case 11 in the direction of arrow A from the side opening where b is not attached.
It is attached by being slid and inserted while being held between the protrusions 11f and 11f, and the separate side wall 11b is engaged with each of the side walls 11a and IIC to be attached.

As a result, the board 6 is moved so that the end of the board is properly connected to the side wall 1 as described above.
1 b, 11 d, the above four protrusions 11 f and the side wall 1
It is held between the plurality of cut and raised portions 11e of 1a to 11d and temporarily assembled so as not to shift in the vertical direction in each figure.

At this time, the plurality of L-shaped terminals 13 in FIG.
Hole 11b protrudes laterally from hole 11g.

(The angled terminals 13 are used for power supply, grounding, circuit checking, etc. for each channel signal frequency band.) Also, in Fig. 7, each side wall 11b, 11d has an IF output. terminal 14, VHF antenna input terminal 15,
The UHF antenna input terminal 16 is attached and fixed, but these input/output terminals 13 to 16 are all located above the board 6, and are above the solder dip surface during both the first soldering process described above and the second soldering process described below. There is no fear that the solder 8 will be attached unnecessarily if the solder 8 is located at the position.

After that, when the lower part of the case 11 (board 6) is soldered for the second time, each lead terminal 7a is fully soldered to the predetermined pattern 17□ with the solder 82 and is electrically fixed, and at the same time, each of the cut and raised portions 11 e is connected to a predetermined ground pattern 17□ by solder 8□ as shown in FIGS. 8 and 9, respectively.
It is soldered to ensure continuity.

In this case, the pair of mounting parts 12□, 12□ of the case 11
is located above, and by holding it, the second soldering operation can be carried out very easily.The area of the solder 8 attached at the lower end of the case 11 is smaller than that of the conventional case, and the cover 18, which will be described later, □ presser part 18
It can be easily hidden by a and does not spoil the aesthetic appearance.

Also, the mounting part 12. , 12□, the extension part 12a is the opening part 1, respectively.
Because it is actually relatively narrow due to the extension of 2C,
The solder heat that rises through the case 11 during the soldering process is easily blocked at the middle part of the line, and the mounting parts 12□, 12□
It is easy to select a member to hold the solder tape, and it is also easy to check the soldering condition by grasping the mounting parts 12□, 12□ by hand immediately after soldering.

Further, in the above embodiment, the case 11 and the substrate 6 are integrally connected by the solder 8□ via the cut-and-raised portion 11e formed by the L-shaped groove, but the present invention is not limited to this. As shown in FIG. 12, after the board 6 is sandwiched between the bent portion 11h, which is formed by cutting a pair of longitudinal parallel grooves into the lower end of the case 11, and the protruding portion 11f, the solder 8□ It is also possible to fix the conduction by using.

Comparing the configurations shown in FIGS. 9 and 12 above, the cut-and-raised portion 11e in FIG. 9 is preferable in terms of strength because a large amount of solder 8□ easily adheres to the ideal shape.

Furthermore, when a pre-coated material such as tin plate is used for the case 11, the solder 8□ mainly adheres to the pre-coated surface at the cut-and-raised portion 11e in FIG.
In this case, since the solder 8□ mainly adheres to the cut surface (solder is originally difficult to adhere to the cut surface), the cut and raised portion 11e is more advantageous.

In FIG. 6, reference numeral 18 denotes a case cover, which is provided with spring faun press parts 18a around the entire circumference, and the predetermined width parts of the press parts 18a on both sides are connected to the openings 12 of the case mounting parts 121 and 122, respectively. C, and is crimped and attached to cover the upper surface of the case 11.

In this case, the cover 18□ is a pair of protrusions 12 of the case 11.
The left and right mounting directions are limited by the engagement function f.

When attaching the case cover 181, a predetermined portion of the holding part 18a is inserted into the opening 12C of the mounting parts 120, 122, and the range of attachment using the holding part 18a is increased as much as possible, so that the cover 18 is It is mechanically and firmly attached to the case 11, and the cover 18 is not unnecessarily vibrated or rattled, and no wasted gaps are created at the attachment part, and the electrical shielding property is good and the performance can be improved. .

18□ is also a case cover, and as shown in FIG. 13, a holding part 18a and cut-and-raised parts 18b are provided at predetermined parts, and each cut-and-raised part 18b is positioned in contact with the lower end of the case 11, and the cover surface 18C is attached to the lower surface of the case 11 in a state in which it comes into pressure contact with a spring-like contact piece (not shown) provided at a predetermined portion of the earth pattern 17□.

Thus, the completed tuner device further includes a pair of case mounting portions 12 in the same manner as shown in FIG.

122 holes 12d and notches 12e of each bent portion 12b
The screws 4 are inserted into the chassis 5, and the chassis 5 is screwed and assembled.

At this time, the pair of mounting portions 121 and 122 are attached to each of the above terminals 13.
- 16 are provided on the side walls 11C, 11d that do not protrude at all, so each terminal 13 is
16 do not get in the way, and one of the parts through which the screw 4 is inserted forms the notch 12e, making positioning easy and assembly and disassembly work extremely easy.

Also, the side walls 11C and 11d are not provided with holes 11g for passing the terminals 13 to 16, and therefore have a large strength, so the mounting portions 12. ．． The strength of the mounting portion 12.12 is increased and a stable mounting structure is obtained, and the other side walls 11a and llb are attached to the mounting portion 12.12. , 122 is difficult to accept strain and deformation due to force, and the terminals 13 to 122 inserted through the side walls 11a and 11b are
16 is not adversely affected by the strain deformation.

In the above-mentioned embodiment, as a case assembly procedure, the board 6 in FIG. 7 is inserted and attached from the side of the case 11, and the rear side wall 11b is attached to complete the temporary assembly, but the present invention is not limited to this. Case side walls 11a to 11d (case 1
1), insert the board 6 from below the case until the upper end of the board 6 comes into contact with each protrusion 11f, and then cut and raise each of the above-mentioned cut-and-raised parts 11e to complete the above-mentioned temporary assembly. may be completed.

In the above embodiment, the circuit board 6 is mounted with the circuit components 7, the L-shaped terminals 13, and the shield plate 19 positioned in advance.
After the first solder dip is performed and the lead terminal 7a is cut, the lead terminal 7a is temporarily assembled to the case 11 and the second solder dip is performed, but the present invention is not limited to this.
After temporarily assembling the above-mentioned parts 7, 13, and 19 into the case 11 in a state where the parts 7, 13, and 19 are simply inserted and positioned, all the soldering is done by one soldering dip, and then the lead terminal 7a is fixed to the above-mentioned desired protruding length. It may be cut into pieces of 1 to 2 mm), which can reduce the number of solder tip operations by one.

The reason why this is possible is that the mounting portions 12□, 12° of the present application are provided at the upper part of the case 11 compared to the conventional example, so when the lead terminal 7a is cut, the mounting portions 12□, 12°. ，
This is because the desired length can be easily cut without the 12□ becoming an obstacle.

Further, in the above embodiment, the cut-and-raised part 11e (bent part 11h) and the protruding part 11f are provided at the lower end of the case 11 and in the vicinity of the lower end, respectively, but conversely, the protruding part 11f and the protruding part 11f are provided at the lower end and in the vicinity of the lower end of the case 11, respectively. A cut and raised portion 11e (bent portion 11h) may be provided to sandwich the substrate 6 therebetween.

Furthermore, in each of the embodiments described above, the substrate 6 is positioned by being held between the two sides, but the present invention is not limited to this, and either one of the cut-and-raised portion 11e (bent portion 11h) or the protrusion portion 11f is provided at the lower end of the case. Alternatively, the solder dipping may be performed to fix the substrate 6 by simply placing and positioning the substrate 6 thereon.

According to the embodiments described above, in any case, the board 6 is fixed in a predetermined position with a simple structure, and soldering can be easily performed.

Further, in the above embodiment, a pair of mounting portions 12. ．． Although the openings 12C were provided in each of the case cover 18□, the holding part 18a of the case cover 18□ is connected to the case side wall 11.
a. It is sufficient to provide a relief part that can come into contact with the IIC as widely as possible, and the above opening 12
Instead of C, for example, as shown in FIG.
122) may be provided with notches 12g on both sides, through which the presser portion 18a is inserted, and as shown in FIG. Three mounting parts 12, a to 12□.

, (12□8 to 122c) and each mounting part 12□
8-12□.

, (1228-122c) may be appropriately provided with a gap portion of a predetermined size to achieve the same function.

As described above, according to the board circuit device of the present invention, a pair of L-shaped mounting portions are provided on the side opposite to the board of the pair of side walls of the case, and the spring faun ridge portion of the case cover is mounted above each mounting portion. Since the case cover is installed by passing through the opening or notch provided in the extension, the case cover can be installed through the opening or notch, which increases the installation range of the case cover to the case. The case cover can be firmly installed without causing any vibration or rattling, and there is no unnecessary gap in the case cover mounting part, which improves electrical shielding. Since it is substantially narrow, the rise in heat during soldering of the board is prevented, and the mounting part is easy to grip, and since it is formed into a narrow width, it can be easily bent, improving work efficiency. In addition, the solder dip work can be easily performed by holding the pair of mounting parts, and the board can be mounted to the case without the solder adhering to the case mounting parts and spoiling the appearance as in the conventional case. Since it is dimensionally possible to cut the lead terminals of the circuit components after the soldering process has been completed, the solder dip work can be performed only once after the board is attached to the case, which has the advantage of greatly reducing the number of man-hours. It is something.

[Brief explanation of drawings]

1 and 2 are front views of various tuner devices for televisions to which conventional examples of circuit board circuit devices are applied, and FIGS. 3A and 3B are front views of tuner devices to which conventional examples of each are applied. A side view, FIGS. 4 and 5 are respectively a front view and a vertical sectional view of a tuner device to which another conventional example is applied, and FIGS. 6 and 7 are respectively an embodiment of a board circuit device according to the present invention. FIG. 8 is a partial perspective view of the main parts of the tuner device viewed diagonally from below, FIGS. 9 and 10 The figures are a vertical cross-sectional view of the main parts mentioned above, another partial perspective view as seen diagonally from below, Figures 11 and 12, respectively.
The figures are a partial perspective view and a vertical sectional view of other embodiments having the configuration shown in FIGS. 9 and 10, respectively, FIG. 13 is a partial perspective view of the lower case cover of the tuner device, and FIGS. 14 and 15 are FIG. 7 is a perspective view showing another embodiment of the case of the tuner device. 1.11...Tuner case, IC, 12 (1
2□, 12□), 12□8-12□. , 122. ~122c... Case mounting part, 2.
... Board terminal, 3,6... Board, 580
．． ...Chassis, 7...Circuit parts, 7a...
...Lead terminal, 8 (8□, 82) ...Solder, 9,18. . 18□・・・Case cover, 11 a to 11 d
...Case side wall, 11 e... Cut and raised portion, 11 f... Protrusion, l1g, 12d...
...hole, llh, 12b... bending part, 12
e, 12 g...notch, 13...
・L-shaped terminal, 14-16...Terminal, 17. 172...pattern, 19...shield plate.

Claims (1)

[Scope of utility model registration request] 1, which has side walls on all sides and is formed by bending the upper ends of upwardly extending portions at predetermined portions of a pair of opposing side walls toward the outside;
It has a metal case integrally provided with a pair of L-shaped mounting parts, and has a circuit component on the top surface of the board with the lower part of the terminal protruding from the bottom surface of the board, and is housed near the bottom end of the case. A board is soldered and conductively fixed to a predetermined pattern on the bottom surface of the board by soldering the lower part of the terminal and a predetermined part of the lower end of the case respectively to a predetermined pattern on the bottom surface of the board by soldering dip, and a plurality of spring-like holding parts are bent on all sides,
The case includes a case cover which is attached to at least the upper side of the case in a closed manner by pressing the spring-like retaining part against the outer surface of the side wall, and an opening or a notch is provided in the extending part of each of the above-mentioned L-shaped attachment parts. A board circuit device comprising: a holding part of the case cover corresponding to the opening or notch is inserted through the opening or the notch and pressed against the outer surface of the case.