JPS5845052A - Decorative particle board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for simultaneously attaching a decorative sheet during the process of manufacturing particle board, and the decoration obtained thereby.
By forming a special adhesive resin layer on the particle board, the decorative paper and particle board can be thermally bonded during the heating and pressing process during particle board manufacturing, and the adhesive resin layer remains even after thermal bonding, allowing for post-processing. The feature is that even if variations occur in the V-cutting accuracy in the V-cutting process, the surface of the decorative paper is not adversely affected.

The method of manufacturing decorative particle board by pasting decorative paper is to first form the particle board and then paste the decorative sheet on top of it with an adhesive, or to layer impregnated paper and heat and pressure mold it. However, each method resulted in complicated processes and high costs.

Therefore, in order to simplify the process, a method was proposed in which decorative paper was overlapped when forming particle board, and the forming of the board and the lamination of the decorative paper were performed at the same time. However, when this method uses decorative paper made of relatively thin paper such as tissue paper, the grains of the chip of the particle board will appear on the surface of the decorative paper (hereinafter referred to as "grain thinning"), resulting in a smooth decorative surface. It had the disadvantage that it could not be obtained.

Moreover, the decorative paper board is often subjected to a V-cut process in post-processing, and during this process, there are also disadvantages such as (1) variation in cutting accuracy causes damage to the decorative paper.

Therefore, the inventors developed an adhesive resin layer (thermoplastic polyester resin, unsaturated carboxylic acid, or vinyl ester) that has a buffering effect so that the surface of the decorative paper would not be affected even if variations in V-cut accuracy occurred. We have proposed a decorative paperboard using a decorative paper having an olefin copolymer resin or its saponified resin as part of its structure, and a method for producing the same (Japanese Patent Application No. 11065/1983).
No. 8).

As a result, a decorative verticle board with excellent surface properties, strong adhesion between the decorative paper and the verticle board, and no occurrence of cracks, cracks, etc. even after V-cut processing and bending force 11 was obtained.

・However, when using these adhesive resins, the hot adhesive strength at high temperatures is somewhat weak, so the board temperature after hot pressing may exceed 7.
A necessary condition is to perform sufficient cooling to below 0°C. Insufficient cooling may cause the decorative paper to lift during the process of peeling off the press plate or cause a decrease in surface properties.

The present invention eliminates the above-mentioned drawbacks and has extremely excellent hot adhesive strength, so it is possible to shorten the cooling time after hot pressing, obtain stable surface properties, and greatly improve workability. A decorative verticle board using decorative paper that has an adhesive resin layer as part of its structure that has a buffering effect so that even if there are variations in cutting accuracy, the surface of the decorative paper will not be affected. The main idea is to apply a monochrome colored layer or any pattern on the forming mat after the forming or buri-pressing process or the board surface after buri-pressing in the manufacturing process of verticle board. The layer and the surface protective layer are formed by thermally bonding the synthetic resin impregnated or mixed on the reinforcing paper with the binder in the particle board and the chips of the particle board. , and the melt viscosity is 1.000 bois (130°C)
The decorative paper on which the adhesive resin layer made of thermoplastic urethane resin with a tensile elongation at break of 200% or more is formed is placed with the side without patterns etc. facing the forming mat or board surface, Relating to a decorative particle board characterized in that a release sheet is layered thereon if necessary, followed by heating and pressure molding, and the particle board body and decorative paper are laminated and integrated via an adhesive resin layer. It is something.

The present invention will be explained in detail below with reference to the drawings.

First, as shown in Figure 1, a monochromatic colored layer or an arbitrary pattern layer (2) is formed on the surface of interpaper reinforced paper (1) impregnated with or mixed with synthetic resin, and then a surface protective resin layer is formed on the surface. (
An adhesive resin layer (5) is formed on the reinforcing paper side of the decorative paper base material (4) on which 3) is formed to obtain a decorative paper (6).

Paper reinforced paper (1) is impregnated with or mixed with resin such as acrylic, urea acrylic, epoxy, nitrile butadiene rubber, styrene butadiene rubber, etc. and has a weight of 23~
1.5.09/m paper with heat resistance and flexibility that will not cause cracks or the like during bending during cutting.

The monochromatic colored layer or arbitrary pattern layer (2) is arbitrarily selected from blue, gray, cream color, or any other monochromatic colored layer, wood grain pattern, cloth grain pattern, abstract pattern pattern, and other patterns, Formed using regular ink.

The surface protection resin layer (3) is formed of a urethane-based, acrylic urethane-based, polyester urethane-based resin, or the like, and constitutes a coating having a heat resistance of 130° C. or higher and a tensile elongation at break of 150 modulus or higher.

The adhesive resin layer (5) is used to thermally bond the decorative paper base material (4) and the vertical board, and also to prevent processing defects due to variations in precision during V-cutting, so the paper reinforced paper (1)
The heat and pressure process (13
0'c -20Ky/ail -5 minutes), and furthermore, it is necessary to form a buffer layer without melting and completely penetrating into the board even under the heated and pressurized conditions. The melt viscosity at °C must be 1000 voids or more; if it is less than this, most of the adhesive resin will permeate into the board. In addition, in order to prevent cranking or the like from occurring during the V-cuff 1 bending process, it is necessary to have a tensile elongation at break of 200 or more, and it is naturally necessary to have heat resistance to maintain this performance even after the heating and pressing process.

As a result of various studies on adhesive resins that satisfy the above conditions and can maintain excellent hot adhesive strength even under high temperature conditions, the superior performance of thermoplastic urethane resins was discovered.

Thermoplastic urethane resin is basically a linear block copolymer obtained by the reaction of a hydroxyl group-terminated long chain polyol and polyisocyanate, and long chain polyols include polyethylene glycol, polypropylene glycol, polytetramethylene glycol. , poly(1,4-
butadiene), polyethylene adipate5. Examples include polydiethylene adipate, polypropylene diadipate, polytetramethylene adipate, polyhexamethylene adipate, polyneopentylene adipate, and random copolymers thereof, and polyε-caprolactone and polypentylene carbonate can also be used. .

Examples of polyisocyanates include aromatic incyanates such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 1,5-naphthalene diisocyanate, 543'-dimethyl-4,41-diphenylene diisocyanate, and 1,6-diisocyanate. Hexylylene diisocyanate layer inphorone diisocyanate, xylylene diisocyanate, trimethylhexamethylene diisocyanate, lysine iso7anate methyl ester,
Aliphatic diisocyanates such as dimeryl diisocyanate and these polyisocyanates and 4,4'-diaminodiphenylmethane, 3,'3'-dichloro4,4'
It is a chain-extended polyisocyanate that is the reaction product of a short chain polyamine such as diaminodiphenylmethane or a short chain polyol such as ethylene glycol, 1,4-butanediol, trimethylolpropane.

Methods for forming a layer of thermoplastic urethane resin on interpaper reinforced paper impregnated or mixed include extruder coating of pelletized resin, or dissolving it in a bath agent and applying it by gravure roll coating, etc. The resin thickness is suitably in the range of 10 to 150 microns.

Next, the results of comparative evaluation of the excellent hot adhesive strength of thermoplastic urethane resins will be explained as examples.

[Example 1] A pattern is printed on the surface of acrylic resin-impregnated paper weighing 85 bars.
After that, adhesive resin layers ① and ② with the following formulation were applied to a decorative paper base coated with a two-component urethane resin top coated with a thickness of 10μ, respectively, using an extruder to a thickness of 50μ.
A decorative paper was obtained by coating.

*This formulation is equivalent to Example 2 of Japanese Patent Application No. 110658/1982.
A test sample was prepared by heating the sample for 5 minutes at a conductivity of ffl and then cooling it to room temperature. When cooled to room temperature,
Smooth decorative particle boards with no homodactyl on the surface were obtained in both cases using adhesive resin (■), (σ) and (2). In addition, in the plane tensile test (Japanese Agricultural and Forestry Standards for Special Plywood) for both, sufficient adhesion strength was obtained with 91 cr& or more (breaking down the vertical board) for 17, and no cracking or cracking occurred during cutting or bending. I didn't.

Next, Table 1 shows the relationship between board surface temperature and plane tensile strength for both samples.

As is clear from Table 1, by using thermoplastic urethane resin as the adhesive layer, a significant improvement in hot bonding strength can be achieved, and in the production process, cooling time can be shortened.
Prevents lifting and peeling during post-processing, resulting in a stable product.

[Example 2] After printing a pattern on the surface of acrylic resin-impregnated paper with a weight of 60 jJ/m, 10 g of polyester-based urethane resin was applied.
A decorative paper was obtained by extruder coating the following adhesive resin (2) to a thickness of 70 μm on the back side of a decorative paper base material top-coated to a thickness of μ μm.

Adhesive resin ■ Adipic acid urethane resin This decorative paper is placed on a forming mat in the verticle board production line and 1! 5 under the condition of IO°C-20Ky/d
After heating for 18 minutes, adjust the board temperature to 65℃.
A comparison of the one cooled for 7 minutes and the one cooled for 7 minutes to bring the board temperature to 95°C revealed that both decorative particle boards had good surface properties, with no lifting or peeling during the press board peeling or post-processing. It was confirmed that the cooling time could be shortened. In addition, in the plane tensile test, 16Ky/f
Sufficient adhesive strength of f1 or higher (breakage) was obtained, and no cracking, cracking, etc. occurred during cutting or bending.

[Example 6] After printing a pattern on the surface of styrene-butadiene-rubber impregnated paper weighing 12 og/rrt, the following adhesive resin layer (■) was applied to a decorative paper base material which was top-coated with polyester urethane resin to a thickness of 10 μm. A decorative paper was obtained by gravure roll coating with a coating weight of 20 g/m''.

Adhesive resin ■ Adipic acid urethane resin This decorative paper was heat-molded in the same manner as in Example 2, and cooled for 7 minutes to bring the board temperature to 95°C. A decorative verticle board with a smooth surface was obtained. 14Ky/cr in plane tensile test
Adhesive strength of 1 or more (break) was obtained, and the cutting and bending workability was also excellent.

According to the present invention as described above, the following effects can be obtained.

■By using a synthetic resin impregnated or mixed with interpaper reinforced paper and an adhesive resin that thermally adheres to both the binder in the particle board and the chips of the particle board, decorative paper is laminated and integrated when making particle board. Therefore, the process is shortened.

■As the decorative paper uses wood-impregnated paper or resin-mixed paper that has heat resistance and flexibility, ■cutting is possible in post-processing.

■Adhesive resin can serve as both an adhesive layer and a buffer layer, and ■V during cutting process.
It is possible to prevent defects due to variations in cutting accuracy.

■By using thermoplastic urethane resin as the adhesive resin, a significant improvement in hot adhesive strength has been achieved, which shortens the cooling time after hot molding, speeding up production, reducing costs, and preventing uneven cooling, etc. Unstable factors in quality can be removed.

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[Brief explanation of the drawing]

The drawings are schematic diagrams □ illustrating an example of the structure of the decorative particle board obtained according to the present invention, and FIG. Figure 3 is a cross-sectional view of the obtained decorative verticle board that has been subjected to V-cut processing, and Figure 4 shows the V-cut F method used in post-processing of the decorative verticle board. It is an explanatory view showing an example of panel manufacture used. (1)...Paper spacing reinforced paper (2)...Single color colored layer or arbitrary pattern layer (3)
... Surface protection resin layer (4) ... Decorative paper base material (5) ... Adhesive resin layer (6) ... Decorative paper (force) ... Forming mat or board (8) ...
Particle board (9)...Decorative particle board (10)...V-shaped groove Patent applicant Toppan Printing Co., Ltd. Figure 3

Claims (1)

[Claims] A monochromatic colored layer on the surface is formed with an arbitrary pattern layer and a surface protective layer.A synthetic resin-impregnated or mixed-sheet reinforced paper is coated with a synthetic resin impregnated or striped with paper and particle board. It is thermally bonded to both the inner hole (interface and particle board chip 0) and has a melt viscosity of 1000.
Tensile elongation at break is 200'i at temperatures above 130°C
After forming or pre-pressing the adhesive resin layer made of thermoplastic urethane resin as described above, it is used for parking, forming or pre-pressing.