JPS5846459U - 半導体素子 - Google Patents

半導体素子

Info

Publication number
JPS5846459U
JPS5846459U JP1981140386U JP14038681U JPS5846459U JP S5846459 U JPS5846459 U JP S5846459U JP 1981140386 U JP1981140386 U JP 1981140386U JP 14038681 U JP14038681 U JP 14038681U JP S5846459 U JPS5846459 U JP S5846459U
Authority
JP
Japan
Prior art keywords
lead terminals
semiconductor element
package
displaying
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981140386U
Other languages
English (en)
Inventor
西元　幸一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1981140386U priority Critical patent/JPS5846459U/ja
Publication of JPS5846459U publication Critical patent/JPS5846459U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示すｉｃの斜視図、第２図
は第１図のｎ−ｎ矢視断面図、第３図は本考案を適用し
た一実施例の回路図である。 １・・・パッケージ、２・・・電源用リード端子、３・
・・グランド用リード端子、４・・・入力信号、出力信
号、その他用者リード端子、５・・・表示口、６・・・
ＩＣチップ、７・・・ワイヤ、８・・・発光ダイオード
、９・・・抵ＬＩＯ−・・アノ−ド、１１・・・カソー
ド。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード端子付きの半導体素子において、前記リード端子
    の通電動作状態を表示する発光物質を、前記リード端子
    のパッケージへの取付端部に設けたことを特徴とする半
    導体素子。
JP1981140386U 1981-09-24 1981-09-24 半導体素子 Pending JPS5846459U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981140386U JPS5846459U (ja) 1981-09-24 1981-09-24 半導体素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981140386U JPS5846459U (ja) 1981-09-24 1981-09-24 半導体素子

Publications (1)

Publication Number Publication Date
JPS5846459U true JPS5846459U (ja) 1983-03-29

Family

ID=29933547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981140386U Pending JPS5846459U (ja) 1981-09-24 1981-09-24 半導体素子

Country Status (1)

Country Link
JP (1) JPS5846459U (ja)

Similar Documents

Publication Publication Date Title
JPS5846459U (ja) 半導体素子
JPS5889955U (ja) 光結合器
JPS5987680U (ja) 電源のモニタ回路
JPS5991762U (ja) 発光ダイオ−ドの定電流駆動用ｉｃ
JPS5995380U (ja) 表示装置
JPS59118082U (ja) 表示装置
JPS5945691U (ja) 発行ダイオ−ド表示ユニット
JPS593561U (ja) 発光ダイオ−ドの駆動回路
JPS6041062U (ja) 半導体装置
JPS6140039U (ja) 制御極付半導体素子の縦続回路
JPS58183522U (ja) 電源装置
JPS5885377U (ja) プリント基板
JPS5852591U (ja) 発光ダイオ−ド駆動回路
JPS6030021U (ja) 電子機器の電源表示器
JPS58118760U (ja) 発光ダイオ−ド
JPS5819318U (ja) 電源回路
JPS59109789U (ja) 糸切れ検知装置
JPS58183039U (ja) 遠隔制御装置
JPS58162656U (ja) 発光装置
JPS614448U (ja) 発光ダイオ−ドの駆動回路
JPS6083292U (ja) 半導体回路装置
JPS5963715U (ja) 定電圧電源回路
JPS5942661U (ja) 半導体発光素子駆動装置
JPS6048699U (ja) 放電器具
JPS6112254U (ja) 光結合装置