JPS5852576A - Printed circuit board inspection method - Google Patents
Printed circuit board inspection methodInfo
- Publication number
- JPS5852576A JPS5852576A JP56149486A JP14948681A JPS5852576A JP S5852576 A JPS5852576 A JP S5852576A JP 56149486 A JP56149486 A JP 56149486A JP 14948681 A JP14948681 A JP 14948681A JP S5852576 A JPS5852576 A JP S5852576A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- probe
- camera
- inspection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、集積回路等を塔載したプリント基板をプロー
ビングするプリント基板の検査方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a printed circuit board inspection method for probing a printed circuit board on which an integrated circuit or the like is mounted.
従来のプロービング装置を第１図に示す。A conventional probing device is shown in FIG.
工Ｃ４を載置したプリント基板３は、プリント基板固定
金具乙に取着されている。このプリント基板５の上方側
には、プリント基板３の面と平行方向（示矢で示すＸＹ
方向）に移動自在なＸＹテーブル１が配設されている。The printed circuit board 3 on which the component C4 is mounted is attached to the printed circuit board fixing fitting B. On the upper side of this printed circuit board 5, there is a direction parallel to the surface of the printed circuit board 3 (XY
An XY table 1 is disposed which is movable in the direction (direction).
このＸＹテーブル１には検査用プローブ２（以下プロー
ブと略称する）が取着され、このプローブ２はプリント
基板３０面の直角方向（示矢の２方向）に移動しつるよ
うにされている。An inspection probe 2 (hereinafter abbreviated as probe) is attached to the XY table 1, and the probe 2 is adapted to move and hang in directions perpendicular to the surface of the printed circuit board 30 (in the two directions indicated by the arrows).
まづ、図示していないプロービング用Ｎｏデータにより
ＸＹテーブル１を所定の位置に位置決めしたのち、プロ
ーブ２を下降させる。次に、プリント基板３に載置され
た被検査物工Ｃ４のリード５にプローブ２の先端を接触
させ、工Ｃ４の信号解析および故障解析を行なうように
なっている。First, the XY table 1 is positioned at a predetermined position using probing No. data (not shown), and then the probe 2 is lowered. Next, the tip of the probe 2 is brought into contact with the lead 5 of the component C4 to be inspected placed on the printed circuit board 3, and signal analysis and failure analysis of the component C4 are performed.
第２図はプローブ２と工Ｃ４のリードとの関係位置を詳
細に示したものである。すなわち、プリント基板３の上
面にはパターンバッド８を介して数多くのＩ ＯＩＪ−
ド５が配設されている。プローブ２は微少幅Ｈを有する
が、図示のごとく１つのＩＣＩＪ−ド５と対峙する位置
に位置決めされることが必要である。しかしながら、工
Ｃ４の放熱等により、プリント基板３が目標精度以上に
熱伸縮を生じ、第３図に示す△ｔだけ変化したとすると
、プローブ２は工Ｃ４のリード５のみならず隣接するリ
ード５′とも接触することになり、短絡が生ずる。その
結果、正しい検査ができないのみならず、塔載した工Ｃ
４を破損する欠点を有していた。FIG. 2 shows in detail the relative positions of the probe 2 and the leads of the connector C4. That is, a large number of IOIJ-
A card 5 is provided. Although the probe 2 has a very small width H, it is necessary to position it at a position facing one ICIJ-board 5 as shown in the figure. However, if the printed circuit board 3 is thermally expanded and contracted more than the target accuracy due to heat dissipation in workpiece C4, and changes by Δt shown in FIG. ′ will also come into contact, causing a short circuit. As a result, not only could a correct inspection not be carried out, but the
It had the disadvantage of damaging 4.
本発明は、この従来技術の欠点を解消するもので、その
目的は、プリント基板が熱伸縮しても、グローブを適正
位置に位置決めしうるプリント基板の検査方法を提供す
るにある。The present invention has been made to overcome this drawback of the prior art, and its purpose is to provide a method for inspecting a printed circuit board that can position the glove at an appropriate position even if the printed circuit board expands and contracts due to heat.
本発明は、以上の目的を達成するために、プローブの取
着するＸＹテーブルにカメラを設置し、このカメラによ
って直接ＩＣリードの画像を取り込み、熱伸縮長を測定
し、この測定値によってＸＹテーブル位置を修正し、プ
ローブを適正位置に位置することにより正しいプルービ
ングができ、かつ、短絡等の生じないプリント基板の検
査方法を特徴としたものである。 ′□
以下、本発明の実施例を図に基づいて説明する。In order to achieve the above object, the present invention installs a camera on the XY table to which the probe is attached, directly captures an image of the IC lead with this camera, measures the thermal expansion/contraction length, and uses this measurement value to This method is characterized by a printed circuit board inspection method that allows correct proving by correcting the position and locating the probe at the proper position, and does not cause short circuits or the like. '□ Hereinafter, embodiments of the present invention will be described based on the drawings.
第４図において、ＸＹテーブル１にはプローブ２に併設
してカメラ７が取着されている。カメラ７は、プリント
基板の画像を取り込み、第６図に示したパターンパッド
８および工Ｃ４のリード５を映し出すようになっている
。In FIG. 4, a camera 7 is attached to the XY table 1 in addition to the probe 2. The camera 7 captures an image of the printed circuit board and displays the pattern pad 8 and the lead 5 of the workpiece C4 shown in FIG.
第５図には、カメラ７で取り込んだ画像から、プリント
基板の伸縮長を算出する方法を示す。FIG. 5 shows a method of calculating the expansion/contraction length of the printed circuit board from the image captured by the camera 7.
すなわち、図示していない制御装置により、プローブ位
置決め用のブロービング用Ｎｏデータを取出し、これに
よってＸＹテーブル１を動かし、カメラ７をブロービン
グすべき位置に合わせる。That is, a control device (not shown) takes out the probing No. data for probe positioning, moves the XY table 1 based on this, and aligns the camera 7 with the position where probing is to be performed.
次に、カメラ７によりプリント基板６の画像を取り込み
、ブロービングすべき工Ｃ４のリード５の位置を認識す
る。Next, an image of the printed circuit board 6 is captured by the camera 7, and the position of the lead 5 of the workpiece C4 to be blown is recognized.
取り込んだ画像９から第５図（ａ）に示すように、何本
かの走査線１０を抽出し、第５図（ｂ）に示す走査線１
０を求める。次に、しきい値１１により、走査線１０の
レベルを確認し、大小を判定する。この大小の判定によ
って、２値化信号１２を作り、リード５′およびパター
ンパッド８＃の中心を算出し、ブロービングすべきリー
ド５”およびパターンパッド８Ｉの伸縮長△ｔを算出す
る。Several scanning lines 10 are extracted from the captured image 9 as shown in FIG. 5(a), and scanning lines 1 as shown in FIG. 5(b) are extracted.
Find 0. Next, the level of the scanning line 10 is checked using the threshold value 11 to determine whether it is large or small. Based on this size determination, a binary signal 12 is generated, the centers of the lead 5' and the pattern pad 8# are calculated, and the expansion/contraction length Δt of the lead 5'' and the pattern pad 8I to be blown is calculated.
次に、前記したプロービング位置決め用Ｎｏデータに伸
縮長△ｔを加算又は減算し、その補正済のデータにより
ＸＹテーブル１を動かしプローブ２を位置決めする。プ
ローブ２の位置決め後、プローブ２を下降させれば、１
つのリード５のみに接触し、短絡を生ずることがなく、
正しい工Ｃ４の層号解析および故障解析を行うことがで
きる。Next, the expansion/contraction length Δt is added or subtracted from the above-mentioned probing positioning No. data, and the XY table 1 is moved to position the probe 2 based on the corrected data. After positioning probe 2, if probe 2 is lowered, 1
Only one lead 5 is contacted and no short circuit occurs.
Correct layer name analysis and failure analysis of engineering C4 can be performed.
以下、全Ｎｏデータを同様に補正し、プリント基板３を
検音完了する。なお、第６図は以上の動作ラフローチャ
ートにより説明したものである。Thereafter, all No. data are corrected in the same way, and the sound test of the printed circuit board 3 is completed. Incidentally, FIG. 6 is explained using the above-mentioned operation rough flowchart.
以上の説明によって明らかのごとく、本発明によれば、
プリント基板に熱伸縮が生じても、それに対応してプロ
ーブを適正位置に修正位置決めでき、正しいプルービン
グを行い得る効果を上げることができる。As is clear from the above description, according to the present invention,
Even if thermal expansion/contraction occurs in the printed circuit board, the probe can be corrected and positioned to an appropriate position in response to the thermal expansion/contraction, and the effect of correct proving can be improved.
第１図は従来一般に使用されてるブロービング装置の側
面図、第２図はプローブを正しい位置に位置決めしたと
きの工０１Ｊ−ドとの関係を示す拡大側面図、第３図は
プリント基板が熱伸縮しだときの従来のブロービング装
置におけるプローブの位置を説明する拡大側面図、第４
図は本発明の実施例を示す側面図、第５図はプリント基
板の伸縮長を算出するだめの説明図、第６図は本発明方
法のフローチャートである。
１・・・ＸＹテーブル、２・・・プローブ、３・・・プ
リント基板、４−・・ＩＣ，５，５’、５’・・・リー
ド、７・・・カメラ、９・・・カメラ画像、１０・・・
走肴線、１１・・・しきい値、１２・・・２値化信号。
代理人 弁理士 秋 本 正 実
第１図
第２図
第３図
第４図
第５図（ａ）
第６凶Figure 1 is a side view of a conventionally commonly used blowing device, Figure 2 is an enlarged side view showing the relationship with the probe when the probe is positioned at the correct position, and Figure 3 is an enlarged side view of the printed circuit board. Enlarged side view illustrating the position of the probe in the conventional probing device when it begins to expand and contract, No. 4
5 is a side view showing an embodiment of the present invention, FIG. 5 is an explanatory diagram of how to calculate the expansion/contraction length of a printed circuit board, and FIG. 6 is a flowchart of the method of the present invention. 1... XY table, 2... Probe, 3... Printed circuit board, 4-... IC, 5, 5', 5'... Lead, 7... Camera, 9... Camera image , 10...
Running line, 11...threshold value, 12...binarized signal. Agent Patent Attorney Tadashi Akimoto Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 (a) Figure 6
Claims (1)
る検査用プローブによりプリント基板を検査するプリン
ト基板検査方法におＡて、前記ＸＹテーブルにカメラを
設置し、該カメラによって、前記プリント基板のプロー
ビングする位置の画像を取込み、その熱膨張量を測定し
、該測定値により前記ＸＹテーブル位置を修正し、前記
検査用プローブを適正位置に位置決めしてプロービング
をすることを特徴とするプリント基板の検査方法。In the printed circuit board inspection method A of inspecting a printed circuit board with an inspection probe attached to an XY table that moves parallel to the printed circuit board surface, a camera is installed on the XY table, and the printed circuit board is probed by the camera. Inspection of a printed circuit board characterized by capturing an image of a position to be inspected, measuring the amount of thermal expansion thereof, correcting the position of the XY table based on the measured value, positioning the inspection probe at an appropriate position, and performing probing. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56149486A JPS5852576A (en) | 1981-09-24 | 1981-09-24 | Printed circuit board inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56149486A JPS5852576A (en) | 1981-09-24 | 1981-09-24 | Printed circuit board inspection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5852576A true JPS5852576A (en) | 1983-03-28 |
Family
ID=15476200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56149486A Pending JPS5852576A (en) | 1981-09-24 | 1981-09-24 | Printed circuit board inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852576A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01229947A (en) * | 1988-03-10 | 1989-09-13 | Seiko Epson Corp | How to position flexible circuit boards |
-
1981
- 1981-09-24 JP JP56149486A patent/JPS5852576A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01229947A (en) * | 1988-03-10 | 1989-09-13 | Seiko Epson Corp | How to position flexible circuit boards |
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