JPS585355U - Lead shaping device - Google Patents

Lead shaping device

Info

Publication number
JPS585355U
JPS585355U JP1981098097U JP9809781U JPS585355U JP S585355 U JPS585355 U JP S585355U JP 1981098097 U JP1981098097 U JP 1981098097U JP 9809781 U JP9809781 U JP 9809781U JP S585355 U JPS585355 U JP S585355U
Authority
JP
Japan
Prior art keywords
shaping device
lead
lead shaping
shaping
stem structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981098097U
Other languages
Japanese (ja)
Inventor
中川　文男
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1981098097U priority Critical patent/JPS585355U/en
Publication of JPS585355U publication Critical patent/JPS585355U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Materials For Medical Uses (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体装置のステム構体単体の斜視図、
第２図は半導体素子を固着したステム構体の斜視図、第
３図はステム構体を次工程へ移送する移送板及びステム
構体の斜視図、第４図乃至・第７図は、この考案の実施
例に係り、第４図及び第５図はリード整形装置の要部斜
視図、第６図は整形爪の駆動機構を示す原理図、第７図
は、ステム構□体を吸着するコレ゛ットの先端部拡大断
面図である。 ３、　４．　５・・・・・・外部導出リード線、７・・
・・・・ステム構体、１−５・・・・・・整形爪。FIG. 1 is a perspective view of a single stem structure of a conventional semiconductor device.
Fig. 2 is a perspective view of a stem structure to which a semiconductor element is fixed, Fig. 3 is a perspective view of a transfer plate for transferring the stem structure to the next process and the stem structure, and Figs. 4 to 7 show implementation of this invention. For example, FIGS. 4 and 5 are perspective views of the main parts of the lead shaping device, FIG. 6 is a principle diagram showing the drive mechanism of the shaping claw, and FIG. FIG. 3 is an enlarged sectional view of the tip of the 3, 4. 5... External lead wire, 7...
... Stem structure, 1-5 ... Orthopedic nail.

Claims (1)

【実用新案登録請求の範囲】 複数の外部導出ＩＪ　　−ド線を植設したステム構体の
各リード線を束ねて挾持する整形爪と、リード線と整形
爪間に相対的に捻りを力〔る手段を設けたことを特徴と
するリード整形装置。[Scope of Claim for Utility Model Registration] Shaping claws that bundle and hold each lead wire of a stem structure in which a plurality of externally derived IJ-do wires are implanted, and a relative twisting force between the lead wires and the shaping claws. A lead shaping device characterized by being provided with means.
JP1981098097U 1981-06-30 1981-06-30 Lead shaping device Pending JPS585355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981098097U JPS585355U (en) 1981-06-30 1981-06-30 Lead shaping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981098097U JPS585355U (en) 1981-06-30 1981-06-30 Lead shaping device

Publications (1)

Publication Number Publication Date
JPS585355U true JPS585355U (en) 1983-01-13

Family

ID=29892866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981098097U Pending JPS585355U (en) 1981-06-30 1981-06-30 Lead shaping device

Country Status (1)

Country Link
JP (1) JPS585355U (en)

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