JPS585372U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS585372U JPS585372U JP9730481U JP9730481U JPS585372U JP S585372 U JPS585372 U JP S585372U JP 9730481 U JP9730481 U JP 9730481U JP 9730481 U JP9730481 U JP 9730481U JP S585372 U JPS585372 U JP S585372U
- Authority
- JP
- Japan
- Prior art keywords
- conductive pattern
- soldering
- printed board
- chip
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図から第4図は従来例に係わり、第1図は1従来例
の要部断面図、第2図は同平面図、第3図は他の従来例
の要部断面図、第4図は同平面図、第5図、第6図は本
考案に係わり、第5図は要部断面図、第6図はその平面
図である。
1・・・・・・プリント基板、2・・・・・・絶縁基板
、3a。
3b・・・・・・導電パターン、3c・・・・・・接続
部、3d・・・・・・導電パターン除去部、4・・・・
・・チップ部品、4a・・・・・・電極、5・・・・・
・筐体、6・・・・・・半田、7・・・・・・レジスト
。1 to 4 relate to conventional examples; FIG. 1 is a sectional view of the main part of the first conventional example, FIG. 2 is a plan view of the same, FIG. 3 is a sectional view of the main part of another conventional example, and FIG. 5 and 6 are related to the present invention, FIG. 5 is a sectional view of a main part, and FIG. 6 is a plan view thereof. 1... Printed circuit board, 2... Insulated board, 3a. 3b...conductive pattern, 3c...connection section, 3d...conductive pattern removal section, 4...
...Chip parts, 4a...Electrode, 5...
- Housing, 6...Solder, 7...Resist.
Claims (1)
ップ部品の半田付は部と筐体の半田付は部との間におい
てスリット状の導電パターン除去部を形成すると共に接
続部を設け、該導電パターンを横断するようにレジスト
を前記接続部上に形成したことを特徴とするプリント基
板。Forming a slit-shaped conductive pattern removal portion between the soldering portion of the chip component and the soldering portion of the housing on the conductive pattern for soldering the chip portion and the casing, and providing a connecting portion; A printed circuit board characterized in that a resist is formed on the connection portion so as to cross the conductive pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9730481U JPS6038292Y2 (en) | 1981-06-30 | 1981-06-30 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9730481U JPS6038292Y2 (en) | 1981-06-30 | 1981-06-30 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS585372U true JPS585372U (en) | 1983-01-13 |
| JPS6038292Y2 JPS6038292Y2 (en) | 1985-11-15 |
Family
ID=29892116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9730481U Expired JPS6038292Y2 (en) | 1981-06-30 | 1981-06-30 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6038292Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117529U (en) * | 1984-12-29 | 1986-07-24 | ||
| JP2007250525A (en) * | 2006-02-20 | 2007-09-27 | Kyoshin Kogyo Co Ltd | Flat type ground terminal and its surface mounting method |
-
1981
- 1981-06-30 JP JP9730481U patent/JPS6038292Y2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61117529U (en) * | 1984-12-29 | 1986-07-24 | ||
| JP2007250525A (en) * | 2006-02-20 | 2007-09-27 | Kyoshin Kogyo Co Ltd | Flat type ground terminal and its surface mounting method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6038292Y2 (en) | 1985-11-15 |
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