JPS6071192U - Printed board - Google Patents

Printed board

Info

Publication number
JPS6071192U
JPS6071192U JP16181383U JP16181383U JPS6071192U JP S6071192 U JPS6071192 U JP S6071192U JP 16181383 U JP16181383 U JP 16181383U JP 16181383 U JP16181383 U JP 16181383U JP S6071192 U JPS6071192 U JP S6071192U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
printed board
chassis
taller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16181383U
Other languages
Japanese (ja)
Inventor
憲 五十嵐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pioneer Corp
Original Assignee
Pioneer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corp filed Critical Pioneer Corp
Priority to JP16181383U priority Critical patent/JPS6071192U/en
Publication of JPS6071192U publication Critical patent/JPS6071192U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のプリント基板と、シーヤーシとの絶縁方
法を示す側面図、第2図はこの考案によるプリント基板
を用いた状態を示す側面図、第3図はこの考案に用いら
れるチップ部品の拡大図である。 1・・・・・・シャーシ、2・・・・・・インシュレー
タ1.3・・・・・・プリント基板、4・・・・・・チ
ップ部品。
Fig. 1 is a side view showing a conventional method of insulating a printed circuit board and a seamstress, Fig. 2 is a side view showing a state in which the printed board according to this invention is used, and Fig. 3 is a side view showing a state in which a printed circuit board according to this invention is used. This is an enlarged view. 1... Chassis, 2... Insulator 1.3... Printed circuit board, 4... Chip parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シャーシ上に載置されるプリント基板において、該プリ
ント基板の上記シャーシと対向する面に、他の半田部分
よりも背が高く、外面が絶縁モールドされたチップ部品
を複数個配設したことを特徴とするプリント基板。
A printed circuit board placed on a chassis is characterized in that a plurality of chip components, which are taller than other solder parts and have insulation molded outer surfaces, are arranged on the surface of the printed circuit board facing the chassis. printed circuit board.
JP16181383U 1983-10-19 1983-10-19 Printed board Pending JPS6071192U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16181383U JPS6071192U (en) 1983-10-19 1983-10-19 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16181383U JPS6071192U (en) 1983-10-19 1983-10-19 Printed board

Publications (1)

Publication Number Publication Date
JPS6071192U true JPS6071192U (en) 1985-05-20

Family

ID=30355507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16181383U Pending JPS6071192U (en) 1983-10-19 1983-10-19 Printed board

Country Status (1)

Country Link
JP (1) JPS6071192U (en)

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