JPS5856442A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide inexpensively a semiconductor device having a cap with a light transmitting window which satisfies the bonding strength and airtightness by employing iron-nickel-cobalt alloy or an iron-nickel alloy. CONSTITUTION:A titanium ring 33, a light transmitting window member 3 made of sapphire, a silver solder 32 having 72% of silver and 28% of copper and a weight 34 are assembled with a cap 31 formed in a cap shape, are heated at approx. 950 deg.C in vacuum or in inert atmosphere, thereby hermetically sealing the cap and the light transmitting window member. A titanium member which is interposed between the cap and the hermetically sealing part made of the window member is mixed with 15-60% by weight of titanium and the remainder of the silver solder. In this manner, a photosemiconductor element is placed on the cap which is hermetically sealed with the member 3 to weld and fix a substrate bonded via a connecting wire to a semiconductor element and a lead terminal, and the element is hermetically sealed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device commonly used in the field of electronics such as Kotsugo, and a method for manufacturing the same. A semiconductor device having a cap that is equipped with a window member and hermetically sealed using a sealing member ↓ and a method for manufacturing the same There are two methods for manufacturing a cap with a window for light transmission in a semiconductor device by this woodcutter. Proposed. The first method is a metallization method, in which a mixture of metal powder such as manganese that easily forms oxides is coated on the hermetically sealed upper part of a light-transmitting window member made of qmt sapphire, etc., and then fired. The surface of the hermetically sealed portion is metallized (metallized) in advance, and then a solder alloy such as silver solder is used to hermetically seal the cap and the metalized portion of the light transmitting window member.

A cross-sectional view of a light-transmitting window cap using such a method is shown in FIG. 1.

In the figure, x (1 is a cap made of titanium, iron-nickel-cobalt alloy (Kovar), etc., 2 is a light-transmitting window, 3 is a light-transmitting window member made of sapphire, etc., 4 is a metallized layer, and 5 is a silver solder. However, such an airtight sealing method requires that the light-transmitting window member be subjected to the above-mentioned metallization treatment in advance, which complicates the manufacturing process and increases the cost.

The latter method is an active alloying method using a sealing member that combines titanium, zirconium, and silver solder. This becomes titanium when heated to high temperatures in a vacuum.

Zirconium etc. diffuses into the silver solder and also diffuses into the oxide of the light-transmitting window material, causing it to strongly adhere to oxygen.
t to perform airtight sealing. The hermetic sealing method using this active alloying method uses sapphire for the single-transmission window member, titanium for the cap, and a 10% T single-core BT solder (titanium) in which the outer periphery of the titanium wire is coated with silver solder as the sealing member. 930 ~ in vacuum using a weight ratio of 10%)
It has been proposed to heat the product to 90°C and hermetically seal it. Although this active alloying method eliminates the need for metallizing the light-transmitting window member, it has the disadvantage that it requires the use of titanium for the cap, making it expensive in terms of cost, similar to the metallizing method.

Figure wIz shows a cross-sectional view of the essential parts of the cap with a window for light transmission in this case, where 21 is a cap made of titanium, 22 is a titanium wire, 23 is soldered with silver solder, and the temperature is reduced by 10% by heating during hermetic sealing. T1 core BT The silver solder melts and the titanium wire 2
2 and silver solder 23. In addition, part 2.3
shows the same part as part 2.3 in FIG. 1 above.

The present invention utilizes the latter active alloying method to create a cap with a window for light transmission that satisfies adhesive strength and airtightness by using iron-nickel-cobalt alloy or iron-nickel alloy instead of using titanium as a control surface. This is an attempt to provide a shoulder conductor device #tk at a low cost.

In addition, the inventor of the present invention obtained the patent application No. 170049/1983 by using an iron-nickel-cobalt alloy or a cap made of an iron-nickel base metal and a light-transmitting window member made of sapphire glass. The present invention proposes an airtight sealing structure that can be used in a higher temperature range than the airtight sealing structure proposed in the prior invention. According to iron-nickel-cobalt alloy or iron-
A light-transmitting window member made of a cap made of a nickel base metal and having a light-transmitting window and a dielectric material mainly composed of quartz:
In a semiconductor device including a cap with a light transmission window which is hermetically sealed via a JJ stopper member, the cap and the light transmission window member are hermetically sealed using a titanium member and a silver solder as a sealing member. A semiconductor device having a value of 7% is provided.

In addition, a cap made of iron-nickel-cobalt alloy or iron-nickel alloy and having a light-transmitting window and a light-transmitting window member made of a dielectric material mainly composed of quartz are hermetically sealed via a sealing member. In this method of manufacturing a semiconductor device having a cap with a light transmission window, there is provided a method for using a semiconductor device characterized by what the cap and the light transmission window member do.

The present invention is active 4! Utilizing the characteristics of the gold plating method, wax, titanium rings, titanium M, etc. are used to seal the airtight seal between the cap made of iron-nickel-cobalt alloy or iron-nickel alloy and the light-transmitting window member made of sapphire, etc. By heating the titanium material with metal interposed, the process takes advantage of the alloy liquefaction phenomenon in which titanium diffuses into the silver solder, and the titanium in the silver solder diffuses into the oxide of the light-transmitting window material, causing oxygen and The strong bond is used to create a strong airtight seal.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 3 is a sectional view showing an assembled ATM before hermetically sealing the gap with a window for light transmission according to the present invention.

In the figure, 31 is an iron-nickel-cobalt alloy, and 9 is a cap made of an iron-nickel alloy.

32 is Chisuro, 33 is titanium ring, 34 is carbon,
It is made of heavy duty 9 made of stainless steel. In addition, part 2.3r
C Shows the same part as Part 3 in Figure 1 above. It should be noted that the silver solder 3'2 may have a plate shape, or it may be inserted together with the titanium ring 33 between the middle wax 31 and the light transmitting window member 3.Also, the titanium ring 33 may be a wire. Even the state is better. In addition to punching thin titanium rings using titanium sheet metal press processing, they can also be procured by cutting titanium pipes into thin pieces.

Cap 31 formed into a cap shape by a well-known method
A titanium ring 33 was made, a light transmitting window member 3 made of sapphire, and a silver solder 3 made of a composition of 72% silver and 28% steel.
The cap and the light-transmitting window member can be hermetically sealed by assembling the 21-fold v34 (I-as shown in the figure) and heating it in a vacuum or in an inert atmosphere to approximately 9501. A partial sectional view is shown in FIG.

In addition, the titanium member interposed in the airtight upper part of the cap and the light transmission window member has a weight ratio of titanium of 15 to 6 with respect to the silver filter 5.
It is better to set it to 0%.

The rice supply for this experiment is shown in the table below.0 Is this the weight ratio of the titanium parts? According to the experiment, when the weight ratio of titanium is small, the titanium is not sufficiently diffused into the silver solder, and when it is less than 10%, an airtight seal cannot be achieved. If it is less than 15%, hermetic sealing is possible to some extent, but the airtightness and adhesive strength are insufficient, so it is not preferred for practical purposes10 Furthermore, the weight ratio of titanium increases6
If it exceeds 0%, the amount of silver solder decreases and the airtightness deteriorates, and the cross-over of the silver solder in the hermetic sealing part becomes unstable, resulting in a decrease in adhesive strength, which is not preferred in practice. In addition, the determination of airtightness F'i, l x 10
-" atm-cc/sea, detection sensitivity of 'IK-
90 Place the optical semiconductor element on the cap with the light-transmitting window member hermetically sealed, and bond the semiconductor element and the lead terminals using connecting wires. The semiconductor device of the present invention is completed by welding and fixing the substrate and hermetically sealing the semiconductor element.

An example of the semiconductor device in this state is shown in FIG. A connection [54 led out from the semiconductor element 52 is connected to the semiconductor element 53, and a nine-lead terminal 55 is a glass fixed to the eyelet 51 of the lead terminal 53i. Note that portions 2 and 3.31 to 33rr are the same portions as the respective portions shown in FIG. 4 above.

FIG. 6 shows another embodiment of the present invention, which differs from the one shown in FIG. 4 in that it uses an integral combination of titanium and silver solder as a sealing member.

That is, more titanium+l as shown in FIG. 7<Q)! JfR part' when hermetically sealed using a sealing member coated concentrically with silver solder on the outside as a T-core using the T-clad method, etc.
It is a tfr surface view. This sealing member is made of mackerel t on titanium wire.
It can be easily manufactured by tightly winding a coated wire into a t-coil shape and cutting it. According to this embodiment, one step of assembling the silver solder and the titanium member can be omitted, resulting in excellent mass productivity.

In addition, the sealing member is not limited to a concentric shape, and may be formed by punching with a titanium sheet metal press made by applying a laminated layer of titanium using a silver solder t-clad method or the like as shown in Figure 1. In this case, in addition to the same effect as the above-mentioned concentric arrangement, there is an effect that the distribution of the silver solder 9 in the hermetic sealing portion is extremely good.

In addition to the above-mentioned edge-shaped and plate-shaped sealing members, it is also possible to place spherical silver solder or titanium around the light-transmitting window member and heat it for airtight sealing. In this case, the weight ratio of titanium/silver solder should be 15 to 60% titanium (at t, z) as described above. According to the present invention, the cap is made of an iron-nickel-cobalt alloy. In addition, since the iron-nickel alloy is used to airtightly seal the cap and light transmitting window member without metalizing the light transmitting window member whose main component is quartz such as sapphire, the manufacturing process can be simplified. It is possible to provide a semiconductor device having a light-transmitting window cap that is simple, improves work efficiency and yield, is excellent in mass production, and satisfies adhesive strength and airtightness.

[Brief explanation of the drawing]

Figure 1 is a cross-sectional view of a cap with a light-transmitting window that has been subjected to conventional metallization treatment. Figure 2 is a cross-sectional view of the main part when a conventional 10-inch solder is used. FIG. 4 is a sectional view showing an assembled state of an embodiment of the invention, FIG. 4 is a sectional view of the main part after air sealing, and FIG. . In the diagram. 1.21.31 ...... Cap 2...
・・・・・・・・・Light transmission window 3・・・・・・・・・
...Light transmission window part number...Metalized layer 5.23, 32. )2 ・・・・・・・・・
Silver solder 22, 〒1・・・・・・Titanium wire 33, F3・・・・・・Chiku/Ring 34・・・・・・・・・
...Weight 51 .....Eyelet 52 ..... Base conductor element 53 ..... Lead terminal 64 ..... Dominant line diagram 6? ? Math 7 figure (+!12) (b)

Claims (1)

[Scope of Claims] (η Iron-nickel-cobalt alloy) A light-transmitting window member consisting of a cap having a light-transmitting window made of an iron-nickel alloy and a g-electronic material having a quartz-free earth component. A semiconductor device having a cap with a light transmitting window that is hermetically sealed via a member R, wherein the cap and the light transmitting window member are hermetically sealed as a titanium member and a sapphire T-sealing member. (2) The semiconductor device according to claim 1, wherein the titanium member has a weight ratio of 15 to 60% between the techno member and the silver solder. (3) ?-Nickel-cobalt alloy 9 rzm - A light transmitting window t made of nickel metal; a cap having a light transmitting window t; a light transmitting window member y made of a dielectric material mainly composed of quartz;
r: In the manufacturing method of a semiconductor device having a gap with a light transmitting window that is hermetically sealed through a sealing member r, titanium is added to the vicinity of the hermetically sealed portion of the cap and the light transmitting window member. Arrange the two parts with the iron solder r, and add the silver solder (!-71
11. A method for manufacturing a semiconductor device, which is characterized by hermetic sealing by melting in a hot bath. (4) The method for manufacturing a semiconductor g&direct according to claim 3, wherein the titanium member is hermetically sealed using a sealing member in which a silver solder layer is integrally formed.