JPS5873973A - Low temperature connector - Google Patents
Low temperature connectorInfo
- Publication number
- JPS5873973A JPS5873973A JP17103381A JP17103381A JPS5873973A JP S5873973 A JPS5873973 A JP S5873973A JP 17103381 A JP17103381 A JP 17103381A JP 17103381 A JP17103381 A JP 17103381A JP S5873973 A JPS5873973 A JP S5873973A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- male
- female
- low
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Inorganic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Glass Compositions (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、液体窒素、液体ヘリウム温度等の低温で使用
される低温デバイス実装用コネクタに関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a connector for mounting low-temperature devices that is used at low temperatures such as liquid nitrogen and liquid helium temperatures.
エレクトロニクス部品としてのコネクタは、従来通常で
は常温付近で使用されていた。近時コンピュータの超高
速化、大容量化に伴ない、シリコンデバイスに代り、ガ
リウムヒ素化合物半導体や新しい原理に基づくジョセフ
ソン素子の実用化研究が盛んになっている。これらの新
素子は何れも液体窒素あるいは液体ヘリウム中で使用さ
れるものであり、これが高密度実装されることにより初
めてコンピュータの超高速化が可能となる。そこで低温
で高密度実装に適したコネクタの開発が望まれていた。Connectors as electronic components have traditionally been used at around room temperature. In recent years, with the ultra-high speed and capacity of computers, there has been active research into the practical application of gallium arsenide compound semiconductors and Josephson elements based on new principles, instead of silicon devices. All of these new elements are used in liquid nitrogen or liquid helium, and only when they are densely packaged will it be possible to make computers extremely fast. Therefore, there was a desire to develop a connector suitable for high-density mounting at low temperatures.
従来のコネクタは、接触子にばね材料を用いて成形し、
嵌合時にそのばね力により接触力を与える構造がとられ
ていた。このようにばね力による接触力を利用するため
、その寸法を小さくすることが困難で小型化に限界があ
り、コネクタ端子密度を1本1−以上に高めることは構
造上著しく困難であり、デバイスの高密度実装上問題と
なっていた。またコネクタ端子数を50本以上にすると
、通常のコネクタでは挿抜力が大きくなり、その脱着は
一般には不可能になる欠点があった。この点を解決のた
め、雌コネクタの対向する対の両雌接触子間の間隔を広
狭に変える機構を備え、雄コネクタの挿入時にはその間
隔を広めておき挿抜力を要しないようにし、挿入後にそ
の間隔を狭めて接触させるようにしたZIFと呼ばれる
無挿抜力コネクタが開発されたが、構造が複雑になるた
めコネクタの小形化には不適であった。Conventional connectors use spring material to mold the contacts.
A structure was adopted in which contact force was applied by the spring force when mating. Since the contact force from the spring force is used in this way, it is difficult to reduce the dimensions and there are limits to miniaturization, and it is extremely difficult due to the structure to increase the density of connector terminals to more than 1. This was a problem in high-density packaging. Furthermore, when the number of connector terminals is increased to 50 or more, the insertion and removal force of a normal connector becomes large, and there is a drawback that it is generally impossible to connect and remove the connector. To solve this problem, a mechanism is provided to widen or narrow the gap between the female contacts of opposing pairs of female connectors. A no-insertion/extraction-force connector called ZIF was developed in which the distance between the connectors was narrowed and the connectors were brought into contact with each other, but the structure was complicated and it was not suitable for miniaturizing the connector.
本発明は上記の点にかんがみ、従来のような機構を要し
なく無挿抜力で、小形化して高密度実装し得る低温用コ
ネクタを提供するものであって、以下図面について詳細
に説明する。In view of the above-mentioned points, the present invention provides a low-temperature connector that does not require a conventional mechanism, requires no insertion/extraction force, is compact, and can be mounted at high density.
第1図は本発明の一実施例を示し、1は雄コネクタの雄
接触子であって、Fe−56重量%N1合金の例えば厚
さ0 、151111 、幅0.4m、長さ5mの低温
における低収縮材2と、Cu −!i3%Zn合金の例
えば厚さ0.15■、幅o、’$1111、長さ5−の
低温における高収縮材3とを張り合わせたものの上に厚
さ0.2μ、のAuめつきを施したものである。4はA
BS樹脂からなる雄接触子支持部材であって、列設した
雄接触子1の一端を埋込み支持している。FIG. 1 shows an embodiment of the present invention, in which 1 is a male contact of a male connector, which is made of Fe-56wt%N1 alloy, for example, with a thickness of 0,151111, a width of 0.4 m, and a length of 5 m. Low shrinkage material 2 and Cu −! For example, Au plating with a thickness of 0.2μ is applied on a material made of i3% Zn alloy, which is laminated with a high shrinkage material 3 at low temperature, having a thickness of 0.15cm, a width o, '$1111, and a length 5-. This is what I did. 4 is A
This is a male contact support member made of BS resin, and supports one end of the male contacts 1 arranged in a row embedded therein.
5はABSw脂よpなる雌コネクタのハウジングであっ
て、本体部6と、この本体部6の一端側に固着され、そ
の間に対向する6対の列設した雌接触子8の一端を固定
する押え板7とよりなっている。Reference numeral 5 denotes a housing of a female connector made of ABSW, which is fixed to a main body 6 and one end side of the main body 6, and fixes one end of six pairs of female contacts 8 arranged in a row facing therebetween. It consists of a presser plate 7.
雌接触子8は例えば厚さ0.2μm+、幅0.6簡のC
u板上にAuめつきを施されたものよりなる。The female contact 8 is, for example, C with a thickness of 0.2 μm+ and a width of 0.6 μm.
It consists of a U plate with Au plating applied to it.
雌コネクタと雄コネクタとが嵌合した状態において、常
温では第1図(b)に示すように雄接触子1と雌接触子
8との間に間隙があシ接触力が生じないようになされ、
低温時には雄接触子1が第1図(C)に示すように彎曲
して雌接触子8との間に接触8
力が発生するよう対向する両雌接触子令、4間の間隔が
選ばれている。従って雌雄両コネクタを常温において脱
着すれば挿抜力を殆んど要しない。When the female connector and the male connector are fitted together, at room temperature there is a gap between the male contact 1 and the female contact 8, as shown in FIG. 1(b), so that no contact force is generated. ,
The spacing between the two opposing female contacts 4 is selected so that at low temperatures, the male contact 1 bends as shown in Figure 1 (C) and a contact force is generated between the male contact 1 and the female contact 8. ing. Therefore, if both the male and female connectors are connected and disconnected at room temperature, almost no insertion or removal force is required.
雄接触子1と雌接触予電の寸法を前記例示のよ 8
うなものとし、対向する対の両雌接触子番、会間の間隔
t−0,5■とじた場合、液体窒素中に浸漬すると、雄
接触子1の先端部でのたわみ量は約0.4■となるので
、雌雄両コネクタ嵌金時の雌雄固接触子各、1の接触力
は100f以上になり、接触抵抗は0.1ml以下の極
めて低く安定した接触特性が得られた。雌雄接触子1.
8の幅寸法も更に小さくしても上記のような動作をして
充分な接触力を得ることができ、端子間隔を1m以下に
でき、無挿抜力のため端子数も従来より遥かに多くでき
る。If the dimensions of the male contact 1 and the female contact pre-electric are as shown in the above example, and the numbers of both female contacts of the opposing pair are set, and the distance between the contacts is t-0,5, then immersed in liquid nitrogen. Then, since the amount of deflection at the tip of the male contact 1 is approximately 0.4 mm, the contact force of the male and female solid contacts 1 when both male and female connectors are fitted becomes 100 f or more, and the contact resistance is 0. Very low and stable contact characteristics of .1 ml or less were obtained. Male and female contacts1.
Even if the width dimension of 8 is made even smaller, sufficient contact force can be obtained through the operation described above, the terminal spacing can be reduced to 1 m or less, and the number of terminals can be much larger than before because there is no insertion/extraction force. .
第2図は他の実施例を示し、11は雌接触子であって、
Fe−56%Ni合金の例えば厚さ0.1瓢、幅0.8
mの低収縮材12と、Cu −55%Zn合金の例え
ば厚さ0.11111%幅0.8mの高収縮材13を張
シ合わせたものよりなり、低収縮材120表面側すなわ
ち雄接触子との接触側のみ例えば2μm厚のAuめつき
を施しである。14はABS樹脂からなる雌コネクタの
ハウジングであって、本体部15と、この本体部15の
一端に固着されて雌接触子11の一端の直角折曲部を固
定する押え板16とよりなっている。17は9ん青銅の
例えば厚さ0.2瓢幅0.5.、長さ4■からなる雄接
触子であって、その表面にはAuめつきを2 pmの厚
さに施しである。18は列設した雄接触子17の各一端
部を埋め込んだABS樹脂よりなる雄コネクタの雄接触
子支持部材である。FIG. 2 shows another embodiment, in which 11 is a female contact,
Fe-56%Ni alloy, for example, thickness 0.1 gourd, width 0.8
The low shrinkage material 12 is made of a Cu-55% Zn alloy, for example, with a thickness of 0.11111% and a width of 0.8 m, stretched together. For example, only the side in contact with is plated with Au with a thickness of 2 μm. Reference numeral 14 denotes a female connector housing made of ABS resin, which includes a main body 15 and a holding plate 16 that is fixed to one end of the main body 15 and fixes the right-angled bent portion of one end of the female contact 11. There is. 17 is made of bronze with a thickness of 0.2 mm and a width of 0.5 mm. This is a male contact with a length of 4 mm, and its surface is plated with Au to a thickness of 2 pm. Reference numeral 18 denotes a male contact support member of a male connector made of ABS resin in which one end of each of the male contacts 17 arranged in a row is embedded.
雄コネクタと雌コネクタとが嵌合した状態において、対
向する対の両雄接触子11.11間の距離は常温では第
2図(b)に示すように対向する対の両雄接触子11と
雄接触子17との間に間隙があり接触力の発生はないよ
うにされ、低温例えば液体窒素に浸漬したときの温度下
で竺第2図(C)に示すように呻接触子11の高収縮材
12と低収縮材板13との収縮差による変形により雄接
触子17と?1接触子11との間に接触力が発生するよ
うに選ばれる。When the male connector and the female connector are mated, the distance between the opposing pairs of male and female contacts 11 and 11 is as shown in FIG. 2(b) at room temperature. There is a gap between the contact member 17 and the high shrinkage material of the contact member 11 so that no contact force is generated. 12 and the low shrinkage material plate 13 due to the deformation due to the difference in shrinkage, the male contact 17 and ? 1 contactor 11 so that a contact force is generated between them.
雄接触子17と雌接触子11の寸法を前記例のようにし
、対向する両雄接触子11 、11間の距離を0.5−
とした場合、液体窒素Tで使用したとき、雌雄接触子の
接触力は150f以上になp1接触抵抗0.1ml以下
の極めて低く安定した接触特性が得られた。雄接触子1
7と雌接触子の幅は前記の例より更に小さくできるので
端子間隔を1m以下にでき小形にできる。The dimensions of the male contact 17 and the female contact 11 are set as in the above example, and the distance between the opposing male and female contacts 11 is set to 0.5-
In this case, when used in liquid nitrogen T, the contact force between the male and female contacts was 150 f or more, and extremely low and stable contact characteristics were obtained with p1 contact resistance of 0.1 ml or less. Male contact 1
Since the widths of 7 and the female contact can be made smaller than in the above example, the terminal spacing can be reduced to 1 m or less, resulting in a compact design.
本発明は以上のように、雄接触子と雌接触子のうちの一
方を低温における高収縮材と低収縮材との張9合わせに
より形成し、常温においては両液触子間に接触力は生ぜ
ず、低温において変形することにより雌雄両接触子間に
接触力が発生するようにしたものであるから、接触子の
幅を小さくしても充分その機能を発揮させることができ
、また無挿抜力にするための他の機構を要せず、従って
小形にして高密度端子のものとすることができ、しかも
また従来のばね材料の接触子のようなばね性の劣化によ
る接触性能の劣化がなく、長期にわたり接触性能が劣化
せず信頼性の優れたものとなる。As described above, in the present invention, one of the male and female contacts is formed by laminating high-shrinkage material and low-shrinkage material at low temperature, and the contact force between the two liquid contactors at room temperature is Since the contact force is generated between the male and female contacts by deforming at low temperatures, it is possible to fully demonstrate its function even if the width of the contact is small, and there is no need for insertion or removal. It does not require any other mechanism to generate force, so it can be made compact and has a high density terminal, and it also avoids the deterioration of contact performance due to deterioration of springiness as in conventional spring material contacts. Therefore, the contact performance does not deteriorate over a long period of time, resulting in excellent reliability.
第1図は本発明の一実施例を示し、同図(a>は断面図
、同図(b)は常温時の嵌合状態を示す断面図、同図(
C)は低温時の嵌合状態を示す断面図、第2図は他の実
施例を示し、同図(a) ti断面図、同図(b)は常
温時の嵌合状態を示す断面図、同図(C)は低温時12
・・・低温における低収縮材、3.13・・・低温にお
ける高収縮材
′#−j図
((1)
(θ)
、。1.、(C)FIG. 1 shows an embodiment of the present invention, in which (a) is a sectional view, FIG.
C) is a cross-sectional view showing the fitted state at low temperature, FIG. 2 shows another embodiment, FIG. 2(a) is a ti cross-sectional view, and FIG. , the same figure (C) is 12 at low temperature.
...Low shrinkage material at low temperature, 3.13...High shrinkage material at low temperature'#-j diagram ((1) (θ), .1., (C)
Claims (1)
材と低収縮材との張り合わせたものより形成し、雄コネ
クタと雌コネクタの嵌合時に常・1温では上記両液触子
間には接触力が生じなく、低温では低温における高収縮
材と低収縮材とを張シ合わせて形成した接触手の変形に
より上記両接触子゛間に接触力が発生するよ□うにした
ことを特徴とする低温用コネクタ。One of the male and female contacts is made of a material laminated with a high-shrinkage material and a low-shrinkage material at low temperatures, and when the male and female connectors are mated, there is a gap between the two liquid contactors at normal temperature. □There is no contact force generated between the two contacts, but at low temperatures, the contact force is generated between the two contact pieces due to the deformation of the contact hand formed by stretching a high-shrinkage material and a low-shrinkage material at low temperatures. Characteristic low-temperature connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17103381A JPS5873973A (en) | 1981-10-26 | 1981-10-26 | Low temperature connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17103381A JPS5873973A (en) | 1981-10-26 | 1981-10-26 | Low temperature connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5873973A true JPS5873973A (en) | 1983-05-04 |
Family
ID=15915836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17103381A Pending JPS5873973A (en) | 1981-10-26 | 1981-10-26 | Low temperature connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5873973A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130390U (en) * | 1982-02-26 | 1983-09-03 | 富士通株式会社 | electronic device socket |
| JPS5931583A (en) * | 1982-08-13 | 1984-02-20 | 日本電気株式会社 | Cryogenic connector |
| US4950173A (en) * | 1983-06-15 | 1990-08-21 | Hitachi, Ltd. | Service temperature connector and packaging structure of semiconductor device employing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5453288A (en) * | 1977-10-04 | 1979-04-26 | Fujitsu Ltd | Zero-force connector |
-
1981
- 1981-10-26 JP JP17103381A patent/JPS5873973A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5453288A (en) * | 1977-10-04 | 1979-04-26 | Fujitsu Ltd | Zero-force connector |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58130390U (en) * | 1982-02-26 | 1983-09-03 | 富士通株式会社 | electronic device socket |
| JPS5931583A (en) * | 1982-08-13 | 1984-02-20 | 日本電気株式会社 | Cryogenic connector |
| US4950173A (en) * | 1983-06-15 | 1990-08-21 | Hitachi, Ltd. | Service temperature connector and packaging structure of semiconductor device employing the same |
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