JPS5874094A - Method of producing printed circuit sheet - Google Patents
Method of producing printed circuit sheetInfo
- Publication number
- JPS5874094A JPS5874094A JP17360881A JP17360881A JPS5874094A JP S5874094 A JPS5874094 A JP S5874094A JP 17360881 A JP17360881 A JP 17360881A JP 17360881 A JP17360881 A JP 17360881A JP S5874094 A JPS5874094 A JP S5874094A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- soluble
- printed
- metal
- electrically insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title description 7
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 38
- 239000011888 foil Substances 0.000 claims description 30
- 238000005530 etching Methods 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000009429 electrical wiring Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 1
- 239000000976 ink Substances 0.000 description 20
- 230000007797 corrosion Effects 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 231100000572 poisoning Toxicity 0.000 description 2
- 230000000607 poisoning effect Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 206010011732 Cyst Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000011536 re-plating Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は金属箔を貼着し良電気絶縁性基材の金属箔上に
電気回路部分をのこして溶媒に可溶なインクにて印刷し
、可溶性印刷層を形成し。[Detailed Description of the Invention] The present invention involves attaching a metal foil, leaving an electric circuit portion on the metal foil as a base material with good electrical insulation, and printing with a solvent-soluble ink to form a soluble printed layer. .
ついで前記金属箔のエツチング剤に対して耐エツチング
性の金属蒸着膜を形成した後、１記可溶性印刷層を溶媒
で溶解除去するとともに可溶性印刷層上の金属蒸着膜を
も同時に除去して電気配線回路部分以外の金属箔を露出
させた後。Next, after forming a metal vapor deposited film that is resistant to etching with the etching agent for the metal foil, the soluble printed layer (1) is dissolved and removed using a solvent, and the metal vapor deposited film on the soluble printed layer is simultaneously removed to form electrical wiring. After exposing the metal foil other than the circuit part.
金属箔の露出部分をエツチング剤で腐食除去して電気絶
縁性基材上に導電回路を形成せしめることを特徴とする
印刷配線シートの製造法に係シ、使用に際して電気的接
続が容易にかつ確実に行える印刷配線シートを得ること
を目的とするものである。A method for manufacturing a printed wiring sheet characterized by forming a conductive circuit on an electrically insulating substrate by corroding and removing exposed portions of metal foil with an etching agent, which facilitates and secures electrical connection during use. The purpose is to obtain a printed wiring sheet that can be printed.
従来、この種印刷配線シートは飽和ポリエステＡ／Ｖ−
ト、フェノール樹脂積層板、エポキシ樹脂積層板、その
他の電気絶縁性基材の上に、鋼箔、アルミニウム箔、そ
の他の金属箔を貼着すると共に前記金属箔表面に耐食イ
ンク（しシスト）にて所望の電気配線回路を印刷し、つ
いでエツチング溶液中に浸漬して非印刷部分の金属箔を
除去することによシミ気絶縁性基材上に所望の導電回路
を形成せしめていた。Conventionally, this type of printed wiring sheet is made of saturated polyester A/V-
A steel foil, aluminum foil, or other metal foil is pasted onto a phenol resin laminate, an epoxy resin laminate, or other electrically insulating substrate, and a corrosion-resistant ink (cyst) is applied to the surface of the metal foil. A desired conductive circuit was formed on the stain-free insulating substrate by printing a desired electrical wiring circuit thereon and then immersing it in an etching solution to remove the non-printed portions of the metal foil.
しかして、上記従来の耐食インクは非導電性である丸め
使用に際して半田付け、その他の方法で電気的に接続す
る場合に、接続部分の耐食インクを溶剤にて溶解除去し
たや或いは溶剤にて膨潤させ喪後、布されなどにてこす
って除去せねばならず、特に耐食インクが熱硬化型など
のインクの場合には該耐食インクの除去に非常な手間が
かがシ、また場合によっては耐食インクの除去が不完全
であう九少あるいは耐食インクの除去作業時に導電回路
を損傷しえシすることがあり、これが九めに電気的接続
不良を起すこともあり、さらに溶剤による火災、中毒等
の危険吃あった。However, the conventional corrosion-resistant ink mentioned above is non-conductive, so when soldering or other methods are used to make an electrical connection, the corrosion-resistant ink at the connection part is dissolved or removed with a solvent, or swells with a solvent. After mourning, the corrosion resistant ink must be removed by rubbing with a cloth, etc. Especially when the corrosion resistant ink is a thermosetting type ink, removing the corrosion resistant ink is very time consuming, and in some cases, the corrosion resistant ink must be removed. Incomplete removal of ink or corrosion-resistant ink may damage conductive circuits during removal work, which may lead to poor electrical connections, and may also cause fires, poisoning, etc. due to solvents. It was dangerous.
本発明はかかる点に鑑みてなされた本のであシ、上記従
来の印刷配線５ｙ−）の欠点をことごとく解消し、電気
的接続が容易にかつ確実に行える印刷配線シートの製造
法に関するものである。The present invention was developed in view of the above, and relates to a method for manufacturing a printed wiring sheet that eliminates all the drawbacks of the conventional printed wiring 5y-) and allows for easy and reliable electrical connection. .
以下本発明について図によ）さらに詳細に説明する。The present invention will be explained in more detail below (with reference to the drawings).
第１図ないし第５図轄本発明の印刷配線シートの製造法
を説明するための一部拡大断面図である。第１図におい
ては電気絶縁性基材１の片面に金属箔３が接着剤２を介
して貼着されている。第２図においては金属箔３上に電
気配線回路部分をのこして可溶性印刷層４が印刷され°
ている。第３図にｉいては耐エツチング性の金属蒸着膜
５が全面に蒸着されている。第４図においては第３図の
ものを溶媒で可溶性印刷層４を溶解するとともに可溶性
印刷層上の金属蒸着膜５をも同時に洗浄除去されている
。第５図は第４図において露出している金属箔３をエツ
チング剤で腐食除去して電気絶縁性基材１上に導電回路
が形成せしめられた本発明の印刷配線シートである。FIGS. 1 to 5 are partially enlarged cross-sectional views for explaining the method of manufacturing the printed wiring sheet of the present invention. In FIG. 1, a metal foil 3 is adhered to one side of an electrically insulating base material 1 with an adhesive 2 interposed therebetween. In FIG. 2, a soluble printing layer 4 is printed on a metal foil 3 leaving an electric wiring circuit part.
ing. In FIG. 3i, an etching-resistant metal deposition film 5 is deposited on the entire surface. In FIG. 4, the soluble printed layer 4 of FIG. 3 is dissolved with a solvent, and the metal vapor deposited film 5 on the soluble printed layer is also washed away at the same time. FIG. 5 shows a printed wiring sheet of the present invention in which a conductive circuit is formed on an electrically insulating base material 1 by corroding away the metal foil 3 exposed in FIG. 4 with an etching agent.
以上の説明から明らかなるごとく本発明の製造法により
得られる印刷配線シートは電気配線、、１．・１：
回路部分上には従・来の印刷配線シートのように非導電
性の耐食インク（レジスト）がないので半田付け、その
他の方法で電気的に接続する場合に、接続部分の耐食イ
ンクを溶剤にて溶解除′夫したり、膨潤させた後、布さ
れなどにてこすって除去したシする必要がないので省力
的であシ、その上耐食インクの除去が不完全であつ九り
あるいは耐食インクの除去作業時に導電回路を損傷した
シすることもないので使用に際して電気的接続がきわめ
て容易であシ、しかも確実に行えるという効果を発揮す
ることができ良のであって産業的価値はすこぶる大であ
る。As is clear from the above description, the printed wiring sheet obtained by the manufacturing method of the present invention is capable of producing electrical wiring.・1: Unlike conventional printed wiring sheets, there is no non-conductive corrosion-resistant ink (resist) on the circuit parts, so when making electrical connections by soldering or other methods, the corrosion-resistant ink on the connection parts There is no need to dissolve the ink with a solvent or swell it and then remove it by rubbing it with a cloth, etc., which saves labor.Moreover, the corrosion-resistant ink may not be removed completely. In addition, since the conductive circuit is not damaged during the removal work of the anti-corrosive ink, it is extremely easy to make electrical connections during use, and it can be done reliably, which is good for industrial value. It's quite large.
先ず本発明において使用する電気絶縁性基材−１として
は、喪とえばポリエチレンテレフタレート、ポリエチレ
ンナフタレート、ポリイミドなどのフィμムないしシー
Ｆ、フ、ノーｐｖｌｌ１ｍ積層板、エボキｖｔｉａｍ積
層板、その他通常の印刷配線シー）Ｋ使用される電気絶
縁性基材をあげることができる。First, the electrically insulating substrate 1 used in the present invention may be a film or a sheet made of polyethylene terephthalate, polyethylene naphthalate, polyimide, etc. Examples of electrically insulating substrates used in printed wiring sheets include:
また１本発明において使用する金属Ｗｉ３としては、た
とえば銅、アＩ４／ミニウム、その他通常の印刷配線Ｖ
−Ｆに使用される金属箔をあげることができる。In addition, the metal Wi3 used in the present invention includes, for example, copper, aluminum, and other ordinary printed wiring V.
-Metal foil used for F can be mentioned.
また前記電気絶縁性基材１と前記金属箔３との貼着に用
いる接着剤２としては印刷配線用金属箔貼積層板やシー
トなどに用いられている通常の接着剤が用いられる。た
とえばエボキＶ樹脂系、フェノー〜樹脂系、メラミン樹
脂系、クロロブレン系、ニトリル系などの接着剤が適宜
用いられる。Further, as the adhesive 2 used for adhering the electrically insulating base material 1 and the metal foil 3, a common adhesive used for metal foil laminated boards, sheets, etc. for printed wiring is used. For example, adhesives such as epoxy V resin type, phenol-resin type, melamine resin type, chloroprene type, and nitrile type are used as appropriate.
１＊、可溶性印刷層４に用いるインクとしては、九とえ
ばカゼイン、ニカワ、ゼラチン、ポリビニルアルコール
、ポリアクリルアミド、メチルセルロース、ヒドロキＶ
エチμ七μロース。1* Inks used for the soluble printing layer 4 include casein, glue, gelatin, polyvinyl alcohol, polyacrylamide, methyl cellulose, hydroxyl V
Echiμ7μloin.
メリビニ〜ピロリドン、ポリビニルアルコ−ル、ビニ〜
メチ〜エーテ〜−無水マレイン酸共重合体、アクリμ酸
エステル、メタアタリＮ酸エステμなどを主成分とする
水溶性ないし親水性のインクが火災、中毒等の危険もな
く好ましいものとしてあげることができる。また通常の
有機溶媒に可溶なインクも使用できることはいうまでも
ない。□これらインクをシルクスクリーン、ローμｍ染
、グラビア印刷など適当な手段により、＋ｍｍ全金属箔
３上可溶性印刷層４を設けるＫあ九如該電気配線回路を
設けるべき表面を所望の図柄で露出しその他の部分が被
覆されるよう印刷して可溶性印刷層４が形成される。Melivini~pyrrolidone, polyvinyl alcohol, vinyl~
Water-soluble or hydrophilic inks containing methyl-ether-maleic anhydride copolymers, acrylic acid esters, meta-acrylic acid esters, etc. as main ingredients are preferable because they do not pose risks such as fire or poisoning. can. It goes without saying that inks soluble in ordinary organic solvents can also be used. □ Apply these inks by silk screen, low μm dyeing, gravure printing, or other suitable means to form a soluble printing layer 4 on the +mm all-metal foil 3, exposing the surface on which the electric wiring circuit is to be provided with a desired pattern. The soluble printed layer 4 is formed by printing so that the other portions are covered.
またかかる可溶性印刷層４の厚さとしては通常Ｏ，Ｓ〜
３声の範囲が適当であり、溶Ｖ＆による洗浄によシきわ
めて容易かつ完全に該可溶性印刷層およびそのうえＫＴ
ｏる金属蒸着膜が溶解１九は剥離除去される。もしかか
る可溶性印刷層の厚さを３声以上で形成するときは、可
溶性印刷層上の金属蒸着膜の除去は可能であるが、可溶
性印刷層の除去が充分でない領内があり、ブロッキング
中蒸着時にガスを発生するなどの間層が生じる。また′
Ｑ、５声以下で形成するとき社。Further, the thickness of the soluble printed layer 4 is usually O, S ~
The 3-tone range is suitable and the soluble printing layer and also the KT
The metal vapor deposited film is dissolved and then peeled off. If the thickness of such a soluble printed layer is 3 or more, it is possible to remove the metal vapor deposited film on the soluble printed layer, but there are areas where the soluble printed layer is not removed sufficiently, and during the deposition during blocking. An interstitial layer occurs that generates gas. Also'
Q. Tokisha formed with five voices or less.
可溶性印刷層上の金属蒸着膜が完全に除去されず、本発
明の目的のために好ましく喰い。The metal deposited film on the soluble printing layer is not completely removed, which is preferable for the purposes of the present invention.
前記可溶性印刷層が形成された前記金属箔向側上には金
属蒸着膜５が設けられるが真空蒸着法、スパッタリング
法、イオ：レプレーティング法などの通常の蒸着方法に
よって形成すればよい、金属蒸着膜５を形成する蒸着金
属としては。A metal vapor deposition film 5 is provided on the side facing the metal foil on which the soluble printing layer is formed, and may be formed by a normal vapor deposition method such as a vacuum vapor deposition method, a sputtering method, or an io:replating method. As for the vapor-deposited metal that forms the film 5.
１記金属箔３に対するエツチング剤に対して耐エツチン
グ性の金属からえらばれ用いられる。The metal foil 3 is selected from metals that are resistant to etching with respect to the etching agent for the metal foil 3 mentioned above.
たとえば金属箔３がアルミニウム箔の場合には銀、金、
銅表どが、ｔた鋼箔の場合には、金。For example, if the metal foil 3 is aluminum foil, silver, gold,
Gold if the copper surface is made of steel foil.
クロムなどが用いられる。ま友アルミニウム箔と銀、金
、銅蒸着膜の組み合わせでは半田付けが可能となシ、耐
食性が陶土するなどの効果も有するものである。Chromium etc. are used. The combination of Mayu aluminum foil and silver, gold, and copper evaporated films has effects such as being able to be soldered and having corrosion resistance comparable to that of china clay.
第１図ないし第５図は本発明の印刷配線シートの製造法
を説明するための一部拡大断面図であシ、１は電気絶縁
性基材、２は接着剤、３は金属箔、４は可溶性印刷層、
５は金属蒸着膜である。
特許出願人 尾池工業株式会社
・ｌｌ’ｌ１１．、、、
′ｊ1 to 5 are partially enlarged cross-sectional views for explaining the method of manufacturing a printed wiring sheet of the present invention, in which 1 is an electrically insulating base material, 2 is an adhesive, 3 is a metal foil, and 4 is an electrically insulating base material. is a soluble printing layer,
5 is a metal vapor deposited film. Patent applicant: Oike Kogyo Co., Ltd. ll'l11. ,,, ′j
Claims (1)
回路部分をのこしてｌ＃Ｈに可溶なインクにて印刷し、
可溶性印刷層を形成し、ついで前記金属箔のエツチング
剤に対して耐エツチング性の金属蒸着膜を形成し九後％
前記可溶性印刷層を溶媒で溶解除去するとともに可溶性
印刷層上の金属蒸着膜を４同時に除去して電気配線回路
部分以外の金属箔を露出させた後、金属箔の露出部分を
エツチング剤で腐食除去して電気絶縁性基材上に導電回
路を形成せしめることを特徴とする印刷配線シートＯ１
ｌ造法。The electrical wiring circuit part is left on the metal foil of the electrically insulating base material to which the metal foil is attached, and printed with an ink soluble in l#H,
A soluble printing layer is formed, and then a metal vapor deposited film that is resistant to etching with respect to the etching agent of the metal foil is formed.
The soluble printed layer is dissolved and removed with a solvent, and the metal vapor deposited film on the soluble printed layer is simultaneously removed to expose the metal foil other than the electric wiring circuit portion, and then the exposed portion of the metal foil is corroded and removed with an etching agent. Printed wiring sheet O1 characterized in that a conductive circuit is formed on an electrically insulating base material by
l construction method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17360881A JPS5874094A (en) | 1981-10-28 | 1981-10-28 | Method of producing printed circuit sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17360881A JPS5874094A (en) | 1981-10-28 | 1981-10-28 | Method of producing printed circuit sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5874094A true JPS5874094A (en) | 1983-05-04 |
Family
ID=15963756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17360881A Pending JPS5874094A (en) | 1981-10-28 | 1981-10-28 | Method of producing printed circuit sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874094A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215790A (en) * | 1983-05-23 | 1984-12-05 | マルイ工業株式会社 | Method of producing printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54161065A (en) * | 1978-06-12 | 1979-12-20 | Tokyo Shibaura Electric Co | Method of forming thin film electrode |
| JPS553676A (en) * | 1978-06-23 | 1980-01-11 | Tokyo Shibaura Electric Co | Method of forming conductive pattern |
-
1981
- 1981-10-28 JP JP17360881A patent/JPS5874094A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54161065A (en) * | 1978-06-12 | 1979-12-20 | Tokyo Shibaura Electric Co | Method of forming thin film electrode |
| JPS553676A (en) * | 1978-06-23 | 1980-01-11 | Tokyo Shibaura Electric Co | Method of forming conductive pattern |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59215790A (en) * | 1983-05-23 | 1984-12-05 | マルイ工業株式会社 | Method of producing printed circuit board |
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