JPS5877044U - Thin film peeling device - Google Patents
Thin film peeling deviceInfo
- Publication number
- JPS5877044U JPS5877044U JP17269481U JP17269481U JPS5877044U JP S5877044 U JPS5877044 U JP S5877044U JP 17269481 U JP17269481 U JP 17269481U JP 17269481 U JP17269481 U JP 17269481U JP S5877044 U JPS5877044 U JP S5877044U
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film peeling
- peeling device
- tank
- mounting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は、本考案に係る薄膜剥離装置の一実施例を示す要部
断面図である。
図において、1は処理槽、2は載置板、3は載置板に設
けられた多数の孔、4は超音波振動子、5は超音波発振
器、6は槽カバー、7は複数個の液体噴射ノズル、8は
フィルタ、9は循環ポンプ、10は剥離液、11は半導
体ウェハを示す。The figure is a sectional view of essential parts showing an embodiment of a thin film peeling apparatus according to the present invention. In the figure, 1 is a processing tank, 2 is a mounting plate, 3 is a large number of holes provided in the mounting plate, 4 is an ultrasonic vibrator, 5 is an ultrasonic oscillator, 6 is a tank cover, and 7 is a plurality of holes. A liquid injection nozzle, 8 a filter, 9 a circulation pump, 10 a stripping liquid, and 11 a semiconductor wafer.
Claims (1)
け、処理すべき半導体ウェハを載置した載置板の上方に
、前記半導体ウェハに向けて剥離液を噴出する噴射ノズ
ルを配置し、かつ前記処理槽内に溜った剥離液に超音波
振動を与える超音波振動子を前記槽底部にそなえると共
に、前記槽内の′剥離液をフィルタを通して前記噴出ノ
ズルへ循環する手段を付設したことを特徴とする薄膜剥
離装置。A wafer mounting plate with a large number of holes is provided horizontally in the processing tank, and above the mounting plate on which semiconductor wafers to be processed are mounted, there is a spray nozzle that sprays a stripping liquid toward the semiconductor wafers. and an ultrasonic vibrator that applies ultrasonic vibration to the stripping solution accumulated in the processing tank is provided at the bottom of the tank, and means for circulating the stripping solution in the tank through a filter to the jet nozzle. A thin film peeling device characterized by being attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17269481U JPS5877044U (en) | 1981-11-19 | 1981-11-19 | Thin film peeling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17269481U JPS5877044U (en) | 1981-11-19 | 1981-11-19 | Thin film peeling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5877044U true JPS5877044U (en) | 1983-05-24 |
Family
ID=29964579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17269481U Pending JPS5877044U (en) | 1981-11-19 | 1981-11-19 | Thin film peeling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5877044U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62258735A (en) * | 1986-05-01 | 1987-11-11 | Nec Kyushu Ltd | Apparatus for recirculating chemical liquid |
-
1981
- 1981-11-19 JP JP17269481U patent/JPS5877044U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62258735A (en) * | 1986-05-01 | 1987-11-11 | Nec Kyushu Ltd | Apparatus for recirculating chemical liquid |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5865361U (en) | Electroless plating device for thin plates with through holes | |
| JPS5877044U (en) | Thin film peeling device | |
| JPS585342U (en) | Wafer surface treatment equipment | |
| JPS5922447U (en) | Plate making equipment equipped with ultrasonic vibration device | |
| JPH0296726U (en) | ||
| JP3339926B2 (en) | Partial plating equipment | |
| JPS59162162U (en) | Jet solder dip equipment | |
| JPS5976562U (en) | spray etching equipment | |
| JPS60111041U (en) | Semiconductor wafer cleaning equipment | |
| JPS6041951U (en) | Spray liquid treatment equipment | |
| JPH01136166U (en) | ||
| JPS5844838U (en) | Wafer cleaning and drying equipment | |
| JPS5827364U (en) | Plating device for IC lead frame | |
| JPS59169042U (en) | Liquid processing equipment | |
| JPS5840836U (en) | Wafer cleaning and drying equipment | |
| JPH0756888B2 (en) | Electronic device cooling device | |
| JPS6074775U (en) | Rotary surface treatment equipment | |
| JPS59195795U (en) | Electronics | |
| JPS6089964U (en) | jet solder bath | |
| JPS59112199U (en) | Jet decontamination equipment | |
| JPS6030534U (en) | Shower tub for washing wafers | |
| JPS5872160U (en) | Spray type surface treatment equipment | |
| JPS6075011U (en) | Resin waste melting equipment | |
| JPS5974887U (en) | cleaning equipment | |
| JPS60158772U (en) | Electronic parts cleaning equipment |