JPS5883024A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5883024A JPS5883024A JP18055381A JP18055381A JPS5883024A JP S5883024 A JPS5883024 A JP S5883024A JP 18055381 A JP18055381 A JP 18055381A JP 18055381 A JP18055381 A JP 18055381A JP S5883024 A JPS5883024 A JP S5883024A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- isocyanurate
- tris
- ester
- anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 23
- 239000000203 mixture Substances 0.000 title claims abstract description 15
- 150000002148 esters Chemical class 0.000 claims abstract description 13
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002253 acid Substances 0.000 claims abstract description 11
- 239000007983 Tris buffer Substances 0.000 claims abstract description 9
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000008064 anhydrides Chemical class 0.000 claims description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- -1 ester compound Chemical class 0.000 abstract description 10
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 7
- 238000001035 drying Methods 0.000 abstract description 5
- 150000005691 triesters Chemical class 0.000 abstract description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 4
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 abstract description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract description 3
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 abstract 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 description 5
- 239000004342 Benzoyl peroxide Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 150000005690 diesters Chemical class 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Chemical class 0.000 description 2
- 150000002978 peroxides Chemical group 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-M 2-Methyl-2-butenoic acid Natural products C\C=C(\C)C([O-])=O UIERETOOQGIECD-ARJAWSKDSA-M 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001728 carbonyl compounds Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- LDHQCZJRKDOVOX-IHWYPQMZSA-N isocrotonic acid Chemical compound C\C=C/C(O)=O LDHQCZJRKDOVOX-IHWYPQMZSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- UIERETOOQGIECD-ONEGZZNKSA-N tiglic acid Chemical compound C\C=C(/C)C(O)=O UIERETOOQGIECD-ONEGZZNKSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】 本発明はエポキシ樹脂組成物に関する。[Detailed description of the invention] The present invention relates to epoxy resin compositions.
一般にエポキシ樹脂とポリカルボン酸無水物および必［
ＥＫ応じて三級アミン、三級アミン塩。Generally, epoxy resin and polycarboxylic acid anhydride and
Tertiary amine, tertiary amine salt depending on EK.
四級アンモニウム塩などの硬化促進剤からなる配合物は
可使時間が艮〈、耐熱性や電気特性の優れた硬化物が得
られるため、［気機器の注型。Compounds containing curing accelerators such as quaternary ammonium salts have a long pot life, and produce cured products with excellent heat resistance and electrical properties.
埋込、含浸用に使用されている。ところで厳近の電気機
器の小型、軽量化に伴って電気絶縁材料の耐熱性がます
ます要求されるようになって来た。また省資源、省エネ
ルギーの観点からも配合物の廃棄ｔをできるだけ少なく
シ、かつ短時間に硬化させることが望ましい。たとえば
発電機や車両用モータ等の回転機のコイル含浸において
、硬化時にエポキシワニス（エポキシ樹脂とポリカルボ
ン酸無水物からなる配合物）がもれて、配合物がロスに
なる一刀・りでなく。Used for embedding and impregnation. However, as electrical equipment becomes smaller and lighter, there is an increasing demand for heat resistance of electrical insulating materials. Also, from the viewpoint of resource and energy conservation, it is desirable to minimize waste of the compound and to cure it in a short time. For example, when impregnating the coils of rotating machines such as generators and vehicle motors, epoxy varnish (a compound made of epoxy resin and polycarboxylic acid anhydride) leaks during curing, resulting in loss of the compound. .
絶縁層に空隙を生じるため電気絶縁性が低下する。この
ような場合空隙を埋めるためしばしば含浸・硬化工種を
２〜３回繰り返すことが必要であった。Since voids are formed in the insulating layer, electrical insulation properties are reduced. In such cases, it was often necessary to repeat the impregnation and curing process two or three times to fill the voids.
このような欠点を改良するため種々検討したところ、エ
ポキシ樹脂とポリカルボン酸無水物の配合物にトリス（
ヒドロキシアルキル）イソシアヌレートの不飽和−塩基
酸のエステルｔｍ加することにより優れた含浸性を有し
つつ９表面乾燥時間が短縮され作業性が改善されること
がわかり本発明に到達した。After conducting various studies to improve these drawbacks, we found that Tris (
It has been found that the addition of an unsaturated basic acid ester (tm) of hydroxyalkyl isocyanurate reduces surface drying time and improves workability while providing excellent impregnating properties, leading to the present invention.
すなわち９本発明は。In other words, the present invention is as follows.
囚 エポキシ樹脂。Prisoner epoxy resin.
（Ｂ） ポリカルボン酸無水物
および
（Ｃ））リス（ヒドロキシアルキル）インシアヌレート
の不飽和−塩基酸のエステル
を含有してなるエポキシ樹脂組成物に関する。The present invention relates to an epoxy resin composition comprising (B) a polycarboxylic anhydride and (C) an ester of an unsaturated basic acid of lis(hydroxyalkyl)in cyanurate.
本発明で使用されるエポキシ樹脂〔囚成分〕は、１分子
中に２ヶ以上のエポキシ基を有する化合物であり、たと
えばビスフェノールＡのジグリシジルエーテル、ノボラ
ック樹脂のポリグリシジルエーテル、多価アルコールの
ポリグリシジルエーテル、ポリカルボン酸のポリグリシ
ジルエステル、ポリグリシジルアミン、脂肪族環状エポ
キシドなどである。The epoxy resin [capacitor component] used in the present invention is a compound having two or more epoxy groups in one molecule, such as diglycidyl ether of bisphenol A, polyglycidyl ether of novolak resin, polyglycidyl ether of polyhydric alcohol, etc. These include glycidyl ether, polyglycidyl ester of polycarboxylic acid, polyglycidyl amine, and aliphatic cyclic epoxide.
またポリカルボン酸無水物〔（Ｂ）成分〕とじてはメチ
ルテトラヒドロ無水２タル酸、メチルへキサヒドロ無水
フタル酸、メチルエンドメチレンテトラヒドロ無水フタ
ル酸、ドデセニル無水コハク酸などの液状二塩基酸無水
物のほか、無水フタル酸、ヘキサヒドロ無水フタル酸、
テトラヒドロ無水フタル酸、無水トリメリット酸、−無
水ピロメリット酸、ベンゾフェノンテトラカルボン酸無
水物。Polycarboxylic acid anhydrides [component (B)] include liquid dibasic acid anhydrides such as methyltetrahydrodithalic anhydride, methylhexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, and dodecenylsuccinic anhydride. In addition, phthalic anhydride, hexahydrophthalic anhydride,
Tetrahydrophthalic anhydride, trimellitic anhydride, -pyromellitic anhydride, benzophenone tetracarboxylic anhydride.
ポリアゼライン酸無水物などが用いられる。Polyazelaic anhydride and the like are used.
トリス（ヒドロキシアルキル）イソシアヌレートの不飽
和−塩基酸のエステル〔（Ｃ）成分〕は。The ester of unsaturated basic acid of tris(hydroxyalkyl)isocyanurate [component (C)] is:
炭素瞭配テ蕃奉唾−不飽和結合を有する不飽和−４基酸
のカルボキシル基の間でエステル結合反応を行なわせて
得ることができる。ここでトリス（ヒドロキシアルキル
）イソシアヌレートとしては、トリス（ヒドロキシエチ
ル）イソシアヌレート、トリス（ヒドロキシプロピル）
イソシアヌレート、トリス（ヒドロキシブチル）イソシ
アヌレート等があり、上記不飽和−塩基酸としては、ア
クリル酸、メタアクリル酸、クロトン酸、イソクロトン
酸、チグリン酸、アンゲリカ酸、ウンデシリン酸、オレ
イン酸、リノール酸、リルン酸などが単独にまたは二種
以上用いられる。It can be obtained by carrying out an ester bonding reaction between the carboxyl groups of an unsaturated 4-base acid having carbon atoms and unsaturated bonds. Here, tris(hydroxyalkyl)isocyanurate includes tris(hydroxyethyl)isocyanurate, tris(hydroxypropyl)
These include isocyanurate, tris(hydroxybutyl)isocyanurate, etc., and the unsaturated basic acids mentioned above include acrylic acid, methacrylic acid, crotonic acid, isocrotonic acid, tiglic acid, angelic acid, undecylic acid, oleic acid, and linoleic acid. , lylunic acid, etc. may be used alone or in combination of two or more.
（Ｃ）成分としてハ、トリス（ヒドロキシアルキル）イ
ソシアヌレートのアクリル酸および／またはメタアクリ
ル酸のエステルが本発明のエポキシ樹脂組成物の硬化性
や硬化物の耐熱性や電気特性の点で特に好ましい。As component (C), esters of acrylic acid and/or methacrylic acid of tris(hydroxyalkyl)isocyanurate are particularly preferred in terms of the curability of the epoxy resin composition of the present invention and the heat resistance and electrical properties of the cured product. .
（Ｃ）成分としてはモノエステル、ジエステルまたはト
リエステルがあるが本発明の効果を効率的に達成するた
めには、トリエステルが８０Ｊ１量慢以上含まれるのが
好ましい。Component (C) may include monoester, diester or triester, but in order to efficiently achieve the effects of the present invention, it is preferable that triester is contained in an amount of 80J1 or more.
また本発明のエポキシ樹脂ｌ１１１成物は、熱筐たは元
により訝ｔｈＩ硬化させることが可能であり。Additionally, the epoxy resin 111 composition of the present invention can be cured in a thermal enclosure or under heat.
エポキシ樹脂とポリカルボン酸無水物との硬化に通常用
いられる三級アミン、三級アミン塩。Tertiary amines and tertiary amine salts commonly used for curing epoxy resins and polycarboxylic acid anhydrides.
四級アンモニウム塩、金属塩などの硬化促進剤のほかに
、＠鎖に不飽和基を有する（Ｃ）成分を重合させるに必
要なラジカル重合開始剤（たとえば過酸化ベンゾイル、
ターシャリープチルパーベンゾエート、ジターシャリ−
フチルバーベンゾエート、ジクミルパーオキサイド、ク
メンヒドロパーオキシドなどの過酸化物）や光重合開始
剤（たとえばベンゾフェノン、ベンゾイン。In addition to curing accelerators such as quaternary ammonium salts and metal salts, radical polymerization initiators (e.g. benzoyl peroxide, benzoyl peroxide,
Tertiary butyl perbenzoate, ditertiary
peroxides such as phthyl benzoate, dicumyl peroxide, cumene hydroperoxide) and photoinitiators (e.g. benzophenone, benzoin).
ベンゾインメチルエーテル、アセトフェノンなどのカル
ボニル化合物やスルフィド類、ハロゲン化物など）を添
加してもよい。これらは、（Ｃ）成分に対して０．１〜
０．５電會９６１！２用されるのが好ましい。Carbonyl compounds such as benzoin methyl ether and acetophenone, sulfides, halides, etc.) may be added. These are 0.1 to 0.1 to component (C).
It is preferable to use 0.5 electric power 961!2.
（Ｃ）成分の配合量に、エポキシ樹脂１００重量部に対
して５〜１００虚量部であり、１ｏｏｌ量部を越えると
硬化物の耐熱性（とくに熱変形温度）が低下し、ａ気特
性が低下する傾向があり、また５重量部未満では１表面
硬化性の点で効果が劣る傾向がある。表１Ｉ［ｉ硬化性
や硬化物の物性のバランスの点で１０〜８０ム量部が特
に好ましい。The blending amount of component (C) should be 5 to 100 imaginary parts per 100 parts by weight of the epoxy resin. If it exceeds 1 ool part, the heat resistance (especially heat distortion temperature) of the cured product will decrease, and the a-air properties will decrease. If the amount is less than 5 parts by weight, the effect tends to be poor in terms of surface hardening. Table 1I [i From the viewpoint of curability and balance of physical properties of the cured product, 10 to 80 parts by weight is particularly preferable.
（Ｂ）成分はカルボキシル基換算で囚成分のエポキシ樹
脂のエポキシ基１当鎗に対して０．６〜１．２当量、好
ましくは０．８〜１．０当量使用される。Component (B) is used in an amount of 0.6 to 1.2 equivalents, preferably 0.8 to 1.0 equivalents, in terms of carboxyl groups, per epoxy group of the epoxy resin as the carrier component.
以下１本発明について実施例で説明するが。The present invention will be explained below using examples.
これらはいずれも本発明の範囲を限定するものではない
。None of these are intended to limit the scope of the invention.
実施例１〜４
直径６０■の金属シャーレに表１に示す配合物ｌｆＰを
と？、１２０℃の乾燥器に放置して表面乾燥性を見た。Examples 1 to 4 The formulation lfP shown in Table 1 was placed in a metal Petri dish with a diameter of 60 cm. The surface drying property was observed by leaving it in a dryer at 120°C.
以下余白
（国
（１）エピコート８２８ニジエルケミカル社商品名、ビ
スフェノール人ジグリシジルエーテル
（２） ＨＮ−２２００：日立化成工業株式会社商品名
。The following margins (Country (1) Epicote 828 Nigel Chemical Co., Ltd. trade name, bisphenol diglycidyl ether (2) HN-2200: Hitachi Chemical Co., Ltd. trade name.
メチルテトラヒドロ無水フタル酸
（３） ＴＨＥＩＣ−ＴＡ ： ）リス（β−ヒドロキ
シエチル）イソシアヌレートのアクリル酸エステル〔ト
リエステル９３重量％、ジエステル７重量％〕
（４）２Ｅ４ＭＺ ：四国化成株式会社商品名、２−
エチル４−メチルイミダゾール
（５）ＢＰＯ：過酸化べ／ジイル
表１に示すように比較例１の組成物に比べて。Methyltetrahydrophthalic anhydride (3) THEIC-TA: ) Acrylic ester of lis(β-hydroxyethyl)isocyanurate [93% by weight of triester, 7% by weight of diester] (4) 2E4MZ: Shikoku Kasei Co., Ltd. product name, 2-
Ethyl 4-methylimidazole (5) BPO: be/diyl peroxide compared to the composition of Comparative Example 1 as shown in Table 1.
トリス（β−ヒドロキシエチル）イソシアヌレートのア
クリル酸エステルを含む実施例１〜４の組成物の方が表
面乾燥性が優れている。The compositions of Examples 1 to 4 containing the acrylic ester of tris(β-hydroxyethyl)isocyanurate have better surface drying properties.
実施例５
表２に示す配合物を１２０℃で５時間、ついで１５０℃
で１５時間硬化させた。Example 5 The formulation shown in Table 2 was heated at 120°C for 5 hours and then at 150°C.
It was cured for 15 hours.
硬化物の熱変形温度及び電気特性を表２に示す。Table 2 shows the heat distortion temperature and electrical properties of the cured product.
（注）
（１） エピコート８２８ 、ＨＮ−２２００、ＴＨ
ＥＩＣ−ＴＡ。(Note) (1) Epicote 828, HN-2200, TH
EIC-TA.
２Ｅ４ＭＺおよびＢＰＯは表１の（注）に１載したもの
である。2E4MZ and BPO are listed in the note in Table 1.
（２１ＴＨＥＩＣ−ＴＭ ： ）リス（βヒドロキシエ
チル）イソシアヌレートのメタクリル酸エステル〔トリ
エステル９ Ｆｆｉｌｌ＊ 、ジエステル７重量慢〕
表２に示すようにトリス（β−ヒドロキシエチル）イン
シアヌレートのアクリル酸またはメタクリル酸のエステ
ルを含有する冥施ガ５〜８の組成物は、（上記エステル
の添加量がエポキシ樹脂１００重量部に対して、５０重
量部以上になると硬化物のＨＤＴが若干低下するが、）
実用上の電気特性は充分満足する。(21THEIC-TM:) Methacrylic acid ester of tris(β-hydroxyethyl) isocyanurate [triester 9 Ffill*, diester 7 heavy weight] As shown in Table 2, acrylic acid ester of tris(β-hydroxyethyl)in cyanurate or The compositions of Meishigas 5 to 8 containing esters of methacrylic acid have the following properties: (If the amount of the ester added is 50 parts by weight or more based on 100 parts by weight of the epoxy resin, the HDT of the cured product will decrease slightly; )
Practical electrical characteristics are fully satisfied.
上記したように本発明のエポキシ樹脂組成物は。As described above, the epoxy resin composition of the present invention.
硬化時の表面乾燥性が優れており０回転機のコイル含浸
やコンデンサのディラグコートや積層用に有用である。It has excellent surface drying properties during curing and is useful for coil impregnation of zero-rotation machines, dirag coating of capacitors, and lamination.
また本発明で用いられるトリスヒドロキシアルキルイソ
シアヌレートの不飽和−塩基酸のエステルはエポキシ樹
脂やポリカルボン酸無水物と相溶性が優れており、しか
も配合物の粘度をドげるため含浸性が改良される。In addition, the unsaturated basic acid ester of trishydroxyalkyl isocyanurate used in the present invention has excellent compatibility with epoxy resins and polycarboxylic acid anhydrides, and also improves impregnation properties by reducing the viscosity of the formulation. be done.
Claims (1)
ートの不飽和−塩基酸のエステル を含有してなるエポキシ樹脂組成物。 ｚ トリス（ヒドロキシアルキル）イソシアヌレートの
不飽和−塩基酸のエステルがトリス（β−ヒドロキシエ
チル）イソシアヌレートのアクリル＃またはメタクリル
酸のエステルである％ｆｆ縛求の＃！囲糖１項記載のエ
ポキシ樹脂組成物。[Claims] 1. Epoxy resin. An epoxy resin composition comprising (B) a polycarboxylic anhydride and (C) an ester of an unsaturated basic acid of lis(hydroxyalkyl)in cyanurate. z # of the %ff constraint where the ester of the unsaturated-basic acid of tris(hydroxyalkyl)isocyanurate is an ester of acrylic # or methacrylic acid of tris(β-hydroxyethyl)isocyanurate! The epoxy resin composition according to item 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18055381A JPS5883024A (en) | 1981-11-10 | 1981-11-10 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18055381A JPS5883024A (en) | 1981-11-10 | 1981-11-10 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5883024A true JPS5883024A (en) | 1983-05-18 |
| JPH0124169B2 JPH0124169B2 (en) | 1989-05-10 |
Family
ID=16085284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18055381A Granted JPS5883024A (en) | 1981-11-10 | 1981-11-10 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5883024A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015232111A (en) * | 2014-05-13 | 2015-12-24 | 日本化薬株式会社 | Polyfunctional acid anhydride, thermosetting resin composition using the same, and cured product thereof |
-
1981
- 1981-11-10 JP JP18055381A patent/JPS5883024A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015232111A (en) * | 2014-05-13 | 2015-12-24 | 日本化薬株式会社 | Polyfunctional acid anhydride, thermosetting resin composition using the same, and cured product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0124169B2 (en) | 1989-05-10 |
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