JPS5883073A - Electrically conductive paint - Google Patents
Electrically conductive paintInfo
- Publication number
- JPS5883073A JPS5883073A JP18048081A JP18048081A JPS5883073A JP S5883073 A JPS5883073 A JP S5883073A JP 18048081 A JP18048081 A JP 18048081A JP 18048081 A JP18048081 A JP 18048081A JP S5883073 A JPS5883073 A JP S5883073A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- parts
- glass powder
- bismuth oxide
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003973 paint Substances 0.000 title claims abstract description 16
- 239000000843 powder Substances 0.000 claims abstract description 58
- 239000011521 glass Substances 0.000 claims abstract description 49
- 229910000416 bismuth oxide Inorganic materials 0.000 claims abstract description 20
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000004020 conductor Substances 0.000 abstract description 31
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052737 gold Inorganic materials 0.000 abstract description 6
- 239000010931 gold Substances 0.000 abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 229910052682 stishovite Inorganic materials 0.000 abstract description 2
- 229910052905 tridymite Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 239000011701 zinc Substances 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 239000001856 Ethyl cellulose Substances 0.000 description 11
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 11
- 229920001249 ethyl cellulose Polymers 0.000 description 11
- 235000019325 ethyl cellulose Nutrition 0.000 description 11
- 238000005476 soldering Methods 0.000 description 11
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 10
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 10
- 229940116411 terpineol Drugs 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 8
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical group CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 208000018999 crinkle Diseases 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052705 radium Inorganic materials 0.000 description 1
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、絶縁基板上に基板との密着性に優れ、かつハ
ンダ付は性の良好な厚膜導体全形成するための導電性塗
料に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive paint for forming a thick film conductor on an insulating substrate, which has excellent adhesion to the substrate and has good solderability.
導′亀性塗料は、セラミック、ガラス、ホウロウ引き鋼
板等の絶縁基板上にスクリーン印刷等の方法により塗布
した後、焼成することにより厚膜導体を形成するもので
ある。形成された導体は電子回路の配線導体や抵抗体の
端子電極、コンデンサの電極等として使用される。これ
らの導体には、リード線や各種電子部品がノ・ンダ付け
、熱圧着その他の方法で接続されている。このように導
ta塗料により形成された厚膜導体は、電子1頓路や電
子部品に組込まれて使用されるが、その使用時の発熱に
よりしば1〜.ば120℃位までの高温状態に長時間お
かれることがある。ところが従来、このような熱環境下
で長時1間使用した場合、導体と基板との密着強度が著
1〜く低下して、その結果導体が剥離したり、リード線
や部品か欠落するという欠点璧有していた。A conductive paint is applied to an insulating substrate such as a ceramic, glass, or enameled steel plate by a method such as screen printing, and then baked to form a thick film conductor. The formed conductor is used as a wiring conductor of an electronic circuit, a terminal electrode of a resistor, an electrode of a capacitor, etc. Lead wires and various electronic components are connected to these conductors by soldering, thermocompression bonding, or other methods. Thick film conductors formed with conductive paints are used by being incorporated into electronic circuits and electronic components, but they often generate heat during use. It may be left in high temperature conditions of up to 120°C for long periods of time. However, conventionally, when used for a long time in such a thermal environment, the adhesion strength between the conductor and the board decreases significantly, resulting in the conductor peeling off or lead wires or parts missing. It had its flaws.
このため・・ンダ付は性が良いのは言うまでもなく、熱
環境下で長時間使用しでも基板との密着強度の劣化が少
ないものが望まれていた。For this reason, there was a desire for something that not only has good soldering properties but also has minimal deterioration in adhesion strength to the substrate even when used for long periods of time in a hot environment.
本発明は、上記要求に応える厚膜導体を形成するための
導電性塗料であり、導電性粉末、結晶性ガラス粉末、非
結晶性ガラス粉末、酸化ビスマス粉末、有機ベヒクルと
からなるものである。The present invention is a conductive paint for forming a thick film conductor that meets the above requirements, and is composed of a conductive powder, a crystalline glass powder, an amorphous glass powder, a bismuth oxide powder, and an organic vehicle.
本発明の導′亀性塗料により形成される導体は、ハンダ
付け1王に優れ、 加えて前述のような熱環境下で使
用した時の密層強度の劣化を抑制できるものでめる。The conductor formed using the electrically conductive paint of the present invention has excellent soldering properties and is also capable of suppressing deterioration of dense layer strength when used in the above-mentioned thermal environment.
非結晶性ガラスを用いた導電性塗料により得られた電子
回路や電子部品などは、使用時の発熱による導体と基板
との密着強度の低下が大きい。そこで本発明者らは、非
結晶性ガラスに代えて結晶性ガラスを使用して研究を行
ったが、結晶化ガラスを用いると得られた導体膜のノ・
ンダ付は性が悪く、実用に耐えないことがわかった。こ
れは導体膜表面に結晶化カラスが多く存在するためであ
るOしかし結晶化ガラスを用いることにより基体との密
着性は良好となり、熱劣化も大幅に改善された0本発明
者らはハンダ付は性を改善するために酸化ビスマスを配
合したが、予想に反して・・ンダ付は性Iユ改善されな
かった。棟々の配合剤を試験した結果、結晶性カラス粉
末と酸化ビスマス粉末の組合せに更に非結晶性ガラス粉
末を添ノ用すると、・・ンダ付は性が非常に良好となり
、しかも耐熱劣化性にも悪影響を与えないことがわかっ
た。これ(は、非結晶性ガラスの添加により得られた導
体の六面にはガラスの存在量が非常に少なくなっており
、これにより)・ンダ付は性が改善されたものと考えら
れる。そして上述の作用効果は導電性ケ末、結晶性ガラ
ス粉末、非結晶社ガラス粉末、゛酸化ビスマス粉末の4
成分を使用した場合にのみ奏されるのであり、その1成
分を欠いてもかかる特有の効果は得られない。Electronic circuits and electronic parts obtained using conductive paints using amorphous glass suffer from a significant decrease in the adhesion strength between the conductor and the substrate due to heat generation during use. Therefore, the present inventors conducted research using crystalline glass instead of amorphous glass, but found that the conductor film obtained when crystallized glass
It was found that the soldering method was poor and could not be put to practical use. This is due to the presence of a large amount of crystallized glass on the surface of the conductor film.However, by using crystallized glass, the adhesion with the substrate is good and thermal deterioration is also significantly improved. Bismuth oxide was added to improve the properties of the product, but contrary to expectations, the properties of the product were not improved. As a result of testing various compounding agents, it was found that when amorphous glass powder was further added to the combination of crystalline glass powder and bismuth oxide powder, the soldering properties were very good, and the heat deterioration resistance was also improved. It was also found that there were no negative effects. This is because the amount of glass present on the six faces of the conductor obtained by adding non-crystalline glass is very small, and it is thought that this improves the soldering properties. The above-mentioned functions and effects include conductive powder, crystalline glass powder, amorphous glass powder, and bismuth oxide powder.
It is produced only when the components are used, and even if one component is missing, the unique effect cannot be obtained.
又、本発明の導電性塗料は・・ンダ付けを必要としない
場合にも使用される。たとえば導電性粉末として金を用
いて電子回路を形成し、これにIJ−ド線を熱圧着した
り、或いは金導体膜上に半導体素子を搭載(7たすする
場合があるが、これらの用途にも、本発明の塗料は表面
にカラスの少ない導体を形成するため、リード線の熱圧
庸や半導体の塔載が容易となるものである。The conductive paint of the present invention can also be used in cases where soldering is not required. For example, gold may be used as conductive powder to form an electronic circuit, and IJ-wires are thermocompression bonded to this, or semiconductor elements may be mounted on a gold conductor film (7). In addition, since the paint of the present invention forms a conductor with less crinkle on the surface, it facilitates heat compression of lead wires and mounting of semiconductors.
本発明に使用される導電・注粉末は、銀、金、)々ラジ
ウム、白金、銅、ニッケル、亜鉛及びこれらの金属の酸
化物から選ばれる少なくとも1種類の粉末であり、化学
的還元法、眠解法、機械的粉砕等の方法で得られるもの
である。The conductive powder used in the present invention is at least one type of powder selected from silver, gold, radium, platinum, copper, nickel, zinc, and oxides of these metals, and is processed by chemical reduction, It can be obtained by methods such as the sleeping method and mechanical crushing.
結晶性ガラス粉末としては、5i02−A120J−C
aO系、ZnO−PbO−B2O3系、ZnO−B2O
3系、Zn0−Bt03−8102糸、ZnO−PbO
−B2O3−8in□系ガラスなどが使用される。非結
晶性ガラスとしては、PbO−8i02−BzQs系、
PbO−8i0.系、PbQ−EliO2−Ax2o、
系、PbO−8iOI B20J11403系ガラス
などが使用される。これらガラスは、結晶性ガラスが少
ないと熱環境下で使用した時基板との1178強度が劣
化するO又結晶性ガラスが多いと、熱環境下で使用して
も基板との密着強度の劣化は小さいが、・・ンダが付き
にくく、リード線の接合や部品の搭載が困難となる。As the crystalline glass powder, 5i02-A120J-C
aO system, ZnO-PbO-B2O3 system, ZnO-B2O
3 series, Zn0-Bt03-8102 yarn, ZnO-PbO
-B2O3-8 inch square glass or the like is used. As the amorphous glass, PbO-8i02-BzQs system,
PbO-8i0. system, PbQ-EliO2-Ax2o,
glass, PbO-8iOI B20J11403 glass, etc. are used. If these glasses contain a small amount of crystalline glass, the strength of the bond with the substrate will deteriorate when used in a thermal environment.If there is a large amount of crystalline glass, the adhesion strength with the substrate will deteriorate even when used in a thermal environment. Although it is small, it is difficult to get undulations, making it difficult to join lead wires and mount components.
このため結晶性ガラスと非結晶性ガラスの使用割合は、
xfil′で10=90〜70:308度が好ましいO
酸化ビスマス粉末は、導電性塗料に通常使用されるもの
でよい。Therefore, the usage ratio of crystalline glass and amorphous glass is
xfil' is preferably 10=90 to 70:308 degrees O The bismuth oxide powder may be one commonly used for conductive paints.
有機ベヒクルとしては、エチルセルロース、ニトロセル
ロース、アルキッドm 脂等(!: シx −y−ル−
yタレート、テルピネオール、ブチルカルピトールアセ
テート
できる。Examples of organic vehicles include ethylcellulose, nitrocellulose, alkyd fat, etc.
y tallate, terpineol, butylcarpitol acetate.
そして本発明の導電性塗料は、導電性粉末100重量部
に対してガラス粉末0.5〜12皿量部、酸化ビスマス
粉末1〜20重量部が好適である0次に実施例ヲアげて
説明するが、本発明はこれに限定されるものではない。The conductive paint of the present invention preferably contains 0.5 to 12 parts by weight of glass powder and 1 to 20 parts by weight of bismuth oxide powder per 100 parts by weight of conductive powder. However, the present invention is not limited thereto.
尚、実施例中「部1はすべて車量部を示す0
実施例1
銀粉末 70部パラジウム
粉末 ろ0部酸化ビスマス粉末
8部結晶性ガラス粉末( Si02
LA1203 − CaO系)1部非結晶性ガラス粉末
( PbO−Sin.系) 6部エチルセルロース、
テルピネオール、プチルカルビトールアセテートヲ調合
した有機ベヒクル 22部
上記成分を充分混株して導電性塗料とし、これをスクリ
ーン印刷法によりアルミナ埜板に塗布し、150℃で1
0分間乾探した後、ベルト炉によりピーク温度85.0
℃で焼成して導体ケ得た0実施例2
銀粉末 70部パラジウム
粉末 30部酸化ビスマス粉末
10部結晶性ガラス粉末(SiO+2−
A1203−CaO系)3部非結晶性ガラス粉末(Pb
O−8in、−B203系)6部エチルセルロース、テ
ルピネオール、フチルカルビトールアセテートを調合し
た有機ベヒクル 22部上
記成分を実施例1と同様にして導体を形成した。In addition, in the examples, all "parts 1" indicate vehicle weight parts. Example 1 Silver powder 70 parts Palladium powder Filter 0 parts Bismuth oxide powder
8 parts crystalline glass powder (Si02
LA1203 - CaO system) 1 part amorphous glass powder (PbO-Sin. system) 6 parts ethyl cellulose,
22 parts of an organic vehicle prepared with terpineol and butyl carbitol acetate The above ingredients were thoroughly mixed to make a conductive paint, which was applied to an alumina plate by screen printing, and then heated at 150°C for 1 hour.
After drying for 0 minutes, the belt furnace reached a peak temperature of 85.0.
Example 2: Conductor obtained by firing at ℃ Silver powder: 70 parts Palladium powder: 30 parts Bismuth oxide powder
10 parts crystalline glass powder (SiO+2-
A1203-CaO system) 3 parts Amorphous glass powder (Pb
O-8in, -B203 series) 6 parts Organic vehicle containing ethyl cellulose, terpineol, and phthyl carbitol acetate 22 parts A conductor was formed using the above components in the same manner as in Example 1.
実施例3
銀粉末 70部パラジウム
粉末 60部酸化ビスマス粉末
10部結晶性ガラス粉末(5i02−A
120.−CaO系)3部非結晶性ガラス粉末(PbO
−’5i02系) 4都エチルセルロース、テルピネ
オール、プチルカルビトールアセテートヲ調合した有機
ベヒクル 22部上記成分
を実施例1と同様にして導体を形成した。Example 3 Silver powder 70 parts Palladium powder 60 parts Bismuth oxide powder
10 parts crystalline glass powder (5i02-A
120. -CaO system) 3 parts amorphous glass powder (PbO
-'5i02 series) 22 parts of an organic vehicle containing ethyl cellulose, terpineol, and butyl carbitol acetate A conductor was formed using the above components in the same manner as in Example 1.
実施例4
銀粉末 70部パラジウム
粉末 30部酸化ビスマス粉末
15部結晶性ガラス粉末(5i02
A1t03−CaO系)4.5部
非結晶性カラス粉末(PbO5iOt糸) 25部エチ
ルセルロース、チルビイ、オール、フチル刀ルビトール
アセテートを調合した有機ベヒクル
22部F記成分全実施例1と同様にして導体
を形成した。Example 4 Silver powder 70 parts Palladium powder 30 parts Bismuth oxide powder
15 parts crystalline glass powder (5i02
A1t03-CaO system) 4.5 parts Amorphous crow powder (PbO5iOt yarn) 25 parts Organic vehicle containing ethyl cellulose, chiruby, all, and phthyl rubitol acetate
Part 22 F Ingredients A conductor was formed in the same manner as in Example 1.
実施例5
銀粉末 88部パラジウム
粉末 12部酸化ビスマス粉末
1部部結晶性カラス粉床(ZnOB2O
3系) 6部非結晶性カラス粉末(PbO−8i
O2−B、os糸) 4 sエチルセルロース、テルピ
ネオール、フチルカルビトールアセテートi調合(−だ
有機ベヒクル 22部上記
成分を実施例1と同様にして導体を形成した。Example 5 Silver powder 88 parts Palladium powder 12 parts Bismuth oxide powder
1 part crystalline glass powder bed (ZnOB2O
3 series) 6 parts amorphous glass powder (PbO-8i
O2-B, OS yarn) 4s Ethyl cellulose, terpineol, phthyl carbitol acetate i Preparation (-) Organic vehicle 22 parts A conductor was formed using the above ingredients in the same manner as in Example 1.
実施例6
金粉末 100部酸化ビスマ
ス粉末 5部結晶性ガラス粉末(Z
nO−B203−8i02系)1.5部非結晶性ガラス
粉末(PbO−8i02系) 2部エチルセルロース
、テルピネオール、ジエチルフタレート全調合した有機
ベヒクル25部−ヒ記成分を実施例1と同様にして導体
を形成した。Example 6 Gold powder 100 parts Bismuth oxide powder 5 parts Crystalline glass powder (Z
nO-B203-8i02 series) 1.5 parts Amorphous glass powder (PbO-8i02 series) 2 parts Ethyl cellulose, terpineol, diethyl phthalate 25 parts of an organic vehicle in which all the components were prepared - A conductor was prepared using the above components in the same manner as in Example 1. was formed.
比較例1
銀粉末 70部パラジウム
粉末 60部酸化ビスマス粉本
10部結晶性ガラス粉末(Si02−A
1203−cao) 7部エチルセルロース、テルピ
ネオール、ブチル〃ルビトールアセテートヲ調合した有
機ベヒク、ル 22部
上記成分を実施例1と同様にして導体を形成したQ比較
例2
銀粉末 70部パラジウム
粉末 ろ0部酸化ビスマス粉末
10部非結晶性ガラス粉末(PPbO−
8in示) 7部エチルセルロース、テルピネオール
、プチルカルビトールアセテートヲ調ヤした有機ベヒク
ル 22部上記成分を実
施例1と同様にして導体を形成した。Comparative Example 1 Silver powder 70 parts Palladium powder 60 parts Bismuth oxide powder
10 parts crystalline glass powder (Si02-A
1203-cao) 7 parts Organic vehicle prepared from ethyl cellulose, terpineol, and butyl rubitol acetate 22 parts A conductor was formed using the above components in the same manner as in Example 1. Q Comparative Example 2 Silver powder 70 parts Palladium powder Filter 0 bismuth oxide powder
10 parts amorphous glass powder (PPbO-
A conductor was formed using the above ingredients in the same manner as in Example 1.
比較例6
銀粉末 70部パラジウム
粉末 ろ0部結晶性ガラス粉末(S
in、、−A120.−CaO系)6部非結晶性カラス
粉末(PbO−8]、 02系) 4部エチルセルロ
ース、テルピネオール、プチルカルビトールアセテート
ヲ調合した有機ベヒクル
22部上記成分を実施例1と同allこして導体金形成
し7こ〇比較例4
金粉末 100部酸化ビスマ
ス粉末 5部結晶性ガラス粉末(Z
nO−B2O3−8j、02系)6.5sエチルセルロ
ース、テルピネオール、ジエチルフタレート全調合した
M機ベヒクル25部上記成分を実施例1と同様にして導
体金形成した。Comparative Example 6 Silver powder 70 parts Palladium powder Filter 0 parts Crystalline glass powder (S
in,,-A120. -CaO type) 6 parts Amorphous crow powder (PbO-8], 02 type) 4 parts Organic vehicle prepared with ethyl cellulose, terpineol, and butyl carbitol acetate
22 parts All of the above components were filtered in the same manner as in Example 1 to form a conductive gold.Comparative Example 4 Gold powder 100 parts Bismuth oxide powder 5 parts Crystalline glass powder (Z
nO-B2O3-8j, 02 series) 6.5s ethyl cellulose, terpineol, diethyl phthalate 25 parts of M machine vehicle, all of which were blended. Conductive gold was formed using the above components in the same manner as in Example 1.
比較例5
金粉末 100部酸化ビスマ
ス粉末 5部非結晶性ガラス粉末(
5iOz−PbO系)6.5部エチルセルロース、テル
ピネオール、ジエチルフタレートを調合したM機ベヒク
ル25部上記成分を実施例1と同様にして導体を形成し
た。Comparative Example 5 Gold powder 100 parts Bismuth oxide powder 5 parts Amorphous glass powder (
5iOz-PbO system) 6.5 parts M machine vehicle containing ethyl cellulose, terpineol, and diethyl phthalate 25 parts A conductor was formed using the above components in the same manner as in Example 1.
このようにして形成した導体について基板との初期密着
強度、熱環境下に長時間放置した後U)密着頚興及びハ
ンダ付は性會測足し、その結果を表1に示した。初期密
N強度は1.51111 X 1.5 咽の導体に直径
0.51111のハンダメッキ銅線をSn 63 /
Pb67ハンダでハンダ付けした後、このl−ド線を基
板に垂直に引張り、導体が基板から剥離した時のkyl
i、で表わす。熱環境下に放置した後の密着強度は、導
体にリード線をハンダ付けし次いで150℃の温度に1
00時間保持した後の基板との密着強度を、初期密層強
度と同様に測定した0 (以下r150C100hr放
置後の密層強度」とい′5O)ハンダ付は性は、直径2
.5簡の5n63/Pb37z・ンダボールを導体上に
載せ、これ全230℃に加熱したホットプレートーヒに
20秒間保持した時のノ・ンダの拡がりをFlaw%で
示した0F10W%は次の式で表わされ、大きい程・・
/夕゛付は性が良い。The initial adhesion strength with the substrate of the conductor thus formed, and the properties of adhesion and soldering after being left in a heat environment for a long time were measured, and the results are shown in Table 1. Initial density N strength is 1.51111 x 1.5 Solder plated copper wire with a diameter of 0.51111 is Sn 63 /
After soldering with Pb67 solder, pull this lead wire perpendicularly to the board, and the kyl when the conductor peels off from the board.
Represented by i. The adhesion strength after being left in a heat environment is determined by soldering the lead wire to the conductor and then heating it to a temperature of 150℃ for 1 hour.
The adhesion strength with the board after being held for 00 hours was measured in the same way as the initial dense layer strength.
.. When 5 sheets of 5N63/Pb37z dowel balls are placed on a conductor and held on a hot plate heated to 230°C for 20 seconds, the spread of the no-da balls is expressed as FLOW%, and 0F10W% is expressed by the following formula. I mean, the bigger it is...
/Dinner is good quality.
但し実施例6と比較例4.5については、Sn6ろ/P
b37ハンダの代わりにIn 50/Pb 50 /−
ンダを使用した。However, for Example 6 and Comparative Example 4.5, Sn6ro/P
In 50/Pb 50/- instead of b37 solder
I used .
表 1
(注)比較例1.5.4については、リード線の・・/
ダ付けができないので密着強度は測定していない。比較
例2.5では150℃100hr放置後の密着強度の低
下が著しい。Table 1 (Note) Regarding Comparative Example 1.5.4, the lead wire.../
Adhesion strength was not measured because it could not be attached. In Comparative Example 2.5, the adhesion strength decreased significantly after being left at 150° C. for 100 hours.
実施例より明ら力・なように、本発明の導電性塗料によ
り形成される導体は、ノ・ンダ付は性か良好であるため
一リード線や電子部品の接続が強固に行われ、かつ長時
間鍋温に曝しても密着強度の劣イヒが小さいため、熱環
境下での使用にも充分耐えるものである。As is clear from the examples, the conductor formed using the conductive paint of the present invention has good soldering properties, so that the connection between lead wires and electronic components can be made firmly. Even if exposed to the pot temperature for a long time, there is little loss of adhesion strength, so it can withstand use in hot environments.
Claims (1)
酸化ビスマス粉末、有機ベヒクルとからなる導電性塗料
。conductive powder, crystalline glass powder, amorphous glass powder,
A conductive paint consisting of bismuth oxide powder and an organic vehicle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18048081A JPS5883073A (en) | 1981-11-11 | 1981-11-11 | Electrically conductive paint |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18048081A JPS5883073A (en) | 1981-11-11 | 1981-11-11 | Electrically conductive paint |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5883073A true JPS5883073A (en) | 1983-05-18 |
| JPS6253031B2 JPS6253031B2 (en) | 1987-11-09 |
Family
ID=16083953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18048081A Granted JPS5883073A (en) | 1981-11-11 | 1981-11-11 | Electrically conductive paint |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5883073A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02230605A (en) * | 1988-11-04 | 1990-09-13 | Asahi Glass Co Ltd | Conductor paste composition and ceramics substrate |
| JPH08153415A (en) * | 1994-11-29 | 1996-06-11 | Futaba Corp | Conductive paste |
| US6174462B1 (en) | 1998-01-20 | 2001-01-16 | Denso Corporation | Conductive paste composition including conductive metallic powder |
| JP2005063975A (en) * | 2003-08-14 | 2005-03-10 | E I Du Pont De Nemours & Co | Thick film conductor paste for automotive glass |
| WO2006055126A3 (en) * | 2004-11-12 | 2007-11-15 | Ferro Corp | Method of making solar cell contacts |
| US8093491B2 (en) | 2005-06-03 | 2012-01-10 | Ferro Corporation | Lead free solar cell contacts |
| US8236598B2 (en) | 2007-08-31 | 2012-08-07 | Ferro Corporation | Layered contact structure for solar cells |
| CN103177793A (en) * | 2011-12-26 | 2013-06-26 | 浙江昱辉阳光能源有限公司 | Electroconductive slurry for front electrode of solar battery and preparing method of electroconductive slurry |
-
1981
- 1981-11-11 JP JP18048081A patent/JPS5883073A/en active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02230605A (en) * | 1988-11-04 | 1990-09-13 | Asahi Glass Co Ltd | Conductor paste composition and ceramics substrate |
| JPH08153415A (en) * | 1994-11-29 | 1996-06-11 | Futaba Corp | Conductive paste |
| US6174462B1 (en) | 1998-01-20 | 2001-01-16 | Denso Corporation | Conductive paste composition including conductive metallic powder |
| JP2005063975A (en) * | 2003-08-14 | 2005-03-10 | E I Du Pont De Nemours & Co | Thick film conductor paste for automotive glass |
| WO2006055126A3 (en) * | 2004-11-12 | 2007-11-15 | Ferro Corp | Method of making solar cell contacts |
| AU2005307036B2 (en) * | 2004-11-12 | 2011-10-13 | Heraeus Precious Metals North America Conshohocken Llc | Method of making solar cell contacts |
| US8889041B2 (en) | 2004-11-12 | 2014-11-18 | Heraeus Precious Metals North America Conshohocken Llc | Method of making solar cell contacts |
| US8093491B2 (en) | 2005-06-03 | 2012-01-10 | Ferro Corporation | Lead free solar cell contacts |
| US9105768B2 (en) | 2005-06-03 | 2015-08-11 | Heraeus Precious Metals North America Conshohocken Llc | Lead free solar cell contacts |
| US8236598B2 (en) | 2007-08-31 | 2012-08-07 | Ferro Corporation | Layered contact structure for solar cells |
| CN103177793A (en) * | 2011-12-26 | 2013-06-26 | 浙江昱辉阳光能源有限公司 | Electroconductive slurry for front electrode of solar battery and preparing method of electroconductive slurry |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6253031B2 (en) | 1987-11-09 |
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