JPS588953U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS588953U
JPS588953U JP1981101431U JP10143181U JPS588953U JP S588953 U JPS588953 U JP S588953U JP 1981101431 U JP1981101431 U JP 1981101431U JP 10143181 U JP10143181 U JP 10143181U JP S588953 U JPS588953 U JP S588953U
Authority
JP
Japan
Prior art keywords
recess
semiconductor equipment
external connection
ceramic substrate
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981101431U
Other languages
English (en)
Inventor
岡野　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1981101431U priority Critical patent/JPS588953U/ja
Publication of JPS588953U publication Critical patent/JPS588953U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の半導体装置の断面図、第２図、第３図は
本考案による半導体装置の実施例の断面図、第４図は本
考案の半導体装置を半導体装置実装用基板に実装した様
子を示す断面図である。 １・・・・・・半導体素子、２・・・・・・パッケージ
、３・・・・・・金属細線、４・・・・・・パッケージ
内部電極、５・・・・・・メタライズ配線、６・・・・
・・スルーホール、７・・・・・・外部接続端子、８・
・・・・・リード、９・・・・・・樹脂枠体、１０・・
・・・・半田、１１・・・・・・半導体装置実装用基板
、１２・・・・・・メタライズ配線、１３・・・・・・
保護用樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 中央部に凹部を有し該凹部の周囲に複数個の外部接続端
    子を有するセラミック基板の前記凹部に半導体素子が載
    置され、樹脂枠体で固定された複数の金属箔リードによ
    り前記半導体素子の電極と前記セラミック基板上の外部
    接続端子とが接続されていることを特徴とする半導体装
    置。
JP1981101431U 1981-07-08 1981-07-08 半導体装置 Pending JPS588953U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981101431U JPS588953U (ja) 1981-07-08 1981-07-08 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981101431U JPS588953U (ja) 1981-07-08 1981-07-08 半導体装置

Publications (1)

Publication Number Publication Date
JPS588953U true JPS588953U (ja) 1983-01-20

Family

ID=29896096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981101431U Pending JPS588953U (ja) 1981-07-08 1981-07-08 半導体装置

Country Status (1)

Country Link
JP (1) JPS588953U (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS535596A (en) * 1976-07-05 1978-01-19 Sharp Corp Led display unit
JPS5355965A (en) * 1976-10-29 1978-05-20 Nec Corp Manufacture of semiconductor device
JPS5552687U (ja) * 1978-09-30 1980-04-08

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS535596A (en) * 1976-07-05 1978-01-19 Sharp Corp Led display unit
JPS5355965A (en) * 1976-10-29 1978-05-20 Nec Corp Manufacture of semiconductor device
JPS5552687U (ja) * 1978-09-30 1980-04-08

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