JPS5890738A - Element having multi-layer conductor - Google Patents

Abstract

PURPOSE:To easily realize reproducible continuity between conductors by providing a carbon layer at the contact area of conductor layers in a multi-layer conductor structure. CONSTITUTION:A conductive layer 12 is formed on a insulator substrate or substrate or substrate having insulation film and the first conductive layer consisting of a carbon layer 13 is formed also thereon. Thereafter, the second conductive layer 14 is formed by partly or entirely stacking thereon. The sputter evaporation etc. is used for film formation and the suppter etching etc. is used for manufacturing. Paticularly, after the carbon layer is deposited, the dry etching method is employed. The reactive sputter etching is effective for selective elimination of only the carbon layer. This constitution is particularly effective for the Al system conductor because any oxide is not formed due to existence of the carbon layer and continuity between both conductor layers can be attained easily with excellent reproducibility. When the thickness of carbon layer is selected to several tens of Angstrom to several hundreds of Angstrom , a contact resistance can also be neglected.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is directed to an element having a multilayer conductor, such as a semicircular element having a multilayer structure or a birch air bubble nest.

Achievements As the weight of devices became more common, the technique of forming multilayer conductor arrangements became popular. One of them is the electrical conductivity between the conductors.
b5-One is the charcoal contact part between the four bodies. Although many effective processes have been proposed for the latter, there is no definitive process for mass production of the latter.

Conventionally, conduction between conductors has been achieved by forming a contact hole in the pongee layer covering the F-layer conductor and then etching the narrow surface of the lower layer conductor immediately before depositing the upper layer conductor. -dicIc'pL811) Aluminum conductor used as wiring material - For example, an alumina layer made of full minicum thorny surface [Chemical L-etching using Yorin wrt, etc., or substrate using argon io/ , Tae, Chi/Gumerii is so talented,
removed by ching. However, in these four methods, the sample is exposed to the atmosphere again before the upper layer conductor is attached, so a natural layer + t = 0 is formed on the surface of the lower conductor. n It causes poor contact. As a measure to improve the inflexibility of the first case, after forming the contact hole, we constructed a stratified intermediate layer while maintaining the upper I-4 body. There is a method of heat treatment in the I summer range to spread the C intermediate layer into the lower layer 4 rods and convert it to E*. However, this method still has some disadvantages, such as increasing the number of process steps due to the heat treatment layer, low reproducibility of contact characteristics, and moxibustion of pickled crystals. On the other hand, in the case of a 1A bugle element, -m- heat treatment increases the stress on the conductor and reduces the transfer of magnetic bubbles. There are speculations that it will turn into an octogenarian.

Uninvented 1. JIIJ eliminates these conventional drawbacks and uses a multilayer conductor with excellent contact characteristics between C conductors.

To Seiki-nii in 14 above! A is a cable having a plurality of layers formed on an insulating substrate or a substrate whose surface is covered with an insulating layer, in which at least a portion of the conductor is partially covered with an insulating layer. is an element having a multi-no conductor, which has a full carbon surface.

Hereinafter, an example of the present invention will be explained in detail with reference to Figure 3-).

As shown in Figure 1 /II! A first conductor layer consisting of four bodies 7d112 and a carbon fiber layer 13 covered thereon is formed on a single edge substrate or a transfer plate 11 having a break on the surface, and a Part Matata/The second 4th body so that all the doors are empty
form fir 14k. The formation of the conductor layer JP carbon layer is performed by the quadruple beam evaporation method or the sputter evaporation method, and these processings are performed by the wafer etching method, the ion etching method, etc. In particular, when the carbon layer is formed on the conductor layer, If so, they must be processed by the dry etching method described above. Part or all of the carbon layer
When it is desired to remove the VJ, it is effective to use reactive etching using oxygen as the etching gas.

In this configuration, since the carbon layer exists at the contact point between the conductor layers, conduction between the two can be easily achieved with good reproducibility. this is,
This is because even if the conductor layer is exposed to the atmosphere after forming the conductor layer, it will not oxidize because the conductor layer is coated with a single layer of charcoal that does not easily cause the formation of charcoal. Therefore, this configuration is effective when used for aluminum-based conductors, etc., which tend to form oxides on the surface. The resistivity of carbon is 100 to iooo times as large as that of conductive materials, but the contact resistance can be ignored by selecting the charcoal plate expansion thickness from several lo An element is obtained.

Furthermore, with this configuration, heat treatment for aJI is not required, and the number of process steps can be reduced by 1.1". Although Figure 1 shows an element with a two-layer conductor, , an element having a multilayer conductor of two or more layers can also be realized with a similar configuration.Furthermore, here, a configuration in which the second conductor layer is directly overlaid on the first conductor l- is shown, but as shown in FIG. Even if the second conductor layer is formed on the first conductor via a spacer layer 21 provided with a contact hole as shown in FIG. 1, a young fruit similar to that in the tray shown in FIG.

Next, I'm going to shoot a real joke.

Aluminium, nickel, and charcoal were deposited on a glass substrate using the 4-beam fish 7II method at 3000 A and 1, respectively.
OOA value layered. A positive photon cyst (
A lens 9 pattern was formed using a normal photon cyst-11-m using Silapray AZ1350J), and
Ion-etched with 00VJJρ series of argon ions to fabricate a first body 1- consisting of C@10μrn, tLzalag aluminum and Seiyaku's Nino. Next, after depositing aluminum 6000X@z on the substrate surface, Using the resist pattern mask thus formed, ion etching was performed under the conditions described above to produce a second conductor layer.

Over-etching was carried out for 1 minute, but the carbon layer was approximately 6
Only 0 layers are etched, and the shape of the first conductor layer is maintained. With this configuration in which a carbon layer is provided between conductor layers, contact resistance can be significantly reduced compared to conventional configurations. Furthermore, variations in resistance between conductor layers due to the presence of contact resistance can be ignored.

On the other hand, as another structure, one in which a spacer rak was used between the conductor layers was manufactured. After forming the first conductor layer in the manner described above, 306 OA of silicon dioxide was deposited thereon by plasma vapor deposition. This development was achieved using a gas mixture of silane and suboxide with a ratio of 1 to 15, and a gas pressure of I.
Torr, m circumference awL force and elbow degree 0. 6 Next, contact holes were formed by plasma etching using the resist pattern mask formed thereon under conditions of IW/7. This plasma etching was carried out under the following conditions: the etching gas was a 10:2 mixed gas of Ry 114 and oxygen, -Hx pressure ITorr, and high J4'tIL power 40QW. Thereafter, a second fourth conductor layer 1 having a thickness of 6000 AO was formed in the same manner as the first conductor layer. Even with this 4-component, the same results as in the absence of Bepaca l- were obtained.

As explained above, according to the present invention, an element having a multi-conductor having a 1.4 f) fi property can be produced at an early stage of the process. In the example, aluminum is used as the conductor material, but the same effect can be obtained even if a tube of 1 or 4 tubes is used.

[Brief explanation of the drawing]

Figures 1 and 2 are perspective views of the basic filtration structure of the multi-conductor of the present invention. In the figure, ε is shown, ll is the substrate, 12 is the conductor layer, and 13 is carbon A.
d, 14 is the second conductor no, 21 is the contact hole k
It is a spacer layer with z.

Claims (1)

[Claims] 41! ! On a board whose surface is covered with a wire or with a wire, there is a conductor that matches the electric current of the wire, and at least one of the four rods is connected to one of the surfaces of the board. It is characterized in that part or all of it is equipped with charcoal acWkt.
An element with 4chi and 44 bodies.