JPS5893872A - sputtering equipment - Google Patents

sputtering equipment

Info

Publication number
JPS5893872A
JPS5893872A JP19236081A JP19236081A JPS5893872A JP S5893872 A JPS5893872 A JP S5893872A JP 19236081 A JP19236081 A JP 19236081A JP 19236081 A JP19236081 A JP 19236081A JP S5893872 A JPS5893872 A JP S5893872A
Authority
JP
Japan
Prior art keywords
target
covers
magnetic pole
blocks
magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19236081A
Other languages
Japanese (ja)
Other versions
JPS6127465B2 (en
Inventor
Hidefumi Funaki
船木 秀文
Takehiro Sakurai
桜井 武広
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anelva Corp filed Critical Anelva Corp
Priority to JP19236081A priority Critical patent/JPS5893872A/en
Priority to GB08231830A priority patent/GB2110719B/en
Priority to FR8219696A priority patent/FR2517330B1/en
Priority to DE19823244691 priority patent/DE3244691C3/en
Publication of JPS5893872A publication Critical patent/JPS5893872A/en
Publication of JPS6127465B2 publication Critical patent/JPS6127465B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Magnetic Films (AREA)

Abstract

PURPOSE:To permit higher speed sputtering of ferromagnetic materials by providing covers for magnetic poles of the same material as that of a target on the magnetic pole parts appearing on the front surface of the target and interposing metallic blocks having good heat conductivity between the covers and a base plate in tight contact therewith. CONSTITUTION:An annular magnet 2, a columnar magnet 3 and a target 4 consisting of a ferromagnetic material are mounted on a stainless steel base plate 1 having magnetism. Further, an annular copper block 5, a columnar copper block 6 and a copper block 7 are provided on the plate 1 respectively in tight contact with the magnets 2,3. Covers 8, 9 for magnetic poles of the same or resembling material as or to that of the target 4 are provided respectively on the magnets 2,3 and the blocks 5, 6, 7. The tight contact with the covers 8, 9 and the blocks 5, 6, 7 as well as the blocks 5, 6, 7 and the plate 1 are improved. The plate 1 is made coolable using water. Then the temp. elevation of the covers 8, 9 and the magnets 2, 3 during sputtering is suppressed and the high speed sputtering of the ferromagnetic material is made possible.

Description

【発明の詳細な説明】 本発明はスパッタリング装置、特にターゲットとして2
強磁性体材料を使用する時に適したスパッタリング装置
に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a sputtering apparatus, particularly a sputtering device that uses two sputtering devices as a target.
The present invention relates to a sputtering device suitable for using ferromagnetic materials.

スパッタリング装置は金属あるいは非金属の薄膜を作成
するために広く使われている。これらの装置においては
、スパッタリングの速度を上げ又膜作成の効率を高める
ため、ターゲット前面に該われておシ、その¥〈はター
ゲットの裏面に磁極の対を置き、ターゲットを透して表
面に出る磁界を利用している。
Sputtering equipment is widely used to create thin films of metals or non-metals. In these devices, in order to increase the speed of sputtering and increase the efficiency of film formation, a pair of magnetic poles is placed on the front side of the target, and a pair of magnetic poles is placed on the back side of the target, and a pair of magnetic poles is placed on the back side of the target. It uses the emitted magnetic field.

しかしながらターゲットが強磁性材料の場合には、ター
ゲット裏面の磁極の影響は表面に及び難い。このため強
磁性材料をスパッタリングさせる時の磁場の利用には種
々の工夫が凝らされている。
However, when the target is a ferromagnetic material, the influence of the magnetic pole on the back surface of the target is difficult to reach the front surface. For this reason, various ideas have been devised to utilize magnetic fields when sputtering ferromagnetic materials.

その一つに磁極をターゲット前面に配置する方法がある
。ただしこの場合には磁極面の材料がスパッタリングさ
れる恐れがあるので、それを避けるためターゲットと組
成的に同−又は類似した材料で磁極の部分を覆うことが
行なわれる。
One method is to place magnetic poles in front of the target. However, in this case, there is a risk that the material on the magnetic pole surface will be sputtered, so to avoid this, the magnetic pole portion is covered with a material that is compositionally the same as or similar to the target.

このように磁極を覆ったスパッタリング装置においては
2強磁性体材料のスパッタリングも成る程度速度を上げ
て行なうことができ、しかも磁極自身がスフ9.タリン
グされることを防止することもできる。しかし更にスパ
ッタリング速度を増そうとすると、磁極を覆っている材
料の温度上昇をもたらし、更に磁極の温度まで上昇させ
、特性に悪影響を与えることがあった。
In a sputtering apparatus in which the magnetic pole is covered in this way, sputtering of two ferromagnetic materials can be performed at a high speed, and moreover, the magnetic pole itself can be covered with a thin film. It is also possible to prevent the data from being tarred. However, if the sputtering rate is further increased, the temperature of the material covering the magnetic pole increases, which further increases the temperature of the magnetic pole, which may adversely affect the characteristics.

したがって本発明の目的は、前述のようにターゲット前
面に磁極を配置し且つこの磁極の前面をターゲットと組
成的には同−又は類似の材料で覆っていながら、しかも
この覆った材料および磁極のスバ、タリング中の温度上
昇を抑えることができ、従って強磁性材料の更に高速な
ス・フッタリングの可能な装置を提供するーことにある
。
Therefore, an object of the present invention is to arrange a magnetic pole in front of a target as described above, cover the front surface of this magnetic pole with a material that is compositionally the same as or similar to that of the target, and furthermore, it is possible to dispose a magnetic pole on the front surface of a target and to cover the same or similar material to the target. The object of the present invention is to provide an apparatus capable of suppressing the temperature rise during futtering, and thus capable of faster futtering of ferromagnetic materials.

このため本発明の装置はその一部が次のような構成にな
っている。すなわち、ターゲット前面の磁極を囲みある
いは磁極に沿って、熱伝導性に優れそして少なくとも強
磁性体ではない金属のブロックを配置し、このブロック
の上面とブロックと並ぶ磁極の双方を覆うようにターゲ
ット材料と同一か又は類似した組成の磁極覆いをつける
。そして金属ブロックは磁極覆いとターf、)表面又は
ターグツFを保持する基台の金属部との両者に密着して
いることが重要でおる。
Therefore, a part of the apparatus of the present invention has the following configuration. That is, a metal block with excellent thermal conductivity and at least a non-ferromagnetic material is placed surrounding or along the magnetic pole in front of the target, and the target material is placed so as to cover both the top surface of this block and the magnetic pole that is aligned with the block. Attach a magnetic pole cover of the same or similar composition. It is important that the metal block is in close contact with both the magnetic pole cover and the metal part of the surface or base that holds the targ.

次に図面を参照して詳細に説明する。Next, a detailed explanation will be given with reference to the drawings.

第1図は本発明の一実施例の構成の断面を示した図であ
る。第1図において、磁性を持つ不銹鋼から成る基台1
には、外周に近く環状磁石2.中央部に柱状磁石3.パ
ーマロイから成るターゲット4などが取付けられている
。更にこの基台1には環状磁石2の内側に沿って環状の
銅ブロック5゜同磁石2の外側には、柱状の銅ブロック
6が磁石2に接して数ケ所に分散配置されている。又中
央の柱状磁石3を囲んで銅ブロック7がある。
FIG. 1 is a cross-sectional view of the configuration of an embodiment of the present invention. In Fig. 1, a base 1 made of magnetic stainless steel
There is a ring magnet near the outer periphery 2. Pillar magnet in the center 3. A target 4 made of permalloy is attached. Further, on this base 1, an annular copper block 5 is disposed along the inside of the annular magnet 2, and columnar copper blocks 6 are disposed at several locations on the outside of the annular magnet 2 in contact with the magnet 2. Further, there is a copper block 7 surrounding the central columnar magnet 3.

磁石2の磁極面および銅ブロック5,6の上面を纒めて
環状の覆い8がかけられている。この覆い8はターゲッ
ト4と同じ材料で作られている。
An annular cover 8 is placed around the magnetic pole surface of the magnet 2 and the top surfaces of the copper blocks 5 and 6. This cover 8 is made of the same material as the target 4.

又中央の磁石3の磁極面およびこれを囲む鋼ブロック7
に対しても、同じ材質の磁極覆い9がかけられている。
Also, the magnetic pole face of the central magnet 3 and the steel block 7 surrounding it
A magnetic pole cover 9 made of the same material is also applied to the magnetic pole cover 9 .

これらを構成する際に重要なことは。What is important when configuring these?

磁極覆い8,9と銅ブロック5,6の密着および銅ブロ
ックと基台1の密着をよくして熱伝導を悪くしないよう
に組立てることである。これは環状磁石2,3の高さを
銅ブロック5,6の高さよシそれぞれ若干低くしておけ
ば、基台が相当の磁性を持っているところから、覆い8
,9と基台1が磁石2,3を介して強く引き合うことに
よシ容易に実現できる。なお磁石はターゲット前面にタ
ーデッドと平行な磁界を作ることが目的であるから。
The purpose of assembly is to improve the close contact between the magnetic pole covers 8, 9 and the copper blocks 5, 6, and the close contact between the copper block and the base 1, so as not to impair heat conduction. This can be done by making the heights of the annular magnets 2 and 3 slightly lower than the heights of the copper blocks 5 and 6, since the base has considerable magnetism.
, 9 and the base 1 are strongly attracted to each other via the magnets 2 and 3, whereby this can be easily realized. The purpose of the magnet is to create a magnetic field parallel to the tarde in front of the target.

当然磁石2と磁石3とでは磁化の方向は反対である。ま
た基台1は水によシ冷却できる。
Naturally, the magnetization directions of magnet 2 and magnet 3 are opposite. Furthermore, the base 1 can be cooled by water.

第1図に示された例では、磁極覆い8,9の冷却も充分
にでき、磁石2,3についても特性に影響を与えるよう
な温度上昇は観測されなかった。
In the example shown in FIG. 1, the magnetic pole covers 8 and 9 were sufficiently cooled, and no temperature rise that would affect the characteristics of the magnets 2 and 3 was observed.

第2図は本発明の他の実施例の構成の断面を示した図で
ある。第2図において、ターゲット14は冷却機構を付
けた基台11に埋め込まれており基台11の他の部分に
は環状の磁石12.この磁石12の内外両面にそれぞれ
沿って密着して置かれている環状の銅ブロック15と1
5′沖央部の磁石13.その磁石を囲んでいる銅ブロッ
ク17などが取り付けられている。これらの磁極面およ
び銅ブロックを覆うターゲットと同材質の磁極覆い18
と19は前に述べた実施例とほぼ同じである。
FIG. 2 is a cross-sectional view of the structure of another embodiment of the present invention. In FIG. 2, the target 14 is embedded in a base 11 equipped with a cooling mechanism, and the other part of the base 11 is equipped with an annular magnet 12. Annular copper blocks 15 and 1 are placed in close contact along the inner and outer surfaces of the magnet 12, respectively.
5' Central offshore magnet 13. A copper block 17 surrounding the magnet is attached. A magnetic pole cover 18 made of the same material as the target covers these magnetic pole faces and the copper block.
and 19 are almost the same as in the previous embodiment.

この実施例もすぐれた冷却効果があシ、このためス・母
ツタリングの速度を上げることが容易でありた。
This example also had an excellent cooling effect, and therefore it was easy to increase the speed of suction and stumbling.

第3図は本発明の更に他の実施例の構成の断面を示す図
である。第3図においてターゲット24は冷却機構をつ
けた基台(第2図の1相当)を構成しており、その他の
部分は第2図の実施例と同様である。この実施例ではタ
ーゲット24が基台となるため構造が簡単となると共に
すぐれた冷却効果があシ、このためスノfツタリング速
度をより大きく上げることが容易であった。
FIG. 3 is a cross-sectional view of a configuration of still another embodiment of the present invention. In FIG. 3, the target 24 constitutes a base (corresponding to 1 in FIG. 2) equipped with a cooling mechanism, and other parts are the same as in the embodiment shown in FIG. In this embodiment, the target 24 serves as a base, which simplifies the structure and provides an excellent cooling effect, making it easy to greatly increase the snorting speed.

以上の諸実施例からも明らかなように9本発明において
は、磁極を覆う金属板に発生する熱を銅ブロックを通じ
て速かに基台の冷却機構に導いている。従って、実施例
の説明において説明したように、磁極覆いの金属板と銅
ブロックあるいは銅ブロックと基台部分は密着した面接
触であって。
As is clear from the above embodiments, in the present invention, the heat generated in the metal plate covering the magnetic pole is quickly guided to the cooling mechanism of the base through the copper block. Therefore, as explained in the description of the embodiment, the metal plate of the magnetic pole cover and the copper block or the copper block and the base portion are in close surface contact.

熱伝導に対する抵抗が非常に小さい。Very low resistance to heat conduction.

なお前述の実施例ではブロックの材料としていずれも銅
を使用したが、熱伝導にすぐれた金属であれば銅に限ら
ず使用することができる。例えばアルミニウムなどはよ
い結果を与えるし、他の金属であってもよい。又ブロッ
クおよびブロックを取付けている部分の形状についても
多くの変形も可能であるが、熱伝導のよい金属のブロッ
クを通じてターダウト前面に配置された磁極を覆う金属
板に発生する熱を、冷却部へ運び出す機構を付けたスパ
ッタリング装置は、すべて本発明の範囲に含まれること
は明らかである。
In the above-described embodiments, copper was used as the material for the blocks, but any metal with excellent thermal conductivity can be used instead of copper. For example, aluminum gives good results, but other metals may also be used. Although many variations are possible in the shape of the block and the part to which it is attached, the heat generated in the metal plate that covers the magnetic pole placed in front of the tardoubt is transferred to the cooling section through the metal block with good heat conduction. It is clear that all sputtering apparatuses with delivery mechanisms are within the scope of the present invention.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図および第3図はいずれも本発明の の実施例の構成メ断面を示す図である。 記号の説明:1は基台、2は環状磁石、3は柱状磁石、
4はターゲット、 5 、5’ 、 6 、7は銅プロ
、り、8,9は磁極覆い、14.24はターゲットをそ
れぞれあられしている。 第1図 第2図 9P!J3図
1, 2, and 3 are all cross-sectional views showing the construction of an embodiment of the present invention. Explanation of symbols: 1 is the base, 2 is the ring magnet, 3 is the columnar magnet,
4 is a target, 5, 5', 6, and 7 are copper plates, 8 and 9 are magnetic pole covers, and 14.24 is a target. Figure 1 Figure 2 Figure 9P! J3 diagram

Claims (1)

【特許請求の範囲】 1、 ターゲットに近接して少なくとも1対の磁極が設
けられ、該磁極の少なくとも一部は該ターゲットの前面
に設置され、該磁極の前記ターゲットの前面に現われた
部分に該ターゲットの材料と同質若しくは類似した材料
の磁極覆いが設けられ。 かつこの磁極覆いと前記磁極に近接したターグツト若し
くはこのターゲットを載せる基台との間に。 熱伝導性の良い金属のブロックを密着介在させて成るこ
とを特徴とするスパッタリング装置。
[Claims] 1. At least one pair of magnetic poles is provided near the target, at least a part of the magnetic poles is installed in front of the target, and a portion of the magnetic poles appearing in front of the target A magnetic pole cover made of the same or similar material to the target material is provided. and between this magnetic pole cover and a target near the magnetic pole or a base on which the target is placed. A sputtering device characterized by closely interposing metal blocks with good thermal conductivity.
JP19236081A 1981-11-30 1981-11-30 sputtering equipment Granted JPS5893872A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP19236081A JPS5893872A (en) 1981-11-30 1981-11-30 sputtering equipment
GB08231830A GB2110719B (en) 1981-11-30 1982-11-08 Sputtering apparatus
FR8219696A FR2517330B1 (en) 1981-11-30 1982-11-24 APPARATUS FOR PROJECTING METAL ONTO A SUBSTRATE, PARTICULARLY OF THE MAGNETRON TYPE
DE19823244691 DE3244691C3 (en) 1981-11-30 1982-11-30 Magnetron sputtering system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19236081A JPS5893872A (en) 1981-11-30 1981-11-30 sputtering equipment

Publications (2)

Publication Number Publication Date
JPS5893872A true JPS5893872A (en) 1983-06-03
JPS6127465B2 JPS6127465B2 (en) 1986-06-25

Family

ID=16289978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19236081A Granted JPS5893872A (en) 1981-11-30 1981-11-30 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS5893872A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138070A (en) * 1983-12-05 1985-07-22 ライボルト・アクチェンゲゼルシャフト Magnetron cathode for sputtering ferromagnetic target
JPS6274074A (en) * 1985-09-27 1987-04-04 Shimadzu Corp Target assembly for sputters

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06311690A (en) * 1993-04-19 1994-11-04 Toyo Electric Mfg Co Ltd Rotating electric machine housing cooling device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57158381A (en) * 1981-03-27 1982-09-30 Nippon Sheet Glass Co Ltd Magnetron sputtering device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57158381A (en) * 1981-03-27 1982-09-30 Nippon Sheet Glass Co Ltd Magnetron sputtering device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60138070A (en) * 1983-12-05 1985-07-22 ライボルト・アクチェンゲゼルシャフト Magnetron cathode for sputtering ferromagnetic target
JPS6274074A (en) * 1985-09-27 1987-04-04 Shimadzu Corp Target assembly for sputters

Also Published As

Publication number Publication date
JPS6127465B2 (en) 1986-06-25

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