JPS5897855U - 発光ダイオ−ドランプ - Google Patents
発光ダイオ−ドランプInfo
- Publication number
- JPS5897855U JPS5897855U JP1981195878U JP19587881U JPS5897855U JP S5897855 U JPS5897855 U JP S5897855U JP 1981195878 U JP1981195878 U JP 1981195878U JP 19587881 U JP19587881 U JP 19587881U JP S5897855 U JPS5897855 U JP S5897855U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light
- diode lamp
- light emitting
- color
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
図面はこの考案の実施例を示す正面図である。
１・・・・・・発光ダイオード、２・・曲直列抵抗、３
・・・・・・透光性樹脂、４・・・・・・口金、５・・
・・・・絶縁ベース、６・・・・・・接触子。
・・・・・・透光性樹脂、４・・・・・・口金、５・・
・・・・絶縁ベース、６・・・・・・接触子。
Claims (1)
- 発光ダイオード素子を透光性樹脂でモールドして外形を
小形電球と同一形状にし・た発光ダイオードランプにお
いて、口金と接触子間を絶縁する絶□縁ベースを発光ダ
イオードの表示色に着色して発・光色を表示するように
したことを特徴とする発光ダイオードランプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981195878U JPS5897855U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981195878U JPS5897855U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5897855U true JPS5897855U (ja) | 1983-07-02 |
Family
ID=30109136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981195878U Pending JPS5897855U (ja) | 1981-12-24 | 1981-12-24 | 発光ダイオ−ドランプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5897855U (ja) |
-
1981
- 1981-12-24 JP JP1981195878U patent/JPS5897855U/ja active Pending
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