JPS5910237A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To enable the easy opening of positioning reference holes in a substrate for positioning by a simple structure without deteriorating the mutual precision in positions of a pellet and the reference holes, by providing the positioning reference holes in accordance with reference points on the pellet. CONSTITUTION:A metal plate 6 may be provided with reference holes 6a and 6b precisely beforehand prior to the bonding and fixing thereof onto a ceramic substrate 5, or it may be provided with these holes after it is bonded and fixed onto the substrate. In the case when the reference holes 6a and 6b are provided in the metal plate 6 beforehand, the plate is fitted on the substrate so that the reference holes 6a and 6b are matched precisely with two fixed points 5c and 5d on x'-y' coordinates determined by a pattern constituting a solid-state image pick-up element, or a part thereof, on a pellet 4. In the case when the reference holes 6a and 6b are made in the metal plate 6 after it is fitted on the substrate, on the other hand, holes are provided precisely at the two points 5c and 5d on the x'-y' coordinates determined by the pattern constituting the solid-state image pick-up element, or a part thereof, on the pellet 4, so as for these holes to be the reference holes 6a and 6b, after the metal plate 6 is bonded and fixed on the back surface of the ceramic substrate 5.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a package structure of a semiconductor device, particularly a semiconductor device having a light-transmitting lid as a light entrance window on the front surface.
In particular, the present invention relates to a semiconductor device in which a package of a photosensor such as a solid-state image sensor is provided with a gold maple plate for positioning, and a reference hole is provided in the gold maple plate, and a method for manufacturing the same.

Generally, when a solid-state imaging device, which is a semiconductor device that has a light-transmitting lid as a light entrance window, is mounted on a television camera, the optical axis center of the lens system and the solid-state imaging device housed and fixed in the solid-state imaging device are aligned. In order to do this, it is recommended that the package of the solid-state imaging device be provided with a reference hole for positioning. This reference hole is provided within a certain accuracy with respect to the pellet center of the solid-state imaging device, and this accuracy is particularly strict for color solid-state imaging cables, and an accuracy within ±0.1 mm is usually required. There is.

For this reason, in conventional packages, the usual method is to have a Kovar plate as an integrated part with reference holes provided in advance, and to attach the pellets after adjusting the pellet position with respect to the reference holes. .

Conventionally, in color solid-state imaging devices, pellet attachment is performed using two reference holes as a reference, and the reference holes are ±0.
．． Although a mutual positional accuracy of 1 hole was required, it is difficult to achieve this accuracy with the current ceramic processing accuracy, so a Kovar plate and a bottom plate are used to form a package having a reference hole.

In this case, the Kovar plate was selected to match the coefficient of thermal expansion with the ceramic during ceramic sintering and during the heating process in the packaging process.

Figure 1 shows an example of a solid-state imaging device that has been proposed in the past, and Figure 1 (a) is a plan view of the package;
Figure (b) is a sectional view taken along line Ib-Ib'.

In the figure, a plurality of ceramic frames each having case mounting holes of different shapes at both ends are IRML,
A Kovar plate 3 is adhesively fixed to the bottom surface of the ceramic substrate 1, which is formed in a manner similar to that of the ceramic substrate 1.The Kovar plate 3 has positioning reference holes 2a and 2b, each having a different hole diameter, provided with high precision in accordance with the above-mentioned perforations. Then, on this Kovar plate 3, the pellet 4 is mounted with high precision by aligning the four corners 4a + 4by 4c + 46 with the four fixed points 3a H3b r 3c 13d on the x-ym standard determined by the reference holes 2a + 2b. Fixed.

However, in the solid-state imaging device having the above configuration, the reference holes 2a e 2b are set in advance with sieve accuracy as described above.
After adhesively fixing the Kovar plate 3 provided with the above to the bottom surface of the ceramic substrate 1 and adjusting the mounting and fixing position of the pellet 4 with respect to this reference hole 2a + 2b, in order to adhesively fix the pellet 4, There are disadvantages in that a highly accurate positioning device is required, and that the package manufactured integrally with the Kovar plate 3 is expensive.

Therefore, the present invention has been made in view of the above-mentioned drawbacks of the conventional art, and its purpose is to provide a simple structure, and moreover, to easily align the positioning reference hole without reducing the mutual positional accuracy between the pellet and the reference hole. An object of the present invention is to provide a semiconductor device that allows perforation and a method for manufacturing the same.

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2(a), (1)) l (0) is a plan view of a main part of a solid-state imaging device for explaining an example of a semiconductor device and a method for manufacturing the same according to the present invention, a cross-sectional view of the solid-state imaging device, and a cross-sectional view of the solid-state imaging device; nc IIc' cross-sectional view. In the figure, a ceramic frame body and a ceramic plate having case mounting holes of different shapes at both ends are laminated and fixed to form a ceramic substrate 5 having through holes 5a+5b for case mounting at both ends. Pellets 4 are adhesively arranged on the bottom of the ceramic substrate 5. Moreover, on the back side of this ceramic substrate 5, there are shown (1)) and (C
), a metal plate 6 for forming positioning reference holes is narrowly adhesively fixed in the direction in which the through holes 5a+5b are arranged. In this case, before the metal plate 6 is adhesively fixed to the ceramic substrate 5, the reference holes 6a+6b are formed in advance with high precision.
may be provided, or reference holes 6a+6b may be bored after bonding. Moreover, in this case, the reference hole 6a is formed in the metal plate 6 in advance.

When providing the reference holes 6b, the reference holes 6a are provided at two fixed points 5c and 5d on the x'-y' coordinates determined by the pattern constituting the solid-state image sensor on the pellet 4 or a part thereof.

Attach so that 6b matches accurately. In addition, in the case where the reference holes 6 a r 6 b are processed after the metal plate 6 is attached, the solid-state imaging device of the pellet 4 is formed after the metal plate 6 is adhesively fixed to the back surface of the ceramic substrate 5. Determined by a pattern or a part of it! 2 on '-7' coordinates
Points 5c and 5d are drilled with high precision to form reference holes 6at6b.

With this configuration, the conventional expensive Kovar bottom plate on the back surface of the ceramic substrate 5 can be removed as unnecessary, so the package structure can be simplified and the package can be made inexpensive. Further, since the reference hole is provided with the pellet as a reference, the degree of adhesion of the pellet 4 can be relaxed, the adhesion of the pellet 4 is facilitated, and accidents such as damage to the pellet 4 can be prevented. Furthermore, in this package structure, if a reference hole for positioning is not required, it can be used without attaching a metal plate for positioning, etc., and there is no need to prepare packages with a plurality of structures. Furthermore, according to such a manufacturing method, a highly accurate positioning device is required because the bellet 4 is conventionally mounted in alignment with the reference holes 2a+2b (see FIG. 1).
Furthermore, during this work, there were defects such as foreign matter adhering to the surface of the pellet 4, resulting in defects, but after attaching the pellet 4 and the transparent lid, the reference holes 6a + 6b were made using the pellet 4 as a reference. Since we are installing the parts that have
The positioning device does not directly handle the pellet 4, there is no problem of foreign matter adhering to the pellet 4, and the device can be simplified.

In the above embodiment, the metal plate 6 for the positioning reference hole is not limited to a metal material, and is not particularly limited to any material as long as it can form the reference holes 6a+6b with good accuracy. Moreover, the ceramic substrate 5 of the metal plate 2
For installation, other than adhesive, mechanical caulking etc.
The same effect can be obtained even if electrically performed by means such as spot welding.

As explained above, according to the present invention, a simple and inexpensive packaging structure can be obtained, and the positioning reference hole can be obtained extremely easily and with high precision, which is an extremely excellent effect.

[Brief explanation of drawings]

Figure 1 (a), (1)) is a plan view of essential parts showing an example of a conventional solid-state imaging device, its Ib-I'b' sectional view, and the second
Figure (a). (b) , (((ri) is a plan view of essential parts showing an example of application to a solid-state imaging device for explaining a semiconductor device and a manufacturing method thereof according to the present invention, and a 1lb-IIb' cross-sectional view thereof,
It is Ilc-Il,c' sectional view. 4 fists...Bellet, 5...Ceramic board, 5a
+5b...Through hole, 6...Metal plate, 6a+6b
...Reference hole. Figure 1 20 3 zb Figure 2 zo

Claims (1)

[Claims] 1. A semiconductor device comprising: a package in which pellets are adhesively disposed; a light-transmitting lid adhesively disposed on an open end of the package; and a translucent lid adhesively disposed on the back surface of the package. . 2. The semiconductor device according to claim 1, wherein the positioning substrate is a rectangular metal plate extending in the direction in which the reference holes are arranged. 3. A step of gluing a pellet inside the package; a step of gluing a positioning substrate to the back of the package;
A method for manufacturing a semiconductor device, comprising the step of drilling a positioning reference hole in the positioning substrate using the pellet reference.